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Semiconductor Packaging Engineer Jobs in Texas (NOW HIRING)

Senior Process Engineer - Advanced Packaging & Manufacturing Austin, Texas | On-site Opportunity ... Hands-on experience with semiconductor packaging, wafer processing, advanced assembly, precision ...

Senior Process Engineer

Austin, TX ยท On-site

$140K - $180K/yr

Senior Process Engineer - Advanced Packaging & Manufacturing Austin, Texas | On-site Opportunity ... Hands-on experience with semiconductor packaging, wafer processing, advanced assembly, precision ...

IC Package Design Engineer

Austin, TX ยท On-site

$134K/yr

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... and integration of advanced semiconductor packages across SoC, memory, RF, and cellular ...

IC Package Design Engineer

Austin, TX ยท On-site

$90 - $130/hr

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... and integration of advanced semiconductor packages across SoC, memory, RF, and cellular ...

Semiconductor Device Engineer

Austin, TX ยท On-site

$110 - $180/hr

About the role As a Device Engineer at fab2, you'll play a critical role in bridging process ... Our total compensation package also includes generous equity in fab2. Benefits * Medical, Dental ...

Semiconductor Device Engineer

Austin, TX ยท On-site

$110 - $180/hr

About the role As a Device Engineer at fab2, you'll play a critical role in bridging process ... Our total compensation package also includes generous equity in fab2. Benefits * Medical, Dental ...

Showing results 41-60

Semiconductor Packaging Engineer information

See Texas salary details

$18

$39

$62

How much do semiconductor packaging engineer jobs pay per hour?

As of Aug 22, 2026, the average hourly pay for semiconductor packaging engineer in Texas is $39.47, according to ZipRecruiter salary data. Most workers in this role earn between $30.48 and $45.91 per hour, depending on experience, location, and employer.

What does a semiconductor packaging engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are the key skills and qualifications needed to thrive as a semiconductor packaging engineer?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What are some common challenges semiconductor packaging engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What cities in Texas are hiring for Semiconductor Packaging Engineer jobs?

Cities in Texas with the most Semiconductor Packaging Engineer job openings:

Infographic showing various Semiconductor Packaging Engineer job openings in Texas as of August 2026, with employment types broken down into 94% Full Time, 3% Part Time, and 3% Contract. Highlights an 85% Physical, 6% Hybrid, and 9% Remote job distribution, with an average salary of $82,097 per year, or $39.5 per hour.

Silicon Photonics Process Development Engineer (on-site)

Prosum Inc.

San Antonio, TX โ€ข On-site

Other

Re-posted 14 days ago


Job description

Job Description
Silicon Photonics Process Development EngineerSalary Range: $120k to $160kPosition Summary
We are seeking a Silicon Photonics Process Development Engineer to develop advanced semiconductor process modules and manufacturing capabilities supporting next-generation silicon photonics technologies. This role will lead process development from research and development through prototype builds and initial production while collaborating with cross-functional engineering teams, manufacturing partners, and technology suppliers to deliver innovative, production-ready solutions.
The ideal candidate has a strong background in semiconductor process development, silicon photonics, and process integration, with experience driving technology from concept through manufacturing.
Key Responsibilities
  • Develop and optimize semiconductor process modules for silicon photonics technologies.
  • Drive process development activities from prototype through production qualification and release.
  • Collaborate with cross-functional engineering, fabrication, and manufacturing teams to implement new process technologies.
  • Develop advanced packaging, 3D heterogeneous integration (3D-HI), and electro-optical process solutions.
  • Perform process qualification, technology characterization, reliability testing, and yield improvement initiatives.
  • Design and evaluate test structures and mask layouts to support research, development, and product qualification activities.
  • Utilize simulation and modeling tools to support process optimization and technology development.
  • Support foundry process development and manufacturing readiness initiatives.
  • Collaborate with internal stakeholders and external partners to evaluate new technologies and manufacturing capabilities.
  • Provide technical support during process transfers, manufacturing ramp-up, and production readiness activities.
  • Travel occasionally to support manufacturing, supplier, and technology development activities.
Required Qualifications
  • Bachelor's degree in Materials Science, Electrical Engineering, Physics, or a related engineering discipline.
  • Minimum of 5 years of semiconductor process development experience.
  • Strong understanding of semiconductor fabrication, process integration, and manufacturing technologies.
  • Experience working in high-volume semiconductor manufacturing environments.
  • Hands-on experience developing silicon photonics technologies.
  • Knowledge of advanced packaging, 3D heterogeneous integration (3D-HI), and electro-optical device manufacturing.
  • Experience with process qualification, reliability testing, yield improvement, and test structure development.
  • Proficiency with GDS layout tools, including Cadence Virtuoso.
  • Strong project management, analytical, problem-solving, and communication skills.
  • Ability to work effectively in a fast-paced, collaborative engineering environment.
Preferred Qualifications
  • M.S. or Ph.D. in Materials Science, Electrical Engineering, Physics, or a related engineering discipline.
  • Experience with semiconductor packaging technologies and advanced process integration.
  • Experience supporting foundry technology development and manufacturing enablement.
  • Familiarity with technology transfer from R&D into production.
What You'll Bring
  • A passion for developing next-generation semiconductor and silicon photonics technologies.
  • Strong technical aptitude with the ability to solve complex process engineering challenges.
  • Excellent collaboration and communication skills when working with multidisciplinary engineering teams.
  • A continuous improvement mindset focused on process optimization, manufacturing readiness, and product quality.

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