Manufacturing Engineering Technician

VCS is looking for Manufacturing Engineering Technician at Yorktown Heights, New York for one of our client.

Earn Gift Cards up to $250 every Month. Attendance/Performance Appreciation: Up to $250/Month as Gift Cards (Non-Taxable)

Second Shift: 4:00 PM to 12:00 AM EST (Monday to Friday)
Location: Yorktown Heights, NY (Onsite )
Only US Citizen
Pay Rate: $29 - $31/hour
Weekly Hours: 40 Hours/week
Overtime: Overtime is not anticipated as a manner of course, but resource(s) should be prepared to support reasonable overtime requests on a periodic basis. (4 hrs. / week)

Start Date: ASAP
End Date: Long term contract

Background:
The Packaging/Microfabrication lab provides a dynamic environment and has the mission of providing innovative solutions to leading edge projects within the Research Division, as well. The team is also engaged with several government projects.
The successful candidate will interact with and contribute to technical teams covering a wide spectrum of exciting and innovative research and semiconductor technology projects.
Currently the Packaging/Microfabrication Team is working with teams in nanotechnology, advanced semiconductor packaging, biosensors, quantum computing and advanced wafer testing.
This engineer will be a part of a technical team executing semiconductor-like processing to create parts for many of these projects as needed.
Semiconductor processing such as lithography, physical vapor deposition, wet chemical cleaning, dicing, bonding, and metrology, all in a clean room environment, as well as other thin film techniques are important skills for the positions available.
Excellent sample handling practices and dexterity are an absolute must because we often deal with small, delicate parts and our tooling is very manual and flexible (not typically automated).
Applicants for this position must be highly motivated, excellent problem solvers, innovative and possess strong team skills with the ability to work effectively in a diverse environment.

Job Duties:
Process wafers and/or other substrates through plating, lithography (coat, expose, develop), wet and dry etch, clean, thin film vacuum deposition, packaging, etc.
Identify, communicate, and solve problems, organize projects and workflow.
Accurately document and summarize data and process steps, as specified.
Work closely with Engineers, Scientists, and Inventors from many different disciplines.
Must be able to work independently as well as be a good team player.
Have a working knowledge of Microsoft Office.

Basic Skills, clearances and other elements required, in order of importance, and number of years' experience, where applicable, in each skill:
US Citizenship is required, green card not sufficient (dual citizenship must be disclosed).
Hands on processing experience in semiconductor-like processing steps.
Must have good dexterity and be able to handle small sensitive parts.
Must be capable of learning to operate new tools and learning new chemical processing steps.
Must be observant and based on technical knowledge, identify sources of variability and/or yield impact.
Must be very flexible to learn new tasks as the workload is varied.
Must have good interpersonal skills with ability to work with Engineers, Scientists, and Inventors from many different disciplines.
Must be able to work independently as well as be a good team player.

Thank You