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Director Chip Design Jobs (NOW HIRING)

Senior Package Design Engineer

San Jose, CA ยท Hybrid

$110K - $205K/yr

Overview Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to ... This is a full-time position reporting to the Director of Package Engineering. As a Senior Package ...

We are seeking an experienced Senior Manager, Asic Design to lead our Asic chip design team. Reporting to the Senior Director, Asic Engineering, you will manage a team and oversee the end-to-end ...

What You Can Expect We are seeking an experienced Senior Manager, ASIC Design to lead our ASIC chip design team. Reporting to the Senior Director, ASIC Engineering, you will manage a team and oversee ...

Astera Labs is seeking an Senior Director OR Associate Vice President, Product Technical Lead (Chip ... This is an executive technical leadership role where you will connect architecture, design ...

Lead chip design projects and deliver successful silicon * Translate chip-level specifications into ... Direct project experience in one or more of the following areas: * Low noise/high linear broadband ...

Lead chip design projects and deliver successful silicon * Translate chip-level specifications into ... Direct project experience in one or more of the following areas: * Low noise/high linear broadband ...

Lead chip design projects and deliver successful silicon * Translate chip-level specifications into ... Direct project experience in one or more of the following areas: * Low noise/high linear broadband ...

Lead chip design projects and deliver successful silicon * Translate chip-level specifications into ... Direct project experience in one or more of the following areas: * Low noise/high linear broadband ...

You will be responsible for implementing complete chip design from netlist to tapeout. You will ... directly and or directing a team of engineers to innovate and complete world class designs.

Lead chip design projects and deliver successful silicon * Translate chip-level specifications into ... Direct project experience in one or more of the following areas: * Low noise/high linear broadband ...

Lead chip design projects and deliver successful silicon * Translate chip-level specifications into ... Direct project experience in one or more of the following areas: * Low noise/high linear broadband ...

Lead chip design projects and deliver successful silicon * Translate chip-level specifications into ... Direct project experience in one or more of the following areas: * Low noise/high linear broadband ...

Lead chip design projects and deliver successful silicon * Translate chip-level specifications into ... Direct project experience in one or more of the following areas: * Low noise/high linear broadband ...

Lead chip design projects and deliver successful silicon * Translate chip-level specifications into ... Direct project experience in one or more of the following areas: * Low noise/high linear broadband ...

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Director Chip Design information

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$37K

$135.8K

$243K

How much do director chip design jobs pay per year?

As of Jun 5, 2026, the average yearly pay for director chip design in the United States is $135,763.00, according to ZipRecruiter salary data. Most workers in this role earn between $109,500.00 and $163,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Director of Chip Design, and why are they important?

To thrive as a Director of Chip Design, you need deep expertise in semiconductor design, electrical engineering, and project management, typically backed by an advanced degree and significant industry experience. Familiarity with EDA tools like Cadence or Synopsys, knowledge of ASIC/FPGA design flows, and relevant certifications are often required. Exceptional leadership, strategic thinking, and communication skills help drive innovation and coordinate cross-functional teams. These competencies ensure the successful delivery of complex chip projects that meet technical, budget, and time objectives in a highly competitive industry.

What are some common challenges a Director of Chip Design faces when leading multidisciplinary engineering teams?

A Director of Chip Design often manages teams that include digital, analog, verification, and layout engineers, making cross-functional communication and alignment essential. One common challenge is balancing project timelines with the need for innovation and rigorous testing to ensure chip reliability and performance. Additionally, staying ahead of rapidly evolving semiconductor technologies and managing resources across multiple concurrent projects can be demanding. Effective directors foster a collaborative environment, resolve technical conflicts, and ensure that all teams work towards shared goals.

What does a Director of Chip Design do?

A Director of Chip Design oversees the entire process of designing integrated circuits (ICs) or microchips, managing teams of engineers and ensuring that projects meet technical and business requirements. This role involves setting the vision and strategy for chip development, collaborating with cross-functional teams, and ensuring timely delivery of high-quality products. The director is responsible for resource allocation, project management, and fostering innovation to keep up with industry trends. Additionally, they ensure compliance with industry standards and drive continuous improvement in design methodologies.
More about Director Chip Design jobs
What cities are hiring for Director Chip Design jobs? Cities with the most Director Chip Design job openings:
What are the most commonly searched types of Chip Design jobs? The most popular types of Chip Design jobs are:
What states have the most Director Chip Design jobs? States with the most job openings for Director Chip Design jobs include:
What job categories do people searching Director Chip Design jobs look for? The top searched job categories for Director Chip Design jobs are:
Infographic showing various Director Chip Design job openings in the United States as of May 2026, with employment types broken down into 8% Internship, 64% Full Time, 8% Part Time, 16% Temporary, and 4% Contract. Highlights an 95% Physical, 2% Hybrid, and 3% Remote job distribution, with an average salary of $135,763 per year, or $65.3 per hour.
Senior Package Design Engineer

Senior Package Design Engineer

Rambus

San Jose, CA โ€ข Hybrid

$110K - $205K/yr

Other

Medical, Dental, Retirement

Posted 10 days ago


Job description

Overview

Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose, CA. In this role, you will be working with some of the brightest inventors and engineers in the world developing products that make data faster and safer.

This is a full-time position reporting to the Director of Package Engineering. As a Senior Package Design Engineer, you will be responsible for supporting the design and layout of new products from early concept to tape out, focusing primarily on several elements that enable high-yielding, low defectivity production. The Senior Package Design Engineer will have the opportunity to work with multiple package technologies and outsourced suppliers to ensure manufacturing readiness for the Rambus product portfolio.

Rambus offers a flexible work environment, embracing a hybrid approach for most office-based roles. Employees are encouraged to spend an average of at least three days per week onsite, allowing for two days of remote work.

Responsibilities
  • Drive early chip-package co-design and development of bump and ball map.
  • Own layout of package types such as FCCSP, FCBGA, FCQFN, WLCSP, QFN.
  • Collaborate with multiple cross-functional teams (Chip Design, SI/PI, Packaging)
  • Analyze cost/performance/reliability trade-offs to complete layout of new products and test chips.
  • Interact with OSAT partners and substrate/leadframe suppliers for design reviews and execution.
  • Continuous improvement of package design workflow and unified package design guidelines.
  • Assist with model creation for thermo-mechanical package simulations.
Qualifications
  • MS Degree in EE/CE
  • Proficiency with Cadence Allegro Package Designer (APD) and AutoCAD.
  • 5+ years of experience in packaging design and layout, preferably in an advanced silicon node.
  • Proven track record with multiple packaging types where products have gone to volume production.
  • Experience routing high-speed, high pin count devices and understanding of signal and power integrity fundamentals.
  • Knowledge of organic laminate substrate technologies and manufacturing capabilities.
  • Awareness of JEDEC standards and other specifications that may govern package design.
  • Understanding of package material properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc.
  • Excellent communication, initiative, multi-tasking, and time management.
  • Strong commitment and ability to work in cross functional and globally dispersed teams

About Rambusย 

Rambus is a global company that makes industry-leading memory interface chips and Silicon IP to advance data center connectivity and solve the bottleneck between memory and processing. With over 30 years of semiconductor experience, we are a leading provider of high-performance products and innovations that maximize the bandwidth, capacity and security for AI and other data-intensive workloads. Our world-class team is the foundation of our company, and our innovative spirit drives us to develop theย cutting-edgeย products and technologies essential for tomorrow's systems.ย ย 

Rambus offers a competitive compensation packageย includingย base salary, bonus, equity, matching 401(k), employee stock purchase plan, comprehensive medical and dental benefits, time-off program, and gym membership.ย ย 

Theย USย salary range for thisย full-timeย position is $110,700ย to $205,700.ย Our salary ranges areย determinedย by role,ย levelย and location. The successful candidate's starting pay will beย determinedย based on job-related skills, experience, qualifications, workย locationย and market conditions.ย 

At Rambus, we are committed to fostering a workplace where every individual is respected, supported, and empowered to succeed. We value a range of perspectives and experiences that contribute to innovation and collaboration. Our goal is to ensure that all team members haveย equitableย access to opportunities, resources, and a sense of belonging. We believe that a culture of fairness and inclusion helps us all do ourย best work.ย 

ย Rambus is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity, gender expression, age, status as a protected veteran, status as an individual with a disability, genetic information, or other applicable legally protected characteristics.ย ย 

Rambus is committed to providing reasonable accommodations for qualified individuals with disabilities and disabled veteransย duringย our job application procedures. If youย requireย assistanceย orย an accommodationย due to a disability,ย please feel free to inform us in your application.ย 

Rambus does not accept unsolicited resumes from headhunters, recruitmentย agenciesย or fee-based recruitment services.ย 

For more information about Rambus, visit rambus.com. Forย additionalย information on life at Rambus and our current openings, check outrambus.com/careers/.ย 

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