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Silicon Package Design Engineer Jobs (NOW HIRING)

Package Design Engineer

San Jose, CA · On-site

$141K - $226K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

Fort Collins, CO · On-site

$141K - $226K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

Boise, ID · On-site

$129K/yr

... Engineering, or a related field. Position also requires: 1. Semiconductor-to-Package Codesign Coordination and Management. 2. Feasibility Studies and Design Assessment. 3. Package Technology ...

Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces ... Engineering, or a related field. * 5+ years of experience in ASIC package design, with deep ...

Micross is seeking a Semiconductor Package Design Engineer to work in our Apopka, Florida or Raleigh, North Carolina facility . Essential Duties and Responsibilities: * The primarily responsible for ...

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Silicon Package Design Engineer information

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$90K

$136.5K

How much do silicon package design engineer jobs pay per year?

As of Jun 8, 2026, the average yearly pay for silicon package design engineer in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

What is the difference between Silicon Package Design Engineer vs PCB Design Engineer?

AspectSilicon Package Design EngineerPCB Design Engineer
CredentialsBachelor's or Master's in Electrical Engineering, VLSI, or related fieldsBachelor's or Master's in Electrical Engineering, Electronics, or related fields
Work EnvironmentSemiconductor fabrication labs, design houses, R&D centersElectronics manufacturing, design firms, product development teams
Industry UsageSemiconductor industry, integrated circuit designConsumer electronics, industrial equipment, communication devices
Primary FocusDesigning silicon chip packages, ensuring electrical and thermal performanceDesigning printed circuit boards for electronic products

The Silicon Package Design Engineer focuses on creating and optimizing the packaging of silicon chips, ensuring electrical connectivity and thermal management. In contrast, the PCB Design Engineer specializes in designing printed circuit boards that connect various electronic components. While both roles require electrical engineering knowledge, their work environments and end products differ significantly.

What types of cross-functional teams do Silicon Package Design Engineers typically collaborate with, and how does this affect daily workflow?

Silicon Package Design Engineers often work closely with electrical engineers, mechanical engineers, manufacturing teams, and product managers to ensure package designs meet performance, reliability, and manufacturability standards. This collaborative environment means that daily tasks often involve design reviews, resolving integration challenges, and coordinating updates based on feedback from various disciplines. Effective communication and teamwork are essential, as design changes in one area can significantly impact other aspects of the product. This cross-functional dynamic offers valuable insight into the entire product development lifecycle and fosters broad technical growth.

What does a Silicon Package Design Engineer do?

A Silicon Package Design Engineer is responsible for designing the physical packaging that houses silicon chips, ensuring optimal electrical performance, thermal management, and mechanical integrity. They collaborate with cross-functional teams to develop package layouts, select materials, and address challenges related to signal integrity, power distribution, and manufacturability. Their work is crucial for protecting the silicon die and enabling reliable integration into electronic devices. This role often involves using specialized design software and working closely with fabrication and testing teams to deliver high-quality, cost-effective packaging solutions.

What are the key skills and qualifications needed to thrive as a Silicon Package Design Engineer, and why are they important?

To thrive as a Silicon Package Design Engineer, you need a solid background in electrical or materials engineering, semiconductor packaging principles, and experience with design for manufacturability. Proficiency in industry-standard EDA tools such as Cadence, Mentor Graphics, or Ansys, along with familiarity with simulation and layout software, is typically required. Strong problem-solving skills, attention to detail, and effective communication are critical for collaborating with multidisciplinary teams and resolving design challenges. These skills and qualifications are essential for delivering reliable, high-performance semiconductor packages that meet stringent industry standards.
More about Silicon Package Design Engineer jobs
Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging

Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging

Amazon

Austin, TX • On-site

$134K/yr

Full-time

Posted 14 days ago


Amazon rating

7.4

Company rating: 7.4 out of 10

Based on 6,823 frontline employees who took The Breakroom Quiz

7th of 39 rated national retailers


Job description

Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago-even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.
We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.
Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.


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About Amazon

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Amazon.com, Inc., commonly known as Amazon, is an American multinational technology company. It was founded by Jeff Bezos in 1994 and initially started as an online marketplace for books. Since then, Amazon has expanded its operations and become one of the largest e-commerce companies in the world. Amazon's primary business is its online retail platform, where customers can purchase a vast array of products, including electronics, clothing, books, home goods, and much more. The company offers a convenient and user-friendly shopping experience, with features such as fast shipping, customer reviews, and personalized recommendations. In addition to its e-commerce platform, Amazon has diversified its business into various other areas. One of its notable ventures is Amazon Web Services (AWS), a comprehensive cloud computing platform that provides services such as storage, compute power, and database management to individuals and businesses. AWS has become a leader in the cloud computing industry, powering many websites and applications worldwide. Amazon has also developed its own consumer electronics, including the popular Amazon Kindle e-reader, Fire tablets, Fire TV streaming devices, and the Alexa-powered Echo smart speakers. The Alexa voice assistant, integrated into these devices, allows users to interact with their devices using voice commands, perform tasks, and access information. Furthermore, Amazon has expanded into media and entertainment. It operates Prime Video, a streaming service that offers a wide range of movies, TV shows, and original content. Amazon Music provides a platform for streaming and purchasing digital music, while Audible offers audiobooks and other audio content. The company's commitment to customer satisfaction and convenience is demonstrated by its membership program, Amazon Prime. Prime members receive various benefits, including free two-day shipping, access to streaming services, exclusive deals, and more.

Industry

It services, book publishers, retail, real estate and computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Seattle, WA, US