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Electronic Packaging Jobs (NOW HIRING)

This role focuses on advanced mechanical and thermal packaging solutions for high-density, high ... Prior experience developing optoelectronic or high-speed electronic products for data center, AI ...

Semiconductor Packaging Engineer

Redmond, WA ยท On-site

$115K - $145K/yr

This role supports the design, fabrication, and validation of advanced electronic packaging solutions for heterogeneous, flexible, and stretchable electronic systems, while collaborating across ...

Semiconductor Packaging Engineer

Redmond, WA ยท On-site

$115K - $145K/yr

This role supports the design, fabrication, and validation of advanced electronic packaging solutions for heterogeneous, flexible, and stretchable electronic systems, while collaborating across ...

Design and develop electronic and semiconductor packaging solutions from concept through production * Manage projects, timelines, and deliverables across cross-functional teams * Work directly with ...

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer ...

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer ...

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Electronic Packaging information

See salary details

$29.5K

$60.8K

$95.5K

How much do electronic packaging jobs pay per year?

As of Jun 10, 2026, the average yearly pay for electronic packaging in the United States is $60,843.00, according to ZipRecruiter salary data. Most workers in this role earn between $46,000.00 and $70,000.00 per year, depending on experience, location, and employer.

What is electronic packaging?

Electronic packaging refers to the design and production of enclosures and protective casings for electronic components and systems. It involves integrating circuit boards, chips, connectors, and other hardware into a physical package that ensures protection from environmental factors and facilitates electrical connections. Good electronic packaging is essential for the reliability, thermal management, and miniaturization of modern electronic devices.

What is the difference between Electronic Packaging vs PCB Design Engineer?

AspectElectronic PackagingPCB Design Engineer
Primary FocusDesigning protective enclosures and integrating electronic components into packagesDesigning printed circuit boards for electronic circuits
Required SkillsMaterials science, thermal management, mechanical designCircuit design, schematic capture, layout skills
Work EnvironmentManufacturing facilities, R&D labsDesign offices, electronics labs
Common CertificationsIPC standards, mechanical engineering certificationsIPC standards, electrical engineering certifications

Electronic Packaging and PCB Design Engineer roles overlap in electronics manufacturing but differ mainly in focus. Electronic Packaging emphasizes protecting and integrating components physically, while PCB Design Engineers focus on creating the circuit layouts. Both roles require IPC standards and are vital in electronics product development.

What are the key skills and qualifications needed to thrive as an Electronic Packaging Engineer, and why are they important?

To thrive as an Electronic Packaging Engineer, you need strong knowledge of materials science, thermal management, and mechanical design, usually supported by a degree in electrical or mechanical engineering. Familiarity with CAD software, PCB design tools (like Altium Designer), and industry standards such as IPC is essential. Attention to detail, problem-solving, and effective communication are standout soft skills for coordinating with multidisciplinary teams and ensuring product reliability. These skills are crucial for creating robust, manufacturable electronic systems that meet performance, safety, and cost requirements.

What are some common challenges faced by professionals in electronic packaging, and how can they be addressed?

Professionals in electronic packaging often encounter challenges related to thermal management, miniaturization, and ensuring reliability under various environmental conditions. As electronic devices become smaller and more powerful, managing heat dissipation and preventing component failure are key concerns. To address these issues, collaboration with design engineers, material scientists, and manufacturing teams is essential, as is staying current with advances in materials and simulation tools. Continuous learning and proactive problem-solving can help professionals overcome these challenges and contribute to innovative, high-performance electronic products.
More about Electronic Packaging jobs
What states have the most Electronic Packaging jobs? States with the most job openings for Electronic Packaging jobs include:
What job categories do people searching Electronic Packaging jobs look for? The top searched job categories for Electronic Packaging jobs are:
Infographic showing various Electronic Packaging job openings in the United States as of June 2026, with employment types broken down into 1% Locum Tenens, 5% As Needed, 75% Full Time, 10% Part Time, 8% Contract, and 1% Nights. Highlights an 96% Physical, 1% Hybrid, and 3% Remote job distribution, with an average salary of $60,843 per year, or $29.3 per hour.
Optical-Electronic Packaging Engineer

Optical-Electronic Packaging Engineer

Lumentum Operations LLC

San Jose, CA โ€ข On-site

$130K - $186K/yr

Full-time

Posted 29 days ago


Job description

It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.
If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!
Mechanical Engineer ( AI & Data Center Optical Modules)
Department: Research & Development
Location: San Jose, California, USA
Position Overview
We are seeking Mechanical Engineers to support the design and development of next-generation high-speed optical modules for AI and data center interconnect applications. This role focuses on advanced mechanical and thermal packaging solutions for high-density, high-power optical modules, including pluggable form factors and emerging advanced packaging architectures.
Engineers in this role will define and deliver mechanical package solutions from early concept and system architecture through prototyping, validation (EVT/DVT), and high-volume manufacturing ramp. The scope of responsibility will scale with experience. Senior engineers are expected to provide technical leadership, influence mechanical and thermal architecture decisions, and contribute to long-term platform and technology roadmap development.
This position plays a critical role in enabling scalable, cost-effective optical module platforms that meet the performance, power, and manufacturability demands of AI-driven data center systems.
Key Responsibilities
  • Design and develop mechanical packaging solutions for high-speed optical modules used in AI and data center interconnect systems
  • Drive mechanical concepts from architecture definition through detailed design, prototype build, validation, and production ramp
  • Develop detailed 3D CAD models and engineering documentation
  • Perform advanced thermal and mechanical stress analysis (FEA) to address high power density, airflow constraints, and long-term reliability
  • Own GD&T definition and tolerance stack-up analysis for high-density opto-electro-mechanical assemblies
  • Design fixtures, tooling, and test infrastructure to support optical alignment, module validation, and scalable manufacturing
  • Collaborate closely with optical, electrical, thermal, reliability, manufacturing, and supply-chain teams to deliver integrated, system-aware solutions
  • For senior-level engineers: provide technical direction, review designs, mentor junior engineers, and influence mechanical and thermal platform strategy
Qualifications
  • B.S. in Mechanical Engineering or a related discipline (M.S. or Ph.D. preferred)
  • Experience level flexible: typically 5+ years of relevant industry experience for senior-level consideration; motivated early-career engineers with strong fundamentals and relevant project experience are also encouraged to apply
  • Prior experience developing optoelectronic or high-speed electronic products for data center, AI, or high-performance computing applications is highly valued
  • Strong proficiency in mechanical design and thermal simulation tools such as SolidWorks, FloTHERM, or equivalent CAD/FEA platforms
  • Deep understanding of thermal management, structural analysis, and high-density packaging design
  • Experience with GD&T and tolerance stack-up analysis for complex assemblies
  • Familiarity with high-density, non-hermetic optical module packaging and design for manufacturability (DFM/DFA)
  • Working knowledge of data analysis tools (e.g., JMP) and basic scripting or programming (VB, C, MATLAB, etc.) to support testing and automation is a plus
  • Ability to operate independently on complex technical problems while contributing effectively in a highly cross-functional environment
Additional Information
  • Self-motivated and adaptable in a fast-paced R&D and NPI environment
  • Willingness to travel internationally (up to 25%) to manufacturing and contract manufacturing sites to drive NPI execution, manufacturing readiness, yield improvement, and high-volume production ramp

Pay Range:
P70-USA-1 :$130,850.00 - $186,900.00
Disclaimer:
Final base salary for the successful candidate will depend on multiple factors, including but not limited to, job location, where work will be performed, qualifications, work history and relevant experience. With our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits.