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Silicon Package Design Engineer Jobs (NOW HIRING)

Renesas Electronics

Package Design Engineer

Austin, TX · On-site +1

$134K/yr

... a talented Package Design Engineer to join our Advanced Silicon Packaging team to design and ... In this role, you will be at the intersection of silicon design and system implementation. You will ...

Intel

Silicon Packaging Design Engineer

Hillsboro, OR

$148K/yr

Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving ... package performance, and delivering high-impact solutions that meet performance, cost, and ...

Intel

Silicon Packaging Design Engineer

Phoenix, AZ

$135K/yr

Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving ... package performance, and delivering high-impact solutions that meet performance, cost, and ...

Apple

IC Package Design Engineer

Austin, TX

$171K - $302K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... wide range of silicon technologies You are expected to leverage AI tools to enhance design ...

Apple

IC Package Design Engineer

Austin, TX

$171K - $302K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... wide range of silicon technologies You are expected to leverage AI tools to enhance design ...

Apple

IC Package Design Engineer

Los Angeles, CA

$120K - $210K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... wide range of silicon technologies You are expected to leverage AI tools to enhance design ...

Apple

IC Package Design Engineer

Austin, TX

$171K - $302K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... wide range of silicon technologies You are expected to leverage AI tools to enhance design ...

Apple

IC Package Design Engineer

Los Angeles, CA

$120K - $210K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... wide range of silicon technologies You are expected to leverage AI tools to enhance design ...

Apple

IC Package Design Engineer

Austin, TX · On-site

$134K/yr

As a Package design engineer, you will lead advanced package architecture, drive next-generation ... wide range of silicon technologies You are expected to leverage AI tools to enhance design ...

Apple

IC Package Design Engineer

Los Angeles, CA · On-site

$146K/yr

As a Package design engineer, you will lead advanced package architecture, drive next-generation ... wide range of silicon technologies You are expected to leverage AI tools to enhance design ...

Apple

IC Package Design Engineer

Los Angeles, CA

$120K - $210K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... wide range of silicon technologies You are expected to leverage AI tools to enhance design ...

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Silicon Package Design Engineer information

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$90K

$136.5K

How much do silicon package design engineer jobs pay per year?

As of Jun 8, 2026, the average yearly pay for silicon package design engineer in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

What is the difference between Silicon Package Design Engineer vs PCB Design Engineer?

AspectSilicon Package Design EngineerPCB Design Engineer
CredentialsBachelor's or Master's in Electrical Engineering, VLSI, or related fieldsBachelor's or Master's in Electrical Engineering, Electronics, or related fields
Work EnvironmentSemiconductor fabrication labs, design houses, R&D centersElectronics manufacturing, design firms, product development teams
Industry UsageSemiconductor industry, integrated circuit designConsumer electronics, industrial equipment, communication devices
Primary FocusDesigning silicon chip packages, ensuring electrical and thermal performanceDesigning printed circuit boards for electronic products

The Silicon Package Design Engineer focuses on creating and optimizing the packaging of silicon chips, ensuring electrical connectivity and thermal management. In contrast, the PCB Design Engineer specializes in designing printed circuit boards that connect various electronic components. While both roles require electrical engineering knowledge, their work environments and end products differ significantly.

What types of cross-functional teams do Silicon Package Design Engineers typically collaborate with, and how does this affect daily workflow?

Silicon Package Design Engineers often work closely with electrical engineers, mechanical engineers, manufacturing teams, and product managers to ensure package designs meet performance, reliability, and manufacturability standards. This collaborative environment means that daily tasks often involve design reviews, resolving integration challenges, and coordinating updates based on feedback from various disciplines. Effective communication and teamwork are essential, as design changes in one area can significantly impact other aspects of the product. This cross-functional dynamic offers valuable insight into the entire product development lifecycle and fosters broad technical growth.

What does a Silicon Package Design Engineer do?

A Silicon Package Design Engineer is responsible for designing the physical packaging that houses silicon chips, ensuring optimal electrical performance, thermal management, and mechanical integrity. They collaborate with cross-functional teams to develop package layouts, select materials, and address challenges related to signal integrity, power distribution, and manufacturability. Their work is crucial for protecting the silicon die and enabling reliable integration into electronic devices. This role often involves using specialized design software and working closely with fabrication and testing teams to deliver high-quality, cost-effective packaging solutions.

What are the key skills and qualifications needed to thrive as a Silicon Package Design Engineer, and why are they important?

To thrive as a Silicon Package Design Engineer, you need a solid background in electrical or materials engineering, semiconductor packaging principles, and experience with design for manufacturability. Proficiency in industry-standard EDA tools such as Cadence, Mentor Graphics, or Ansys, along with familiarity with simulation and layout software, is typically required. Strong problem-solving skills, attention to detail, and effective communication are critical for collaborating with multidisciplinary teams and resolving design challenges. These skills and qualifications are essential for delivering reliable, high-performance semiconductor packages that meet stringent industry standards.
More about Silicon Package Design Engineer jobs
What job categories do people searching Silicon Package Design Engineer jobs look for? The top searched job categories for Silicon Package Design Engineer jobs are:
Silicon Package Design Engineer jobs near you

Staff Package Design Engineer

Renesas Electronics

Tempe, AZ • On-site

Full-time

Posted 3 days ago

Job description

Company Description
Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, Renesas is expanding its advanced packaging capabilities and seeking a talented Staff Package Design Engineer to join our Advanced Silicon Packaging team. In this role, you will design and deliver next-generation, high-performance package solutions that support our world-class product portfolio across automotive, industrial, infrastructure, and IoT applications.
Job Description
In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. You will play a critical role in designing and delivering next-generation, high-performance semiconductor package solutions, including power modules, chiplet-based architectures, FCBGA, SiP, WLCSP, wire-bonded, QFP, and QFN packages supporting automotive SoCs, industrial IoT microcontrollers, and AI-enabled embedded computing platforms. This role requires strong technical depth in package layout execution, manufacturability, assembly process constraints, and cross-domain co-design with global silicon design, signal integrity/power integrity, thermal, reliability, and product engineering teams.
Key Responsibilities
  • Execute package layout design and development for advanced package technologies, including power modules, FCBGA, SiP, WLCSP, and multi-chip modules.
  • Develop and maintain package CAD databases, ensuring accuracy and adherence to package design guidelines, DFM, and DFA requirements to support manufacturability, yield, and long-term reliability.
  • Manage the package design cycle, including schematic creation, netlist import, footprint assignment, layout implementation, verification, and generation of manufacturing release outputs such as Gerber/drill data, fabrication drawings, assembly drawings, bump maps, and related documentation.
  • Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and power/ground distribution features.
  • Collaborate with SI/PI, thermal, reliability, DFT, silicon design, product engineering, and manufacturing teams to support package-level co-optimization and participate in design reviews.
  • Ensure package designs comply with applicable foundry, OSAT, substrate vendor, and manufacturing design rules, including DRC, LVS, connectivity, and netlist verification requirements.
  • Support Engineering Change Order cycles, design updates, revision control, and release documentation throughout the project lifecycle.

Qualifications
  • 4+ years of hands-on experience in package CAD layout, substrate design, or advanced package development; 6+ years preferred.
  • Strong background in power module packaging, FCBGA, SiP, WLCSP, advanced substrate-based packages, and multi-die/chiplet-based package architectures.
  • High proficiency with industry-standard package design tools such as Cadence Allegro Package Designer / SiP Layout, Siemens Xpedition Substrate Integrator, or equivalent CAD platforms.
  • Proven experience applying advanced package design rules, substrate vendor constraints, OSAT assembly requirements, DFM/DFA principles, and manufacturing release standards.
  • Experience interfacing directly with Tier-1 OSATs, substrate suppliers, foundries, silicon design teams, and product engineering teams.
  • Working understanding of SI/PI fundamentals, high-speed routing, impedance control, power/ground distribution, and crosstalk mitigation.
  • Strong communication, presentation, and technical documentation skills, with demonstrated experience working effectively in global, cross-functional engineering environments.

Education
  • Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.

Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose 'To Make Our Lives Easier.' As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, 'To Make Our Lives Easier.'
At Renesas, you can:
  • Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
  • Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people's lives easier, safe and secure.
  • Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.

Are you ready to own your success and make your mark?
Join Renesas. Shape Your Future with Us.
Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
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