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Executive Probe Card Engineer Jobs (NOW HIRING)

onsemi

Director, Probe and Post Fab

Hopewell Junction, NY · On-site

$164K - $296K/yr

Bachelor's degree in engineering or related technical discipline * 12+ years of semiconductor ... Probe strategies and probe card utilization * Wafer thickness targets, TTV, warp, and bow controls

onsemi

Director, Probe and Post Fab

Hopewell, NY · On-site

$164K - $296K/yr

Probe strategies and probe card utilization * Wafer thickness targets, TTV, warp, and bow controls ... Build, develop, and retain high-performing engineering and operations teams * Establish clear ...

Advantest

Lead Application Engineer

San Jose, CA · On-site

Guide ATE system configuration, load board and probe card design, and test interface integration ... Work closely with engineering teams across Europe, Asia, and North America. * Conduct customer ...

Nokia

Senior ATE Wafer Test Engineer

Sunnyvale, CA · On-site

Knowledge of automated test equipment (ATE) platforms, probe card development, software and ... Some experience with scripting and simple programming skills. * Critical thinking skills to debug ...

Nokia

Senior ATE Wafer Test Engineer

Sunnyvale, CA

Knowledge of automated test equipment (ATE) platforms, probe card development, software and ... Some experience with scripting and simple programming skills. * Critical thinking skills to debug ...

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Executive Probe Card Engineer information

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$36K

$83.5K

$116K

How much do executive probe card engineer jobs pay per year?

As of Jun 7, 2026, the average yearly pay for executive probe card engineer in the United States is $83,498.00, according to ZipRecruiter salary data. Most workers in this role earn between $70,000.00 and $94,500.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as an Executive Probe Card Engineer, and why are they important?

To thrive as an Executive Probe Card Engineer, you need in-depth knowledge of semiconductor testing, probe card design, and materials science, usually supported by a degree in electrical engineering or a related field. Proficiency with CAD software, semiconductor testing equipment, and familiarity with industry standards is essential, along with relevant certifications. Strong problem-solving, project management, and communication skills make someone stand out in this role. These abilities are crucial for developing innovative, reliable probe card solutions and ensuring efficient testing of semiconductor devices in a highly competitive industry.

What are some of the common challenges faced by Executive Probe Card Engineers, and how can they be addressed?

Executive Probe Card Engineers often encounter challenges such as managing tight project timelines, maintaining high accuracy in probe card design, and coordinating between cross-functional teams like test engineering and manufacturing. Staying updated with evolving semiconductor technologies and troubleshooting complex test issues are also key aspects of the role. Addressing these challenges involves proactive communication, continuous learning, and leveraging data-driven analysis to optimize probe card performance. Building strong relationships with both internal teams and external vendors can also help streamline workflows and resolve potential bottlenecks more efficiently.

What is the difference between Executive Probe Card Engineer vs Test Engineer?

AspectExecutive Probe Card EngineerTest Engineer
CredentialsBachelor's or higher in Electrical Engineering or related field; industry certificationsBachelor's or higher in Electrical, Electronics, or Computer Engineering; certifications optional
Work EnvironmentSemiconductor fabrication labs, R&D centers, manufacturing facilitiesTesting labs, production lines, R&D departments
Industry UsageDesign and develop probe cards for wafer testing in semiconductor industryDesign, develop, and execute testing procedures for electronic devices

The Executive Probe Card Engineer primarily focuses on designing and developing probe cards used in wafer testing within the semiconductor industry, requiring specialized technical skills. Test Engineers, while also involved in testing processes, typically focus on testing electronic devices and systems. Both roles require technical expertise, but the Executive Probe Card Engineer's role is more specialized towards probe card development for semiconductor testing.

What is an Executive Probe Card Engineer?

An Executive Probe Card Engineer is a specialized professional responsible for designing, developing, and optimizing probe cards used in semiconductor wafer testing. They oversee the engineering processes that ensure probe cards are efficient, reliable, and meet the precise requirements of integrated circuit testing. In addition to technical expertise, they often manage teams, coordinate with clients, and drive innovation in testing methodologies. Their work is crucial for ensuring the quality and yield of semiconductor devices before packaging and shipment.
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Executive Probe Card Engineer jobs near you
Infographic showing various Executive Probe Card Engineer job openings in the United States as of May 2026, with employment types broken down into 1% As Needed, 80% Full Time, 17% Part Time, and 2% Contract. Highlights an 86% Physical, 4% Hybrid, and 10% Remote job distribution, with an average salary of $83,498 per year, or $40.1 per hour.
Director, Probe and Post Fab

Director, Probe and Post Fab

onsemi

Hopewell Junction, NY • On-site

$164K - $296K/yr

Full-time

Posted 28 days ago

Onsemi rating

8.0

Company rating: 8.0 out of 10

Based on 18 frontline employees who took The Breakroom Quiz

Job description

The Director of Probe & PostFab Operations is responsible for endtoend leadership of wafer manufacturing activities from electrical probe through postfab processing, including wafer thinning and back side metallization. This role owns the transition from electrical qualification to wafer readiness for assembly, with accountability for yield, cost per wafer, wafer integrity, reliability, cycle time, and operational scalability.

A key responsibility of this role is to define and execute the automation strategy for PostFab Operations, ensuring that postfab manufacturing systems, controls, and data integration resemble frontend fab standards, while supporting a phased approach to material handling automation (onsemi assembly test operations and external assembly)

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.


onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.

If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact Talent.acquisition@onsemi.com for assistance.

Required

  • Bachelor's degree in engineering or related technical discipline
  • 12+ years of semiconductor manufacturing experience
  • Demonstrated leadership in Probe and/or PostFab Operations
  • Experience driving manufacturing system standardization and/or automation
  • Proven ability to lead organizations through operational change

Preferred

  • Advanced degree (MS or PhD)
  • Experience leading multiarea manufacturing organizations
  • Thinwafer, power, or analog device manufacturing background
  • Experience deploying MES, tracking, or automation in nonfab environments

 Salary: onsemi is excited to share the base salary range for this position is $164,800 to $296,600 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
 

Leadership & Strategy

  • Define and execute the operational, technical, and automation strategy for Probe & PostFab Operations
  • Establish a phased automation roadmap for PostFab, balancing nearterm practicality with longterm scalability
  • Ensure PostFab systems and execution models align with fablevel manufacturing standards

Operational Ownership

  • Full accountability for yield, cost per wafer, cycle time, and quality from probe through postfab
  • Lead stable execution of postfab operations during automation transitions
  • Drive continuous improvement while maintaining production continuity

Automation & Manufacturing Systems

  • Lead the evolution of PostFab Operations toward a fablike operating model, including: 
    • MES usage, tracking, and lot genealogy
    • SPC, recipe control, and data integrity
    • Standard work and operational discipline
  • Establish an automation approach where: 
    • Shortterm: tooltotool transport may remain manual
    • Longterm: material delivery and flow enable automated solutions
  • Partner with IT, Manufacturing Systems, and Facilities to ensure scalable, standardized implementation

Technical Stewardship

  • Provide oversight of: 
    • Probe strategies and probe card utilization
    • Wafer thickness targets, TTV, warp, and bow controls
    • Back side metallization robustness and compatibility with assembly flows
  • Ensure manufacturing readiness for new products and volume ramps

Organization & Talent

  • Build, develop, and retain highperforming engineering and operations teams
  • Establish clear expectations for managers and technical leaders
  • Promote a culture of discipline, accountability, and continuous improvement

CrossFunctional Integration

  • Serve as the primary interface to: 
    • Frontend Fab leadership
    • Assembly and packaging organizations
    • Quality, reliability, supply chain, and IT teams
  • Support capital planning, automation investments, and costreduction initiatives

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