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Electronic Packaging Jobs (NOW HIRING)

This role focuses on advanced mechanical and thermal packaging solutions for high-density, high ... Prior experience developing optoelectronic or high-speed electronic products for data center, AI ...

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer ...

Experience working in an electronic packaging or similar manufacturing environment. * Ability to assemble electronic subassemblies and install harnesses. * Comfort working under a production schedule ...

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Electronic Packaging information

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$29.5K

$60.8K

$95.5K

How much do electronic packaging jobs pay per year?

As of Aug 30, 2026, the average yearly pay for electronic packaging in the United States is $60,843.00, according to ZipRecruiter salary data. Most workers in this role earn between $46,000.00 and $70,000.00 per year, depending on experience, location, and employer.

What is electronic packaging?

Electronic packaging refers to the design and production of enclosures and protective casings for electronic components and systems. It involves integrating circuit boards, chips, connectors, and other hardware into a physical package that ensures protection from environmental factors and facilitates electrical connections. Good electronic packaging is essential for the reliability, thermal management, and miniaturization of modern electronic devices.

What are the key skills and qualifications needed to thrive as an electronic packaging engineer?

To thrive as an Electronic Packaging Engineer, you need strong knowledge of materials science, thermal management, and mechanical design, usually supported by a degree in electrical or mechanical engineering. Familiarity with CAD software, PCB design tools (like Altium Designer), and industry standards such as IPC is essential. Attention to detail, problem-solving, and effective communication are standout soft skills for coordinating with multidisciplinary teams and ensuring product reliability. These skills are crucial for creating robust, manufacturable electronic systems that meet performance, safety, and cost requirements.

What are some common challenges faced by professionals in electronic packaging, and how can they be addressed?

Professionals in electronic packaging often encounter challenges related to thermal management, miniaturization, and ensuring reliability under various environmental conditions. As electronic devices become smaller and more powerful, managing heat dissipation and preventing component failure are key concerns. To address these issues, collaboration with design engineers, material scientists, and manufacturing teams is essential, as is staying current with advances in materials and simulation tools. Continuous learning and proactive problem-solving can help professionals overcome these challenges and contribute to innovative, high-performance electronic products.

What is the difference between Electronic Packaging vs PCB Design Engineer?

AspectElectronic PackagingPCB Design Engineer
Primary FocusDesigning protective enclosures and integrating electronic components into packagesDesigning printed circuit boards for electronic circuits
Required SkillsMaterials science, thermal management, mechanical designCircuit design, schematic capture, layout skills
Work EnvironmentManufacturing facilities, R&D labsDesign offices, electronics labs
Common CertificationsIPC standards, mechanical engineering certificationsIPC standards, electrical engineering certifications

Electronic Packaging and PCB Design Engineer roles overlap in electronics manufacturing but differ mainly in focus. Electronic Packaging emphasizes protecting and integrating components physically, while PCB Design Engineers focus on creating the circuit layouts. Both roles require IPC standards and are vital in electronics product development.

More about Electronic Packaging jobs

What states have the most Electronic Packaging jobs?

States with the most job openings for Electronic Packaging jobs include:

Infographic showing various Electronic Packaging job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 84% Full Time, 13% Part Time, and 2% Contract. Highlights an 84% Physical, 1% Hybrid, and 15% Remote job distribution, with an average salary of $60,843 per year, or $29.3 per hour.

Optical-Electronic Packaging Engineer

Lumentum Operations LLC

San Jose, CA • On-site

$134.75 - $192.50/hr

Other

Re-posted 18 days ago


Job description

Optical-Electronic Packaging EngineerSkip to main contentWe use cookies to make the safest and most effective website possible.# OpportunitiesOptical-Electronic Packaging Engineer page is loaded## Optical-Electronic Packaging EngineerApplylocations: USA - CA - San Jose (Ridder)time type: Full timeposted on: Posted Todayjob requisition id: 2026174**It's fun to work in a company where people truly BELIEVE in what they're doing!** We're committed to bringing passion and customer focus to the business.If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!**Position Title: Mechanical Engineer (AI & Data Center Optical Modules)****Employment Type:** Full-time, Existing vacancy**Location:** San-Jose (On-Site)**About Lumentum**At Lumentum, we’re building the tech behind the world’s fastest networks and most advanced systems. Our optical and photonic solutions power everything from AI and cloud computing to data centers, telecom, and advanced manufacturing.We’re a global team of innovators working where light meets technology, solving big challenges that keep the world connected and moving forward. If shaping the future of connectivity excites you, you’ll fit right in.**Why You’ll Love This Role**We are seeking Mechanical Engineers to support the design and development of next-generation high-speed optical modules for AI and data center interconnect applications. This role focuses on advanced mechanical and thermal packaging solutions for high-density, high-power optical modules, including pluggable form factors and emerging advanced packaging architectures.Engineers in this role will define and deliver mechanical package solutions from early concept and system architecture through prototyping, validation (EVT/DVT), and high-volume manufacturing ramp. The scope of responsibility will scale with experience. Senior engineers are expected to provide technical leadership, influence mechanical and thermal architecture decisions, and contribute to long-term platform and technology roadmap development.This position plays a critical role in enabling scalable, cost-effective optical module platforms that meet the performance, power, and manufacturability demands of AI-driven data center systems.**What You’ll Be Doing*** Design and develop mechanical packaging solutions for high-speed optical modules used in AI and data center interconnect systems* Drive mechanical concepts from architecture definition through detailed design, prototype build, validation, and production ramp* Develop detailed 3D CAD models and engineering documentation* Perform advanced thermal and mechanical stress analysis (FEA) to address high power density, airflow constraints, and long-term reliability* Own GD&T definition and tolerance stack-up analysis for high-density opto-electro-mechanical assemblies* Design fixtures, tooling, and test infrastructure to support optical alignment, module validation, and scalable manufacturing* Collaborate closely with optical, electrical, thermal, reliability, manufacturing, and supply-chain teams to deliver integrated, system-aware solutions* For senior-level engineers: provide technical direction, review designs, mentor junior engineers, and influence mechanical and thermal platform strategy**What We’re Looking For****Education: B.S. in Mechanical Engineering or a related discipline (M.S. or Ph.D. preferred)****Experience: Core Requirements:*** Experience level flexible: typically 5+ years of relevant industry experience for senior-level consideration; motivated early-career engineers with strong fundamentals and relevant project experience are also encouraged to apply* Prior experience developing optoelectronic or high-speed electronic products for data center, AI, or high-performance computing applications is highly valued* Strong proficiency in mechanical design and thermal simulation tools such as SolidWorks, FloTHERM, or equivalent CAD/FEA platforms* Deep understanding of thermal management, structural analysis, and high-density packaging design* Experience with GD&T and tolerance stack-up analysis for complex assemblies* Familiarity with high-density, non-hermetic optical module packaging and design for manufacturability (DFM/DFA)* Working knowledge of data analysis tools (e.g., JMP) and basic scripting or programming (VB, C, MATLAB, etc.) to support testing and automation is a plus* Ability to operate independently on complex technical problems while contributing effectively in a highly cross-functional environment.* Self-motivated and adaptable in a fast-paced R&D and NPI environment* Willingness to travel internationally (up to 25%) to manufacturing and contract manufacturing sites to drive NPI execution, manufacturing readiness, yield improvement, and high-volume production ramp**Perks You’ll Love*** Flexible time off* Health and wellness benefits (physical and mental)* Tuition reimbursement and career growth support* A workplace built for you: free gym, games room, prayer room* Subsidized meals, free coffee/tea* Employee stock options and incentive plans* A collaborative, innovative, and inclusive culture**Join a Team That’s Shaping the Future**At Lumentum, we’re more than just a workplace—we’re a launchpad for creativity and innovation. We’re committed to celebrating your unique talents and helping you grow. Our guiding principles—Innovate, Engage, Deliver, Excel, and Win—aren’t just words; they’re the heart of what we do.**Let’s Build a Brighter Future Together!****We’re committed to building an inclusive workplace where everyone feels valued and empowered. We welcome applicants from all backgrounds and provide accommodations for individuals with disabilities throughout the hiring process. Your uniqueness makes us stronger, sparks creativity, and drives our success.*****Please contact us at*** ***talentacquisition@lumentum.com*** ***to request accommodation.*****Join us—your future starts here!****Pay Range:**P70-USA-1 :$134,750.00 - $192,500.00**Disclaimer:**Final base salary for the successful candidate will depend on multiple factors, including but not limited to, job location, where work will be performed, qualifications, work history and relevant experience. With our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits.Lumentum is illuminating the networks of tomorrow with advanced photonic technologies that enable AI, data centers, telecom, industrial, and sensing applications. As AI accelerates the global demand for bandwidth and energy efficiency, we deliver the building blocks that keep data moving reliably, efficiently, and at massive scale. Our optical products support AI and compute infrastructure, cloud and DCI environments, metro and long-haul networks, while our lasers drive breakthroughs in precision manufacturing and sensing.For nearly five decades, Lumentum has been at the intersection of light and innovation. What began as a vision with JDS Uniphase to harness the power of photonics has evolved into a global force driving the communication infrastructure of tomorrow. At Lumentum, we’re building more than a business—we’re building a team of passionate innovators whose drive to collaborate, create, and connect the world fuels everything we do. We are part of the AI technology revolution and we are illuminating the path forward. Headquartered in San Jose, California, we operate worldwide through a network of R&D, manufacturing, and sales locations. #J-18808-Ljbffr