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Temporary Probe Card Engineer Jobs (NOW HIRING)

Manufacturing Technician 1

Livermore, CA · On-site

$19.30 - $25.36/hr

... with engineering and manufacturing teams. Key Responsibilities: * Perform routine manufacturing operations associated with probe card production, including photolithography, thin film processing ...

Manufacturing Technician 1

Livermore, CA · On-site

$19.30 - $25.36/hr

... with engineering and manufacturing teams. Key Responsibilities: * Perform routine manufacturing operations associated with probe card production, including photolithography, thin film processing ...

... with engineering and manufacturing teams. Key Responsibilities: * Perform routine manufacturing operations associated with probe card production, including photolithography, thin film processing ...

Manufacturing Technician 1

Livermore, CA · On-site

$19.30 - $25.36/hr

... with engineering and manufacturing teams. Key Responsibilities: * Perform routine manufacturing operations associated with probe card production, including photolithography, thin film processing ...

Manufacturing Technician 1

Livermore, CA · On-site

$19.30 - $25.36/hr

... with engineering and manufacturing teams. Key Responsibilities: * Perform routine manufacturing operations associated with probe card production, including photolithography, thin film processing ...

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Temporary Probe Card Engineer information

What is the difference between Temporary Probe Card Engineer vs Test Engineer?

AspectTemporary Probe Card EngineerTest Engineer
CredentialsRelevant technical certifications, engineering degreeEngineering degree, certifications may vary
Work EnvironmentSemiconductor testing labs, cleanroomsElectronics testing labs, manufacturing facilities
Industry UsageSemiconductor industry, chip testingElectronics, consumer devices, industrial equipment
Common Search IntentComparing roles in semiconductor testingUnderstanding electronics testing roles

The Temporary Probe Card Engineer primarily focuses on developing, testing, and maintaining probe cards used in semiconductor wafer testing. In contrast, Test Engineers work on designing and executing tests for electronic devices across various industries. While both roles require technical certifications and work in testing environments, the Probe Card Engineer specializes in semiconductor testing hardware, whereas the Test Engineer's scope is broader, covering multiple electronic products.

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What cities are hiring for Temporary Probe Card Engineer jobs? Cities with the most Temporary Probe Card Engineer job openings:
What are the most commonly searched types of Probe Card Engineer jobs? The most popular types of Probe Card Engineer jobs are:
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Infographic showing various Temporary Probe Card Engineer job openings in the United States as of June 2026, with employment types broken down into 45% Full Time, 53% Part Time, and 2% Contract. Highlights an 99% Physical, and 1% Remote job distribution.
Sr Manager, Process Integration

Sr Manager, Process Integration

FormFactor, Inc.

Beaverton, OR • On-site

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 8 days ago


FormFactor rating

6.0

Company rating: 6.0 out of 10

Based on 6 frontline employees who took The Breakroom Quiz


Job description

Forming Our Future together
FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle - from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor's products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America.
Rooted in our core values - Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People - we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.
Shift:
The regular hours for this position are day shift.
Job Description:
The Sr Manager, Process Integration is responsible for leading process integration engineering within a semiconductor manufacturing environment, with a focus on MEMS and probe card manufacturing. This role ensures that complex, multi-step manufacturing processes, spanning wafer-level fabrication, MEMS processes, assembly, interconnect, and electrical test, are effectively integrated to achieve product performance, yield, quality, and manufacturability targets.
This position operates as both a people leader and technical leader, managing a team of integration engineers while driving cross-functional alignment across Process, Equipment, Product, Yield, Quality, and Operations teams. The role is accountable for integration performance at the product or site level and plays a key role in new product introduction (NPI), ramp readiness, and continuous improvement initiatives.
Key Responsibilities:
Process Integration Ownership
  • Own and drive end-to-end process integration across probe card manufacturing flows, ensuring alignment between unit processes and product-level requirements.

  • Define, maintain, and continuously improve integrated process flows, including critical steps, process interactions, and control strategies.

  • Identify integration risks, process interactions, and trade-offs impacting yield, performance, and manufacturability.

Yield, Quality & Performance Management
  • Lead integration-level yield improvement initiatives using data-driven analysis and structured problem solving (e.g., DMAIC, 8D).

  • Drive root cause identification and resolution of complex yield excursions and defect mechanisms across multiple process modules.

  • Ensure process capability, defect reduction, and cycle time improvements across integrated manufacturing flows.

New Product Introduction (NPI) & Manufacturing Readiness
  • Lead integration activities for NPI, pilot builds, and ramp to high-volume manufacturing.

  • Establish integration readiness criteria, including process stability, control plans, qualification strategies, and manufacturability assessments.

  • Partner with Product and R&D teams to ensure Design for Manufacturability (DfM) and Design for Reliability (DfR) alignment.

Cross-Functional Leadership
  • Serve as the technical integration interface across Process Engineering, Equipment Engineering, Product Engineering, Manufacturing, and Quality teams.

  • Drive resolution of cross-module process interactions and constraints impacting product performance.

  • Influence integration strategy, roadmap, and best practices across site or product line.

People Leadership & Team Development
  • Manage, coach, and develop a team of process integration engineers.

  • Set clear performance expectations, priorities, and deliverables aligned to manufacturing goals.

  • Build team capability in systems thinking, structured problem solving, and semiconductor process integration.

Process Control, Documentation & Compliance
  • Ensure robust process control strategies, including SPC, FDC, and monitoring methodologies.

  • Drive standardization of process flows, specifications, and documentation.

  • Ensure effective change management, traceability, and compliance with internal and external quality standards.

Continuous Improvement & Operational Excellence
  • Lead cross-functional continuous improvement initiatives focused on yield, throughput, cost, and process capability.

  • Promote best practice sharing across modules, products, and sites.

  • Support manufacturing scalability and operational readiness for volume production.

Skills:
Change Management, Change Management, Cross-Functional Leadership, Data Analysis, Defect Identification, Defect Reduction, Design of Experiments (DOE), Electrical Testing, Electroplating, Etching, Manufacturing Execution Systems (MES), Metrology, Microelectromechanical Systems (MEMS), New Product Introduction (NPI), People Leadership, Photolithography, Probe Cards, Process Control, Process Integration, Root Cause Analysis (RCA), Semiconductor Manufacturing, Stakeholder Management, Statistical Process Control (SPC), Team Development, Technology Transfer {+ 1 more}
Education & Experience:
Minimum of 10 years of related experience with a Bachelor's degree; or 8 years and a Master's degree; or a PhD with 5 years experience; or equivalent work experience | Required
Pay Range:
$138,900.00 - $182,280.00
Pay Range Explained:
This role in Beaverton, Oregon pays between $138,900.00 and $182,280.00 per year, depending on your experience, skills, and background. Pay may vary in other locations. We offer a full benefits package, including medical, dental, vision, life insurance, disability coverage, a 401(k) with company match, employee stock purchase plan (ESPP), and paid time off. You'll also be eligible for quarterly profit-sharing bonuses and flexible spending or savings accounts.
Equal Employment Opportunity Statement
FormFactor is an equal opportunity employer. FormFactor complies with all national, state, and local laws that seek to promote equal opportunities for any applicant or employee without regard to age, race, color, gender, gender identity/expression, national origin, sexual orientation, religion, disability, marital status, pregnancy or related condition, military service, or any other legally protected characteristics. These protections apply to all aspects of employment, including but not limited to, recruitment, hiring, training, promotions, and compensation.
For roles that are designated as remote-eligible, employees cannot be located in: AL, AK, AR, DE, GA, HI, IL, IA, KY, LA, ME, MD, MS, MO, NE, NV, NJ, NM, ND, OK, PA, RI, SC, SD, TN, WV, WI, WY. This list is continuously evolving and being updated, please check back with us if the state you live in is on the exclusion list. A role is remote-eligible only when it is listed as "Remote" in the job location.