Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...
Package Design Engineer
$141K - $226K/yr
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...
Package Design Engineer
$141K - $226K/yr
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...
IC Package Design Engineer
Austin, TX · On-site
$134K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
IC Package Design Engineer
Austin, TX · On-site
$134K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
Packaging Design Manager
Twinsburg, OH · On-site
Associate's or Bachelor's degree in Packaging Engineering, Industrial Design, Engineering, Graphic Communications, or a related field preferred (equivalent experience will be considered). What Makes ...
Packaging Design Manager
Twinsburg, OH · On-site
Associate's or Bachelor's degree in Packaging Engineering, Industrial Design, Engineering, Graphic Communications, or a related field preferred (equivalent experience will be considered). What Makes ...
Packaging Design Manager
Twinsburg, OH · On-site
Associate's or Bachelor's degree in Packaging Engineering, Industrial Design, Engineering, Graphic Communications, or a related field preferred (equivalent experience will be considered). What Makes ...
Packaging Design Manager
Twinsburg, OH · On-site
Associate's or Bachelor's degree in Packaging Engineering, Industrial Design, Engineering, Graphic Communications, or a related field preferred (equivalent experience will be considered). What Makes ...
IC Package Design Engineer
$175K - $308K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
IC Package Design Engineer
$175K - $308K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation ... Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers)
Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation ... Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers)
Advanced Package Design Engineer
San Jose, CA · On-site
$159K/yr
Advanced Package Design Engineer Office Location: San Jose, CA Work Model: Onsite About SK hynix ... Design silicon and organic interposers for advanced packaging solutions * Experience in EDA tools ...
Advanced Package Design Engineer
San Jose, CA · On-site
$159K/yr
Advanced Package Design Engineer Office Location: San Jose, CA Work Model: Onsite About SK hynix ... Design silicon and organic interposers for advanced packaging solutions * Experience in EDA tools ...
Dennis Group is a design build engineering firm and general contractor that designs and builds food and beverage processing facilities. As such, our packaging engineers are involved with defining ...
Quick apply
Dennis Group is a design build engineering firm and general contractor that designs and builds food and beverage processing facilities. As such, our packaging engineers are involved with defining ...
IC Package Design Engineer
$122K - $214K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
IC Package Design Engineer
$122K - $214K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
IC Package Design Engineer
$122K - $214K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
IC Package Design Engineer
$122K - $214K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
Advanced Package Design Engineer
San Jose, CA · On-site
$110K - $155K/yr
Advanced Package Design Engineer Office Location: San Jose, CA Work Model: Onsite About SK hynix ... Design silicon and organic interposers for advanced packaging solutions * Experience in EDA tools ...
Advanced Package Design Engineer
San Jose, CA · On-site
$110K - $155K/yr
Advanced Package Design Engineer Office Location: San Jose, CA Work Model: Onsite About SK hynix ... Design silicon and organic interposers for advanced packaging solutions * Experience in EDA tools ...
IC Package Design Engineer
$175K - $308K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
IC Package Design Engineer
$175K - $308K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
Entry Level Packaging Systems Design Engineer
Duluth, GA · On-site
$78K - $82K/yr
As a packaging engineer, your responsibilities will include, but not be limited to: Responsibilities Developing design concepts, estimates and functional specifications for packaging lines ...
Entry Level Packaging Systems Design Engineer
Duluth, GA · On-site
$78K - $82K/yr
As a packaging engineer, your responsibilities will include, but not be limited to: Responsibilities Developing design concepts, estimates and functional specifications for packaging lines ...
Packaging Design Manager
Twinsburg, OH · On-site
Associate's or Bachelor's degree in Packaging Engineering, Industrial Design, Engineering, Graphic Communications, or a related field preferred (equivalent experience will be considered).What Makes ...
Quick apply
Packaging Design Manager
Twinsburg, OH · On-site
Associate's or Bachelor's degree in Packaging Engineering, Industrial Design, Engineering, Graphic Communications, or a related field preferred (equivalent experience will be considered).What Makes ...
IC Package Design Engineer
$175K - $308K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
IC Package Design Engineer
$175K - $308K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
IC Package Design Engineer
$122K - $214K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
IC Package Design Engineer
$122K - $214K/yr
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Description As a Package design engineer, you will lead advanced package architecture, drive next ...
This is a Direct Hire role Design Engineer - Medical Packaging The Design Engineer is responsible for leading the design and development of thermoformed medical packaging solutions that meet customer ...
This is a Direct Hire role Design Engineer - Medical Packaging The Design Engineer is responsible for leading the design and development of thermoformed medical packaging solutions that meet customer ...
Design Engineer
Dekalb, IL · On-site
This is a Direct Hire role Design Engineer - Medical Packaging The Design Engineer is responsible for leading the design and development of thermoformed medical packaging solutions that meet customer ...
Design Engineer
Dekalb, IL · On-site
This is a Direct Hire role Design Engineer - Medical Packaging The Design Engineer is responsible for leading the design and development of thermoformed medical packaging solutions that meet customer ...
Packaging Design Engineer information
See salary details
$90K - $94.2K
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$94.2K - $98.5K
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$98.5K - $102.7K
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$111.1K - $115.4K
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$123.8K - $128K
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$128K - $132.3K
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$133.3K is the 25th percentile. Wages below this are outliers.
$132.3K - $136.5K
100% of jobs
$90K
$136.5K
How much do packaging design engineer jobs pay per year?
What is the difference between Packaging Design Engineer vs Packaging Technician?
| Aspect | Packaging Design Engineer | Packaging Technician |
|---|---|---|
| Credentials | Bachelor's degree in packaging engineering, industrial design, or related field | High school diploma or associate degree, technical training |
| Work Environment | Design studios, R&D labs, manufacturing settings | Production lines, warehouse, testing facilities |
| Job Focus | Developing and optimizing packaging designs, materials, and prototypes | Implementing packaging processes, testing, and quality control |
| Industry Usage | Used by companies creating new packaging solutions | Used in packaging assembly and quality assurance |
The Packaging Design Engineer primarily focuses on creating and improving packaging designs, requiring specialized education and working in design environments. In contrast, the Packaging Technician handles the implementation, testing, and quality control of packaging in production settings. Both roles are essential in the packaging industry but differ in responsibilities and skill requirements.
What are the key skills and qualifications needed to thrive as a packaging design engineer, and why are they important?
What are some common challenges faced by a packaging design engineer when developing new packaging solutions?
What cities are hiring for Packaging Design Engineer jobs?
Cities with the most Packaging Design Engineer job openings:
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The top employers for Packaging Design Engineer jobs are:
What states have the most Packaging Design Engineer jobs?
States with the most job openings for Packaging Design Engineer jobs include:
What job categories do people searching Packaging Design Engineer jobs look for?
The top searched job categories for Packaging Design Engineer jobs are:
What are popular job titles related to Packaging Design Engineer jobs?
For Packaging Design Engineer jobs, the most frequently searched job titles are:

$134K/yr
Full-time
Medical, Dental, Vision, Retirement, PTO
Re-posted 6 days ago
Broadcom rating
8.7
Based on 23 frontline employees who took The Breakroom Quiz
19th of 157 rated electronics manufacturers
Job description
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Job Description:Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.
RESPONSIBILITIES:
Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
Schedule, prioritize, & track your work across 2+ projects simultaneously
General flip-chip BGA package design & engineering
Project management and customer interface for your design projects
Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.
Physical design (layout) is a foundational responsibility in this role
EDUCATION/EXPERIENCE & REQUIREMENTS:
BSEE or similar field and 8+ years' experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 6+ years' work experience
Knowledge of package-level signal integrity and power integrity, to apply to package designs
Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.
Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
Self-management and organization skills
Preferred candidates will also have1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest
OTHER REQUIREMENTS
This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position.
Compensation and Benefits
The annual base salary range for this position is USD 121,900.00 To USD 195,000.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
About Broadcom
Sourced by ZipRecruiter
Industry
Semiconductor and electronic component manufacturing
Company size
10,000+ Employees
Headquarters location
Palo Alto, CA, US
Year founded
1991