The Role and Impact As a Product Packaging Engineer, you will be at the forefront of designing and developing innovative packaging solutions that accelerate Intel's product delivery to a global ...
New

The Role and Impact As a Product Packaging Engineer, you will be at the forefront of designing and developing innovative packaging solutions that accelerate Intel's product delivery to a global ...
New
The Role and Impact As a Product Packaging Engineer, you will be at the forefront of designing and developing innovative packaging solutions that accelerate Intel's product delivery to a global ...
New
The Role and Impact As a Product Packaging Engineer, you will be at the forefront of designing and developing innovative packaging solutions that accelerate Intel's product delivery to a global ...
New
The Role and Impact As a Product Packaging Engineer, you will be at the forefront of designing and developing innovative packaging solutions that accelerate Intel's product delivery to a global ...
New
The Role and Impact As a Packaging Module Engineer , you will play a pivotal role in shaping Intel ... Joining Intel means contributing to groundbreaking projects, collaborating with industry-leading ...
New
The Role and Impact As a Packaging Module Engineer , you will play a pivotal role in shaping Intel ... Joining Intel means contributing to groundbreaking projects, collaborating with industry-leading ...
New
The Role and Impact As a Packaging Module Engineer , you will play a pivotal role in shaping Intel ... Joining Intel means contributing to groundbreaking projects, collaborating with industry-leading ...
New
The Role and Impact As a Packaging Module Engineer , you will play a pivotal role in shaping Intel ... Joining Intel means contributing to groundbreaking projects, collaborating with industry-leading ...
New
The Role and Impact As a Packaging Module Development Engineer , you will play a pivotal role in ... Joining Intel means contributing to groundbreaking projects, collaborating with industry-leading ...
The Role and Impact As a Packaging Module Development Engineer , you will play a pivotal role in ... Joining Intel means contributing to groundbreaking projects, collaborating with industry-leading ...
The Role and Impact As a Packaging Module Development Engineer , you will play a pivotal role in ... Joining Intel means contributing to groundbreaking projects, collaborating with industry-leading ...
The Role and Impact As a Packaging Module Development Engineer , you will play a pivotal role in ... Joining Intel means contributing to groundbreaking projects, collaborating with industry-leading ...
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... By leveraging your technical expertise, you will help ensure that Intel delivers exceptional ...
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... By leveraging your technical expertise, you will help ensure that Intel delivers exceptional ...
$94.30K - $133.20K/yr
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... By leveraging your technical expertise, you will help ensure that Intel delivers exceptional ...
$94.30K - $133.20K/yr
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... By leveraging your technical expertise, you will help ensure that Intel delivers exceptional ...
$115.11K - $219.55K/yr
Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical ...
$115.11K - $219.55K/yr
Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical ...
$115.11K - $219.55K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
$115.11K - $219.55K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
The Role and Impact As a Senior Packaging Module Development Engineer , you will play a pivotal ... Collaborating with cross-functional teams, you will contribute directly to Intel's success ...
New
The Role and Impact As a Senior Packaging Module Development Engineer , you will play a pivotal ... Collaborating with cross-functional teams, you will contribute directly to Intel's success ...
New
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
$127.40K - $179.90K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... The Packaging Module Development Engineer will contribute to advancing technology and foundry ...
$127.40K - $179.90K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... The Packaging Module Development Engineer will contribute to advancing technology and foundry ...
$133.80K - $188.89K/yr
Develops assembly processes and/or equipment and applies innovative engineering concepts to enable Intel's future assembly packaging platform technologies. Optimizes and improves manufacturing ...
$133.80K - $188.89K/yr
Develops assembly processes and/or equipment and applies innovative engineering concepts to enable Intel's future assembly packaging platform technologies. Optimizes and improves manufacturing ...
Phoenix, AZ · On-site
$115.11K - $219.55K/yr
Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical ...
Phoenix, AZ · On-site
$115.11K - $219.55K/yr
Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical ...
Phoenix, AZ · On-site
$115.11K - $219.55K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
Phoenix, AZ · On-site
$115.11K - $219.55K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
$127.40K - $179.90K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...
$127.40K - $179.90K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Business group:Intel Foundry strives to make every facet of semiconductor manufacturing ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Business group:Intel Foundry strives to make every facet of semiconductor manufacturing ...
Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel's future assembly packaging platform technologies. Optimizes manufacturing processes to ...
Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel's future assembly packaging platform technologies. Optimizes manufacturing processes to ...
What are the key skills and qualifications needed to thrive as a Packaging Engineer, and why are they important?
How does a Packaging Engineer typically collaborate with other departments during the product development process?
What does a Packaging Engineer do?
What is the difference between Packaging Engineer vs Packaging Technician?
| Aspect | Packaging Engineer | Packaging Technician |
|---|---|---|
| Credentials | Bachelor's degree in engineering, packaging science, or related field | High school diploma or equivalent; technical training often preferred |
| Work Environment | Design, development, and testing of packaging solutions; collaboration with R&D and manufacturing | Implementation, setup, and troubleshooting of packaging processes on the production line |
| Employer & Industry Usage | Manufacturers, consumer goods, food & beverage, pharmaceuticals | Packaging facilities, manufacturing plants, distribution centers |
Packaging Engineers focus on designing and developing packaging solutions, requiring technical degrees and working in R&D or design settings. Packaging Technicians handle the practical implementation and maintenance of packaging processes on the production floor, often with technical training. Both roles are essential in the packaging industry but differ in responsibilities and required qualifications.
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$17.25 - $20/hr
Full-time
Medical, Retirement, PTO
Posted yesterday
8.8
Based on 143 frontline employees who took The Breakroom Quiz
9th of 137 rated electronics manufacturers
The Role and Impact
As a Product Packaging Engineer, you will be at the forefront of designing and developing innovative packaging solutions that accelerate Intel's product delivery to a global customer base. This role places you at the intersection of engineering innovation and sustainability, ensuring Intel's products are safely transported while minimizing environmental impact. You will collaborate across diverse teams, including manufacturing, regulatory, logistics, and supply chain, to meet operational goals and drive continuous improvement. Your contributions will directly influence Intel's ability to deliver high-quality products efficiently, making you an essential part of our mission to shape the future of technology.
Key Responsibilities
Behavioral Skills:
Minimum Qualifications:
Additional Qualifications for Consideration:
Join our team and make an impact on Intel's packaging innovation and sustainability efforts. Apply now to shape the future of technology and leave your mark on a global scale.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $164,470.00-232,190.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Manufacturing
10,000+ Employees
Santa Clara, CA, US
1968