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Semiconductor Packaging Engineer Jobs (NOW HIRING)

INTEL

Packaging Module Development Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...

Marvell

Principal Package Engineer

Santa Clara, CA

Your Team, Your Impact The package engineering team drives semiconductor package development from ... the semiconductor packaging field OR Master's degree and/or PhD in ME and Material science or ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$115K - $219K/yr

The Packaging Module Development Engineer will contribute to advancing technology and foundry ... Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor ...

Apple

IC Packaging Integration Engineer

Austin, TX

$181K - $318K/yr

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • ... We are looking for someone experienced in the semiconductor packaging and/or system integration.

Skyworks

Principal Packaging Engineer

Irvine, CA · On-site

$129K - $247K/yr

Principal Packaging Engineer Posting Start Date: 3/23/26 Job Location(s): San Jose If you are ... Minimum 12 years experience (or MS and 8 years) in semiconductor packaging technology * Strong ...

Apple

IC Packaging Integration Engineer

Austin, TX

$181K - $318K/yr

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • ... We are looking for someone experienced in the semiconductor packaging and/or system integration.

INTEL

Packaging Module Development Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... The Packaging Module Development Engineer will contribute to advancing technology and foundry ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

Develop, qualify, and optimize semiconductor packaging equipment and processes to meet quality ... Support standardization of qualification processes, quality systems, and engineering methodologies ...

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Semiconductor Packaging Engineer information

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How much do semiconductor packaging engineer jobs pay per hour?

As of Jun 12, 2026, the average hourly pay for semiconductor packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are the key skills and qualifications needed to thrive as a Semiconductor Packaging Engineer, and why are they important?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What does a Semiconductor Packaging Engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are some common challenges Semiconductor Packaging Engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.
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Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in the United States as of June 2026, with employment types broken down into 86% Full Time, 4% Part Time, 9% Contract, and 1% Nights. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.
Packaging Module Development Engineer

Packaging Module Development Engineer

INTEL

Phoenix, AZ • On-site

$127K - $179K/yr

Full-time

Medical, Retirement, PTO

This job post has expired 1 day ago. Applications are no longer accepted.

Intel rating

8.8

Company rating: 8.8 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

8th of 139 rated electronics manufacturers

Job description

Job Description

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.


As a Packaging Module Development Engineer, you will:


• Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
• Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
• Manage projects to ensure alignment with product development schedules and execution milestones.
• Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
• Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
• Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
The ideal candidate should demonstrate:


• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.

Qualifications

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:


• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.


• Experience listed above should be a combination of the following:

Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
Preferred Qualifications:


One or more years of experience in one or more of the following areas:
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Delivery of results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technologies.
• Prior related work experience within a semiconductor foundry.

Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experienceWorking ModelThis role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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