What is wire bonding?

Wire bonding is a method used in semiconductor and electronics manufacturing to create electrical connections between an integrated circuit (IC) chip and its package or between two chips. It involves using fine wires, typically made of gold, aluminum, or copper, to connect tiny bond pads on the chip to corresponding pads on a substrate. This process is critical for ensuring the proper functioning of microchips in a wide variety of electronic devices. Wire bonding is valued for its reliability, flexibility, and cost-effectiveness in high-volume production.