Packaging Engineer
$127K - $179K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...

$127K - $179K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...
$127K - $179K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...
$148K - $209K/yr
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
$148K - $209K/yr
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
$148K - $209K/yr
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
$148K - $209K/yr
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
$148K - $209K/yr
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
$148K - $209K/yr
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
$148K - $209K/yr
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
$148K - $209K/yr
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
Intel is in the midst of an exciting transformation, with a vision to create and extend computing ... As an OTF Module Engineer you will play an important role in the OTF engineering team. You will be ...
Intel is in the midst of an exciting transformation, with a vision to create and extend computing ... As an OTF Module Engineer you will play an important role in the OTF engineering team. You will be ...
The Role and Impact Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you ...
The Role and Impact Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you ...
The Role and Impact Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you ...
The Role and Impact Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you ...
Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and ...
Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and ...
$127K - $179K/yr
This role is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which is dedicated to developing and scaling semiconductor packaging solutions that meet the demands of ...
$127K - $179K/yr
This role is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which is dedicated to developing and scaling semiconductor packaging solutions that meet the demands of ...
$94K - $133K/yr
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... By leveraging your technical expertise, you will help ensure that Intel delivers exceptional ...
$94K - $133K/yr
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... By leveraging your technical expertise, you will help ensure that Intel delivers exceptional ...
Phoenix, AZ · On-site
$85K - $162K/yr
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... By leveraging your technical expertise, you will help ensure that Intel delivers exceptional ...
Phoenix, AZ · On-site
$85K - $162K/yr
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... By leveraging your technical expertise, you will help ensure that Intel delivers exceptional ...
Job Details: Intel is shaping the future of technology to help create a better future for the ... We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ...
Job Details: Intel is shaping the future of technology to help create a better future for the ... We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ...
Phoenix, AZ · On-site
$115K - $219K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
Phoenix, AZ · On-site
$115K - $219K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
Phoenix, AZ · On-site
$133K - $188K/yr
This role is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which is dedicated to developing and scaling semiconductor packaging solutions that meet the demands of ...
Phoenix, AZ · On-site
$133K - $188K/yr
This role is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which is dedicated to developing and scaling semiconductor packaging solutions that meet the demands of ...
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... As a Packaging Module Development Engineer, you will. • Contribute to the advancement of ...
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... As a Packaging Module Development Engineer, you will. • Contribute to the advancement of ...
Phoenix, AZ · On-site
$85K - $162K/yr
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... By leveraging your technical expertise, you will help ensure that Intel delivers exceptional ...
Phoenix, AZ · On-site
$85K - $162K/yr
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... By leveraging your technical expertise, you will help ensure that Intel delivers exceptional ...
Phoenix, AZ · On-site
$133K - $188K/yr
This role is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which is dedicated to developing and scaling semiconductor packaging solutions that meet the demands of ...
Phoenix, AZ · On-site
$133K - $188K/yr
This role is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which is dedicated to developing and scaling semiconductor packaging solutions that meet the demands of ...
Job Details: Intel is shaping the future of technology to help create a better future for the ... We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ...
Job Details: Intel is shaping the future of technology to help create a better future for the ... We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ...
Intel is shaping the future of technology to help create a better future for the entire world. Our ... We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ...
Intel is shaping the future of technology to help create a better future for the entire world. Our ... We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ...
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$127K - $179K/yr
Full-time
Medical, Retirement, PTO
Posted 25 days ago
8.7
Based on 147 frontline employees who took The Breakroom Quiz
19th of 159 rated electronics manufacturers
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
As a Packaging Module Development Engineer, you will:
• Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
• Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
• Manage projects to ensure alignment with product development schedules and execution milestones.
• Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
• Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
• Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
The ideal candidate should demonstrate:
• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.
You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
• Experience listed above should be a combination of the following:
Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
Preferred Qualifications:
One or more years of experience in one or more of the following areas:
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Delivery of results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technologies.
• Prior related work experience within a semiconductor foundry.
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Manufacturing
10,000+ Employees
Santa Clara, CA, US
1968