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Silicon Package Design Engineer Jobs (NOW HIRING)

IC Package Design Engineer

Austin, TX · On-site

$134K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... wide range of silicon technologies You are expected to leverage AI tools to enhance design ...

Description As a Package design engineer, you will lead advanced package architecture, drive next ... wide range of silicon technologies You are expected to leverage AI tools to enhance design ...

Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose, CA. In ...

IC Package Design Engineer

Los Angeles, CA · On-site

$146K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... wide range of silicon technologies You are expected to leverage AI tools to enhance design ...

As a Senior Package Design Engineer, you will lead co-design activities that bridge silicon design, package architecture, and product development for advanced DRAM and memory products targeting ...

Overview Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose ...

Overview Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose ...

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation ... silicon, PCB, and system integration teams. The successful candidate will also contribute to ...

Package Design Engineer

Chandler, AZ · On-site

$133K/yr

Scope all aspects of package design feasibility at Silicon interposer and substrate level for multi-chip SiP packaging. * Support pre/post silicon bring up, yield improvement activities ...

Package Design Engineer

Santa Clara, CA · On-site

$159K/yr

Scope all aspects of package design feasibility at Silicon interposer and substrate level for multi-chip SiP packaging. * Support pre/post silicon bring up, yield improvement activities ...

OR · On-site

$200K - $280K/yr

Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces ... Engineering, or a related field. * 10+ years of experience in ASIC package design, with deep ...

Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces ... Engineering, or a related field. * 5+ years of experience in ASIC package design, with deep ...

New

OR · On-site

$180K - $260K/yr

Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces ... Engineering, or a related field. * 5+ years of experience in ASIC package design, with deep ...

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Silicon Package Design Engineer information

See salary details

$90K

$136.5K

How much do silicon package design engineer jobs pay per year?

As of Jul 3, 2026, the average yearly pay for silicon package design engineer in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

What is the difference between Silicon Package Design Engineer vs PCB Design Engineer?

AspectSilicon Package Design EngineerPCB Design Engineer
CredentialsBachelor's or Master's in Electrical Engineering, VLSI, or related fieldsBachelor's or Master's in Electrical Engineering, Electronics, or related fields
Work EnvironmentSemiconductor fabrication labs, design houses, R&D centersElectronics manufacturing, design firms, product development teams
Industry UsageSemiconductor industry, integrated circuit designConsumer electronics, industrial equipment, communication devices
Primary FocusDesigning silicon chip packages, ensuring electrical and thermal performanceDesigning printed circuit boards for electronic products

The Silicon Package Design Engineer focuses on creating and optimizing the packaging of silicon chips, ensuring electrical connectivity and thermal management. In contrast, the PCB Design Engineer specializes in designing printed circuit boards that connect various electronic components. While both roles require electrical engineering knowledge, their work environments and end products differ significantly.

What types of cross-functional teams do Silicon Package Design Engineers typically collaborate with, and how does this affect daily workflow?

Silicon Package Design Engineers often work closely with electrical engineers, mechanical engineers, manufacturing teams, and product managers to ensure package designs meet performance, reliability, and manufacturability standards. This collaborative environment means that daily tasks often involve design reviews, resolving integration challenges, and coordinating updates based on feedback from various disciplines. Effective communication and teamwork are essential, as design changes in one area can significantly impact other aspects of the product. This cross-functional dynamic offers valuable insight into the entire product development lifecycle and fosters broad technical growth.

What does a Silicon Package Design Engineer do?

A Silicon Package Design Engineer is responsible for designing the physical packaging that houses silicon chips, ensuring optimal electrical performance, thermal management, and mechanical integrity. They collaborate with cross-functional teams to develop package layouts, select materials, and address challenges related to signal integrity, power distribution, and manufacturability. Their work is crucial for protecting the silicon die and enabling reliable integration into electronic devices. This role often involves using specialized design software and working closely with fabrication and testing teams to deliver high-quality, cost-effective packaging solutions.

What is the salary of silicon Design Engineer?

The salary of a Silicon Package Design Engineer typically ranges from $80,000 to $150,000 annually, depending on experience, location, and company size. Entry-level positions may start lower, while experienced engineers with specialized skills in IC packaging and CAD tools can earn higher salaries.

How much does a silicon packaging Design Engineer make at Intel?

A silicon packaging design engineer at Intel typically earns between $80,000 and $130,000 annually, depending on experience, education, and location. Salaries may also include bonuses and stock options, with roles often requiring knowledge of CAD tools and industry standards.

What engineer makes $500,000 a year?

Silicon Package Design Engineers typically do not earn $500,000 annually; such high salaries are more common among executive roles or senior engineers with extensive experience, specialized skills, and leadership responsibilities. Compensation at this level often includes bonuses, stock options, or profit sharing, especially in high-tech companies or startups.

What engineers make $300,000 a year?

Senior Silicon Package Design Engineers with extensive experience, advanced skills in IC packaging, and proficiency in tools like CAD and simulation software can earn $300,000 or more annually. High compensation is often associated with roles in leading tech companies, specialized expertise, and sometimes managerial responsibilities.

What are the key skills and qualifications needed to thrive as a Silicon Package Design Engineer, and why are they important?

To thrive as a Silicon Package Design Engineer, you need a solid background in electrical or materials engineering, semiconductor packaging principles, and experience with design for manufacturability. Proficiency in industry-standard EDA tools such as Cadence, Mentor Graphics, or Ansys, along with familiarity with simulation and layout software, is typically required. Strong problem-solving skills, attention to detail, and effective communication are critical for collaborating with multidisciplinary teams and resolving design challenges. These skills and qualifications are essential for delivering reliable, high-performance semiconductor packages that meet stringent industry standards.
More about Silicon Package Design Engineer jobs
What job categories do people searching Silicon Package Design Engineer jobs look for? The top searched job categories for Silicon Package Design Engineer jobs are:
Infographic showing various Silicon Package Design Engineer job openings in the United States as of June 2026, with employment types broken down into 94% Full Time, and 6% Part Time. Highlights an 88% Physical, 5% Hybrid, and 7% Remote job distribution, with an average salary of $135,040 per year, or $64.9 per hour.
IC Package Design Engineer

IC Package Design Engineer

Apple

Austin, TX • On-site

$134K/yr

Full-time

Posted 28 days ago


Apple rating

8.1

Company rating: 8.1 out of 10

Based on 666 frontline employees who took The Breakroom Quiz

5th of 30 rated technology retailers


Job description

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple's internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We're looking for a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. You will play a key role in shaping the architecture, scalability, and efficiency of next-generation products while advancing design methodologies through automation and AI.
Description
As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical design from concept through tape-out. You will collaborate closely with cross-functional teams to deliver optimized SI/PI performance across a wide range of silicon technologies You are expected to leverage AI tools to enhance design efficiency, quality and performance.
Minimum Qualifications
BS and 10+ years of relevant industry experience
Preferred Qualifications
Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms, with knowledge of diverse package types (SiP, PoP, wirebond) and verification tools (Calibre, CAM350).
High-Speed & SI/PI Expertise: Strong understanding of high-speed interface layout constraints (DDR, PCIe) and Signal/Power Integrity (SI/PI) analysis, including experience with simulation tools like HFSS or PowerSI and parasitic extraction (RLGC, S-parameters).
Manufacturing & Materials Knowledge: Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and various sophisticated package configurations and assembly technology
Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.

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About Apple

Sourced by ZipRecruiter

Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Cupertino, CA, US

Year founded

1976