As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly ...

67 Intel Packaging Design Engineer Jobs Hiring Near You
As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly ...
Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology ...
Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology ...
As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly ...
As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly ...
Primary Function of Position The Medical Device Packaging Design Engineer is a critical engineering role responsible for the design, development, verification, and launch of next-generation ...
Primary Function of Position The Medical Device Packaging Design Engineer is a critical engineering role responsible for the design, development, verification, and launch of next-generation ...
Primary Function of Position The Medical Device Packaging Design Engineer is a critical engineering role responsible for the design, development, verification, and launch of next-generation ...
Primary Function of Position The Medical Device Packaging Design Engineer is a critical engineering role responsible for the design, development, verification, and launch of next-generation ...
Packaging Design Engineer, Platforms Infrastructure Engineering
Sunnyvale, CA · On-site
$159 - $230/hr
... packaging and logistics services providers. * Experience with TOPS, CAPE, and FEA simulation tools. About the job: As a Product Design Engineer, you will design and evaluate our data center systems ...
Packaging Design Engineer, Platforms Infrastructure Engineering
Sunnyvale, CA · On-site
$159 - $230/hr
... packaging and logistics services providers. * Experience with TOPS, CAPE, and FEA simulation tools. About the job: As a Product Design Engineer, you will design and evaluate our data center systems ...
Primary Function of Position The Medical Device Packaging Design Engineer is a critical engineering role responsible for the design, development, verification, and launch of next-generation ...
Primary Function of Position The Medical Device Packaging Design Engineer is a critical engineering role responsible for the design, development, verification, and launch of next-generation ...
... for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging ... Responsibilities range from architecture, detailed design, validation and new product introduction.
... for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging ... Responsibilities range from architecture, detailed design, validation and new product introduction.
Advanced Packaging Design Engineer
Chandler, AZ · On-site
$133K/yr
Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC/PIC designers to develop a portfolio of packages that meets a huge range of performance ...
Advanced Packaging Design Engineer
Chandler, AZ · On-site
$133K/yr
Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC/PIC designers to develop a portfolio of packages that meets a huge range of performance ...
Packaging Design Engineer, Platforms Infrastructure Engineering
Sunnyvale, CA · On-site
$159 - $230/hr
... packaging and logistics services providers. * Experience with TOPS, CAPE, and FEA simulation tools. About the job As a Product Design Engineer, you will design and evaluate our data center systems ...
Packaging Design Engineer, Platforms Infrastructure Engineering
Sunnyvale, CA · On-site
$159 - $230/hr
... packaging and logistics services providers. * Experience with TOPS, CAPE, and FEA simulation tools. About the job As a Product Design Engineer, you will design and evaluate our data center systems ...
Advanced Packaging Design Engineer
Santa Clara, CA · On-site
$159K/yr
Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC/PIC designers to develop a portfolio of packages that meets a huge range of performance ...
Advanced Packaging Design Engineer
Santa Clara, CA · On-site
$159K/yr
Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC/PIC designers to develop a portfolio of packages that meets a huge range of performance ...
The Role and Impact Intel is seeking a passionate and skilled Analog Layout Design Engineer to join ... Intel invests in our people and offers a complete and competitive package of benefits employees and ...
The Role and Impact Intel is seeking a passionate and skilled Analog Layout Design Engineer to join ... Intel invests in our people and offers a complete and competitive package of benefits employees and ...
The Role and Impact Intel is seeking a passionate and skilled Analog Layout Design Engineer to join ... Intel invests in our people and offers a complete and competitive package of benefits employees and ...
The Role and Impact Intel is seeking a passionate and skilled Analog Layout Design Engineer to join ... Intel invests in our people and offers a complete and competitive package of benefits employees and ...
About the Role Wing is looking for a Senior Packaging Design Engineer to join our team in Palo Alto, CA . Operating as a technical authority and key partner across hardware and operations, you will ...
About the Role Wing is looking for a Senior Packaging Design Engineer to join our team in Palo Alto, CA . Operating as a technical authority and key partner across hardware and operations, you will ...
... packaging and logistics services providers. * Experience with TOPS, CAPE, and FEA simulation tools. About the job As a Product Design Engineer, you will design and evaluate our data center systems ...
... packaging and logistics services providers. * Experience with TOPS, CAPE, and FEA simulation tools. About the job As a Product Design Engineer, you will design and evaluate our data center systems ...
RTL Design Engineer
Hillsboro, OR · On-site
$91K - $128K/yr
As a RTL Design Engineer, you will play a pivotal role in shaping the core logic design and ... Intel invests in our people and offers a complete and competitive package of benefits employees and ...
RTL Design Engineer
Hillsboro, OR · On-site
$91K - $128K/yr
As a RTL Design Engineer, you will play a pivotal role in shaping the core logic design and ... Intel invests in our people and offers a complete and competitive package of benefits employees and ...
Space Electronics Units Packaging Design Engineer
Carlisle, MA · On-site
$80K - $160K/yr
An Electronics Packaging Design Engineer is sought for the packaging design and development of space and aerospace payloads and systems. The successful candidates will develop electronics packaging ...
Quick apply
Space Electronics Units Packaging Design Engineer
Carlisle, MA · On-site
$80K - $160K/yr
An Electronics Packaging Design Engineer is sought for the packaging design and development of space and aerospace payloads and systems. The successful candidates will develop electronics packaging ...
Analog Layout Design Engineer
Hillsboro, OR · On-site
$220K/yr
The Role and Impact Intel is seeking a passionate and skilled Analog Layout Design Engineer to join ... Intel invests in our people and offers a complete and competitive package of benefits employees and ...
Analog Layout Design Engineer
Hillsboro, OR · On-site
$220K/yr
The Role and Impact Intel is seeking a passionate and skilled Analog Layout Design Engineer to join ... Intel invests in our people and offers a complete and competitive package of benefits employees and ...
RTL Design Engineer
Hillsboro, OR · On-site
Life at Intel As a CPU Logic Design Engineer, you will play a critical role in shaping Intel's next ... Benefits at Intel Our total rewards package goes above and beyond just a paycheck. Whether you're ...
RTL Design Engineer
Hillsboro, OR · On-site
Life at Intel As a CPU Logic Design Engineer, you will play a critical role in shaping Intel's next ... Benefits at Intel Our total rewards package goes above and beyond just a paycheck. Whether you're ...
Space Electronics Units Packaging Design Engineer
Carlisle, MA · On-site
$80K - $160K/yr
An Electronics Packaging Design Engineer is sought for the packaging design and development of space and aerospace payloads and systems. The successful candidates will develop electronics packaging ...
Quick apply
Space Electronics Units Packaging Design Engineer
Carlisle, MA · On-site
$80K - $160K/yr
An Electronics Packaging Design Engineer is sought for the packaging design and development of space and aerospace payloads and systems. The successful candidates will develop electronics packaging ...
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Full-time
Medical, Retirement, PTO
Re-posted 18 days ago
Intel rating
8.7
Based on 147 frontline employees who took The Breakroom Quiz
18th of 161 rated electronics manufacturers
Job description
The Role and Impact
Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry.
Business group
Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting-edge solutions across Intel's diverse product portfolio. This group collaborates with cross-functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world-class technologies.
Key Responsibilities of ATD Media Inspection Handling Laser Equipment Development Engineer
- Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
- Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports.
- Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.
- Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
- Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks.
- Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges.
- Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.
- Lead problem-solving initiatives and drive continuous improvement in equipment and processes.
- Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.
- Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. This position is not eligible for Intel immigration sponsorship.
Minimum Qualifications
Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.
-OR- Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience.
-OR- PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience.
Relevant experience should include any of following:
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing
- Competency in mechanical design software such as SolidWorks or AutoCAD.
Preferred Qualifications
- Proven ability to lead technical innovation and manage complex, time-sensitive projects.
- Understanding of semiconductor fabrication processes and packaging technologies.
- Familiarity with supply chain management in a manufacturing or materials qualification environment.
- Experience with high-precision manufacturing methods, including stamping and CNC machining.
Join Intel's team of innovators and contribute to defining the future of technology. Apply now to make your mark and help shape industry-leading packaging solutions.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.About Intel
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Industry
Manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US
Year founded
1968