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Semiconductor Packaging Engineer Jobs in Texas (NOW HIRING)

Apple

IC Packaging Integration Engineer

Austin, TX · On-site

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • ... We are looking for someone experienced in the semiconductor packaging and/or system integration.

Apple Inc.

IC Packaging Integration Engineer

Austin, TX · On-site

$120 - $150/hr

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description ... We are looking for someone experienced in the semiconductor packaging and/or system integration.

Diodes Incorporated

Be Seen First

Senior Director of Packaging Technology

Plano, TX · On-site

MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field. * 15+ years of direct experience in semiconductor packaging or advanced ...

Apple

IC Packaging Integration Engineer

Austin, TX

$184K - $324K/yr

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • ... We are looking for someone experienced in the semiconductor packaging and/or system integration.

Apple

IC Packaging Integration Engineer

Austin, TX

$184K - $324K/yr

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • ... We are looking for someone experienced in the semiconductor packaging and/or system integration.

Apple

Packaging Assembly Engineer

Austin, TX · On-site

S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field is desired. 5+ years of extensive experience in Semiconductor Packaging ...

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Semiconductor Packaging Engineer information

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$18

$39

$62

How much do semiconductor packaging engineer jobs pay per hour?

As of Aug 7, 2026, the average hourly pay for semiconductor packaging engineer in Texas is $39.47, according to ZipRecruiter salary data. Most workers in this role earn between $30.48 and $45.91 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are the key skills and qualifications needed to thrive as a semiconductor packaging engineer?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What does a semiconductor packaging engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are some common challenges semiconductor packaging engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.
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Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in Texas as of July 2026, with employment types broken down into 95% Full Time, 2% Part Time, and 3% Contract. Highlights an 88% Physical, 4% Hybrid, and 8% Remote job distribution, with an average salary of $82,097 per year, or $39.5 per hour.

High Voltage Semiconductor Packaging Engineer - Onsite

Genesis10

Dallas, TX • On-site

Other

Medical, Dental, Vision, Life, Retirement

Re-posted 11 days ago

Job description

Genesis10 is currently seeking a High Voltage Semiconductor Packaging Engineer for an Onsite position with a Leading Semiconductor Company located in Plano, TX. This is a direct hire opportunity.
As a member of the Packaging team, you will have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth within the team and across the organization. This role focuses on defining, designing, and developing high-voltage and high-power packages and modules for the Industrial, Automotive, Renewable, and Telecom markets, scaling them from concept to high-volume production.
Responsibilities:
  • Define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets
  • Understand market trends and end equipment system requirements and build these into competitive forward-looking package and module roadmaps
  • Define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools
  • Develop new process flows/technologies necessary to create first article prototypes and also scale to high volume manufacturing
  • Outline package reliability plans, complete testing, summarize failure modes and provide solutions to address issues
  • Utilize a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process/equipment integration
  • Work with various suppliers to provide solutions to meet roadmaps
  • Work collaboratively across worldwide cross-functional teams and accelerate development cycles to ensure a rapid time-to-market for new products

Requirements:
  • Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering or related engineering degree
  • 8 years of experience and proven track record of innovation in High Voltage (200V-3300V must) and high power (5KW 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies
  • Hands-on high voltage package and power module design, materials, equipment, and assembly flow integration (molded packages like TOLT, TOLG, Q-DPAK DIP, SIP and case modules)
  • Strong knowledge of Silicon / GaN / SiC-package interaction and hands-on experience with stress, thermal and electrical modeling analysis and tools

Desired skills:
  • Excellent communication skills and ability to work with internal and external customers to define and develop roadmaps
  • Prior experience scaling HV packages and modules from concept to high volume manufacturing
  • Good understanding of clip attach, flip chip packaging and overview of wafer bumping processes
  • Knowledge of magnetics and high power density enterprise power modules (6V 48V) is a plus
  • Strong knowledge of HV Bill of Materials (Mold compounds, Die Attach, DBC substrates, etc.)
  • Good understanding of industry & subcon HV packaging capabilities & roadmaps
  • Overview of high voltage discrete and power modules reliability and qualification requirements, with the ability to define and drive reliability and qualification strategies
  • Track record of presenting at international conferences or symposiums related to power electronics, semiconductor packaging, or high-voltage technologies

If you have the described qualifications and are interested in this exciting opportunity, please apply!
Ranked a Top Staffing Firm in the U.S. by Staffing Industry Analysts for six consecutive years, Genesis10 puts thousands of consultants and employees to work across the United States every year in contract, contract-for-hire, and permanent placement roles. With more than 300 active clients, Genesis10 provides access to many of the Fortune 100 firms and a variety of mid-market organizations across the full spectrum of industry verticals.
For contract roles, Genesis10 offers the benefits listed below. If this is a perm-placement opportunity, our recruiter can talk you through the unique benefits offered for that particular client. Benefits of Working with Genesis10:
  • Access to hundreds of clients, most who have been working with Genesis10 for 5-20 years.
  • The opportunity to have a career-home in Genesis10; many of our consultants have been working exclusively with Genesis10 for years.
  • Access to an experienced, caring recruiting team (more than 7 years of experience, on average.)
  • Behavioral Health Platform
  • Medical, Dental, Vision
  • Health Savings Account
  • Voluntary Hospital Indemnity (Critical Illness & Accident)
  • Voluntary Term Life Insurance
  • 401K
  • Sick Pay (for applicable states/municipalities)
  • Commuter Benefits (Dallas, NYC, SF, and Illinois)

For multiple years running, Genesis10 has been recognized as a Top Staffing Firm in the U.S., as a Best Company for Work-Life Balance, as a Best Company for Career Growth, for Diversity, and for Leadership, amongst others. To learn more and to view all our available career opportunities, please visit us at our website.
Genesis10 is an Equal Opportunity Employer. Candidates will receive consideration without regard to their race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.
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About Genesis10

Sourced by ZipRecruiter

For multiple years running, Genesis10 has been recognized as a Top Staffing Firm in the U.S., as a Best Company for Work-Life Balance, as a Best Company for Career Growth, for Diversity, and for Leadership, amongst others. To learn more and to view all our available career opportunities, please visit us at our website.

Industry

It services

Company size

1,001 - 5,000 Employees

Headquarters location

New York, NY, US

Year founded

1999

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