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Semiconductor Packaging Engineer Jobs in Massachusetts

Velaura

Principal Packaging Engineer

Boston, MA · On-site

$200 - $500/hr

Role Overview We are looking for a Principal Packaging Engineer to own package architecture and ... The ideal candidate has deep experience with advanced semiconductor packaging, package-level signal ...

Teradyne

Sr. Packaging Engineer

North Reading, MA · On-site

$175 - $281/hr

Opportunity Overview Teradyne is seeking a Package Design Engineer with signal and power integrity experience to support advanced measurement ASIC products within the Semiconductor Test Division.

New

Conductor

Packaging Engineer- Flip Chip

Boston, MA · On-site

$110 - $170/hr

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump ...

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Semiconductor Packaging Engineer information

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How much do semiconductor packaging engineer jobs pay per hour?

As of Aug 25, 2026, the average hourly pay for semiconductor packaging engineer in Massachusetts is $46.27, according to ZipRecruiter salary data. Most workers in this role earn between $35.72 and $53.80 per hour, depending on experience, location, and employer.

What does a semiconductor packaging engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are the key skills and qualifications needed to thrive as a semiconductor packaging engineer?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What are some common challenges semiconductor packaging engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are popular job titles related to Semiconductor Packaging Engineer jobs in Massachusetts?

For Semiconductor Packaging Engineer jobs in Massachusetts, the most frequently searched job titles are:

What job categories do people searching Semiconductor Packaging Engineer jobs in Massachusetts look for?

The top searched job categories for Semiconductor Packaging Engineer jobs in Massachusetts are:

Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in Massachusetts as of August 2026, with employment types broken down into 87% Full Time, 7% Part Time, 1% Temporary, 4% Contract, and 1% Nights. Highlights an 85% Physical, 5% Hybrid, and 10% Remote job distribution, with an average salary of $96,238 per year, or $46.3 per hour.

Semiconductor Packaging Engineer

Analog Devices

Wilmington, MA • On-site

Full-time

Medical, Dental, Vision, Retirement, PTO

Posted 21 days ago

Analog Devices rating

8.7

Company rating: 8.7 out of 10

Based on 18 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.
Senior Systems Semiconductor Packaging Engineer
About the Role
As a Senior Systems Semiconductor Packaging Engineer, you will lead the development of advanced semiconductor packaging solutions for MEMS sensors used in automotive, industrial, medical, aerospace, and defense applications. You will work across the product lifecycle, from concept through manufacturing readiness, helping translate product and customer requirements into robust, scalable packaging solutions.
This role calls for strong technical judgment, cross-functional collaboration, and hands-on problem solving. You will partner closely with teams across applications, quality, reliability, manufacturing, and external vendors to improve package performance, manufacturability, and time to market.
Key Responsibilities
  • Packaging Development: - Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness
  • Manufacturability and Reliability: - Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving
  • Root Cause and Yield Improvement: - Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions
  • Engineering Analysis: - Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance
  • Process and Quality Methods: - Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes
  • Customer Requirements Translation: - Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams
  • OSAT Collaboration: - Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
  • Vendor and Assembly Readiness: - Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints
  • Cross-Functional Leadership: - Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases

Required Skills
  • Semiconductor Packaging Expertise: - Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
  • Materials Knowledge: - Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
  • Design for Reliability: - Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
  • Simulation and Analysis Tools: - Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
  • Structured Problem Solving: - Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
  • Cross-Functional Collaboration: - Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
  • Technical Communication: - Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders

Preferred Education and Experience
  • Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field
  • 5+ years of relevant experience in semiconductor packaging, process development, or manufacturing engineering
  • Experience supporting MEMS, sensor, or advanced package development is a plus
  • Experience working with OSAT partners and external manufacturing vendors is preferred

We recognize that candidates may not meet every listed requirement. If you bring relevant experience and a willingness to learn, we encourage you to apply.
#LI-PG1
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position - except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
EEO is the Law: Notice of Applicant Rights Under the Law.
Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $110,385 to $151,808.
  • Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
  • This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
  • This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

What Analog Devices employees say

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Hours and flexibility

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About Analog Devices

Sourced by ZipRecruiter

Analog Devices (NASDAQ: ADI) designs and manufactures semiconductor products and solutions. We enable our customers to interpret the world around us by intelligently bridging the physical and digital worlds with unmatched technologies that sense, measure and connect.

Industry

Electrical equipment, appliance, and component manufacturing

Company size

5,001 - 10,000 Employees

Headquarters location

Norwood, MA, US

Year founded

1965

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