Electronic Assembler

Manual Wire Bonder

Our client is a 40-year-old leading provider of electronic manufacturing services(EMS), design engineering and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets. They are looking for Manual Wire Bonder Level I for their Chatsworth location. In this role, you will be responsible for the operation of manual wire bond equipment in a clean room environment.

Job Location: Chatsworth, CA
Hourly Pay: $18.00 - 20.00/hr (DOE)
Salary Pay: $37,500 - $41,600
Company benefits: Comprehensive benefit package.

Responsibilities:

• Read and interpret assembly instructions, drawings and work instruction processes.
• Written tests for ESD + wire-bond and ribbon bond requirements.
• Use tools such as fine-tipped tweezers, dental probes, x-acto knives.
• Perform pin bonds between substrate and case pins.
• Use pf periodic machines certification for bond strengths.
• Inspect and know the difference between an acceptable epoxy placement, die attach assembly, sub attached assembly and wire bond and ribbon bonds on a hybrid in conformance with prints, drawings and or Mil std.
• Inspect - to the drawings/specs and procedures – the devices for defects before starting the assembly and after finishing his/her part of the assembly.
• Adhere to all ESD and other handling requirements.
• Comply with all in-house training as identified in job-specific family and or specific training plan.
• Follow company 6S and continuous improvement (kaizen) objectives.
• Perform all other duties, as assigned.

Requirements:

• High School Diploma /GED or equivalent experience
• Valid Permanent Resident or Citizen of the United States of America
• 0-2 years related Experience
• Perform general physical activities.
• Monitor processes, materials and surroundings.
• Ability to operate Plasma Cleaners, Auto wirebond, Ribbon bond and Bond Pull machines used for microelectronics - Orthodyne 20B, MEI-1204W - Aluminum Wedge bonder, K&S 4124, 4213, Hybond 522A – Manual Ball wire Bonder, Hybond 572A- Manual Ribbon Bonder, Unitek UB2-1-191-02, Palomar MCW550 – Gap Welder and Dage 4000, Dage 2200, Unitek MicroPull III & IV bond pull machines or Equivalent.
• Minimum 2 years of working experience as a manual wire bonder/manual ribbon bonder in a microelectronic assembly factory.
• Familiar with MIL-PRF-38534 requirements for microelectronics assembly.
• Ability to work in a class 100,000 (class 8) clean room environment using clean room antistatic gowns, facemasks, hair covers etc.
• Ability to work with a 30X microscope throughout the day.
• Ability to work in a manufacturing area with normal factory noise levels.
• Ability to work on a team and be a good team member.
• Ability to access documents using a computer
• Should not have a problem in using chemical-based cleaning systems for cleaning build substrates etc.
• Sense of urgency, successful at meeting deadlines.
• Mechanical aptitude/dexterity and the ability to lift up to 20 lbs
• Fluency in English Language- Reading, written & spoken

Company benefits:

• Medical, dental and vision coverage
• Company-paid basic life/AD&D insurance, short-term and long-term disability insurance
• Voluntary supplemental insurance, flexible spending accounts and employee assistance program (EAP)
• Sick Leave, Vacation Time, and company-paid Holidays are also provided as paid time off.
• The company provides a 401(k) Retirement Savings Plan option with a company match

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