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Semiconductor Packaging Engineer Jobs (NOW HIRING)

Altera

Senior Package Reliability Engineer

San Jose, CA

$166K - $240K/yr

Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or a related technical field with 8+ years of experience in semiconductor package thermal and thermomechanical ...

New

Qualcomm

Packaging Engineer, Sr.

San Diego, CA · On-site

... Semiconductor Assembly and Test (OSAT) providers. Experience with Wafer-on-Wafer bonding is ... Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127K - $179K/yr

... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...

Skyworks

Principal Packaging Engineer

Irvine, CA · On-site

$129K - $247K/yr

Principal Packaging Engineer Posting Start Date: 3/23/26 Job Location(s): San Jose If you are ... Minimum 12 years experience (or MS and 8 years) in semiconductor packaging technology * Strong ...

Apple

IC Packaging Integration Engineer

Austin, TX

$184K - $324K/yr

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • ... We are looking for someone experienced in the semiconductor packaging and/or system integration.

Apple

IC Packaging Integration Engineer

Austin, TX

$184K - $324K/yr

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • ... We are looking for someone experienced in the semiconductor packaging and/or system integration.

Skyworks

Sr. Packaging Engineer

Irvine, CA · On-site

$91K - $177K/yr

Sr. Packaging Engineer Posting Start Date: 6/22/26 Job Location(s): Irvine If you are looking for a ... Relevant technical experience in semiconductor packaging technology. * Technical expertise required ...

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Semiconductor Packaging Engineer information

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How much do semiconductor packaging engineer jobs pay per hour?

As of Jul 19, 2026, the average hourly pay for semiconductor packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are the key skills and qualifications needed to thrive as a Semiconductor Packaging Engineer, and why are they important?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What does a Semiconductor Packaging Engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are some common challenges Semiconductor Packaging Engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.
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Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in the United States as of July 2026, with employment types broken down into 95% Full Time, 2% Part Time, and 3% Contract. Highlights an 87% Physical, 4% Hybrid, and 9% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.
Senior Package Reliability Engineer

Senior Package Reliability Engineer

Altera

San Jose, CA

$166K - $240K/yr

Full-time

Posted 2 days ago

Job description

Job Details:Job Description:

About Altera

At Altera, our independence as the world's largest pureplay FPGA solutions provider gives us the focus, speed, and agility to innovate without compromise. With more than four decades of industryleading FPGA expertise, our singular mission is to deliver the programmable technologies that help customers differentiate, innovate, and scale across rapidly evolving markets like AI, cloud, networking, and edge. As an independent company, we move faster, invest deeper, and partner more closely-empowering our teams to drive breakthrough innovation and shape the future of the FPGA industry.

About the Role

We are seeking an experienced semiconductor Package Reliability Engineer responsible for characterizing and qualifying advanced 2.5D/3D semiconductor packages. This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical characterization for advanced packaging technologies.

Key Responsibilities

  • Partner with package development and assembly teams for packaging materials (substrate, and assembly materials) selection to meet product thermomechanical reliability requirements

  • Develop and maintain advanced semiconductor package thermal and thermomechanical finite element models using commercial software (e.g., Ansys, Abaqus)

  • Define, execute and interpret package coplanarity, warpage, and second level reliability data collection strategies to calibrate the thermal and thermomechanical FEM models

  • Lead package reliability evaluations to validate package robustness as defined by industry standards such as JEDEC, MIL-STD, IPC, and AEC using test-chips and products

  • Understand FPGA use conditions and develop customer reports, communications related to package thermal and thermomechanical concerns.

  • Perform reliability lifetime prediction modeling from stress test/field data

  • Develop and own package DFMEA/FMEA's partnering with development and manufacturing teams

Salary Range

The pay range below is for Bay Area California only. Actual salary may vary based ona number offactors including job location, job-related knowledge, skills, experiences,trainings, etc. We also offer incentive opportunities that reward employees based on individual and company performance.

$166,900 - $240,000USD

We use artificial intelligence to screen, assess, or select applicants for the position. Applicants must be eligible for any required U.S. export authorizations.

#LI-MD1

Qualifications:

Minimum Qualifications

  • Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or a related technical field with 8+ years of experience in semiconductor package thermal and thermomechanical analysis

  • 8+ years of experience using thermal and thermomechanical simulation tools (e.g., Ansys, Abaqus, COMSOL, or equivalent) to develop and analyze warpage, coplanarity, stress, and deformation models for advanced semiconductor packages.

  • 8+ years of experience developing, analyzing, and validating advanced semiconductor packaging technologies, including 2.5D, 3D, and heterogeneous integration packages, with a strong understanding of package reliability.

  • 3+ years of experience applying reliability statistics, failure analysis methodologies, and lifetime modeling techniques to semiconductor packaging and product reliability assessments.

  • 3+ years of experience developing scripts or software using Python for automation, simulation workflows, data analysis, and post-processing.

Preferred Qualifications

  • Deep understanding of thermal, mechanical and thermomechanical characteristics of advanced 2.5D/3D flip-chip packages

  • Ability to correlate between thermomechanical simulations and package dynamic warpage and package behavior in surface mount system level assembly

  • Develop customer facing collaterals for packaging risk assessments

Job Type: RegularShift:Shift 1 (United States of America)Primary Location:San Jose, California, United StatesAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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