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Fib Tem Failure Analysis Jobs (NOW HIRING)

Experience : 8-10 years' related experience operating SEM/FIB/TEM failure analysis tools. * Skills : * Strong experience in SEM and FIB techniques and toolsets, including tool ownership experience to ...

Failure Analysis Technician At TSMC Arizona, brilliance can ignite a world of innovation and launch ... FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis and reporting • TEM ...

Failure Analysis Technician At TSMC Arizona, brilliance can ignite a world of innovation and launch ... Operating FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis and reporting TEM ...

Failure Analysis Technician A job at TSMC Arizona offers an opportunity to work at the most ... Operate Dual-Beam FIB to prepare TEM samples or conduct materials analysis (e.g., SIMS & XPS) and ...

Failure Analysis Technician A job at TSMC Arizona offers an opportunity to work at the most ... Operate Dual-Beam FIB to prepare TEM samples or conduct materials analysis (e.g., SIMS & XPS) and ...

... FIB) and DBFIB, scanning electron microscopy (SEM), and transmission electron microscopy (TEM ... failure analysis insights. * Experience developing, maintaining, and improving technical ...

... FIB) and DBFIB, scanning electron microscopy (SEM), and transmission electron microscopy (TEM ... failure analysis insights. * Experience developing, maintaining, and improving technical ...

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Fib Tem Failure Analysis information

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How much do fib tem failure analysis jobs pay per hour?

As of Jun 9, 2026, the average hourly pay for fib tem failure analysis in the United States is $27.94, according to ZipRecruiter salary data. Most workers in this role earn between $24.04 and $29.81 per hour, depending on experience, location, and employer.

What is FIB TEM Failure Analysis?

FIB TEM Failure Analysis is a technique used in the semiconductor and electronics industries to identify and analyze defects or failures in microelectronic devices. FIB stands for Focused Ion Beam, which is used to precisely prepare thin samples from a device, while TEM stands for Transmission Electron Microscopy, which provides high-resolution imaging of the sample’s internal structure. This method allows engineers to investigate issues at the nanoscale, such as material defects, layer delamination, or contamination, helping improve product reliability and manufacturing processes.

What is the difference between Fib Tem Failure Analysis vs Fib Tem Quality Control Inspector?

AspectFib Tem Failure AnalysisFib Tem Quality Control Inspector
Primary RoleInvestigates and determines causes of product failures and defects in fiber-tempered materialsInspects and monitors fiber-tempered products to ensure quality standards are met
Required SkillsAnalytical skills, failure investigation techniques, knowledge of fiber-tempered materialsAttention to detail, inspection procedures, quality standards knowledge
Work EnvironmentLaboratories, failure analysis labs, manufacturing plantsProduction lines, quality control labs, manufacturing facilities

Fib Tem Failure Analysis focuses on diagnosing why fiber-tempered products fail, while Fib Tem Quality Control Inspector ensures products meet quality standards during production. Both roles require knowledge of fiber-tempered materials but differ in their primary objectives and daily tasks.

What are some common challenges faced by professionals in FIB TEM Failure Analysis, and how can they be addressed?

Professionals in FIB TEM Failure Analysis often encounter challenges such as sample preparation difficulties, minimizing artifact introduction, and interpreting complex microstructural data. Working with delicate or minute samples requires precision and patience, and unexpected results can demand creative troubleshooting. Collaboration with process engineers and design teams is essential to accurately correlate analysis findings with device performance issues. Continuous training on advanced instrumentation and staying updated with new analytical techniques can help address these challenges and improve problem-solving efficiency.

What are the key skills and qualifications needed to thrive as a FIB TEM Failure Analysis Engineer, and why are they important?

To thrive as a FIB TEM Failure Analysis Engineer, you need a solid background in materials science, semiconductor physics, and hands-on experience with Focused Ion Beam (FIB) and Transmission Electron Microscopy (TEM) systems, often supported by a relevant engineering or science degree. Proficiency in operating analytical tools such as FIB, TEM, SEM, and associated software, as well as familiarity with sample preparation techniques, is essential. Strong analytical thinking, attention to detail, and effective communication skills help distinguish top performers in this role. Mastery of these skills ensures accurate identification of root causes for device failures, enabling timely solutions and improvements in semiconductor manufacturing processes.
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What states have the most Fib Tem Failure Analysis jobs? States with the most job openings for Fib Tem Failure Analysis jobs include:
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Experienced Process Technician

skywater

Austin, TX • On-site

Other

This job post has expired today. Applications are no longer accepted.


Job description

Primary Objective: 

The Failure Analysis Technician provides support for SkyWater sites by performing routine failure analysis and supporting QA/QC evaluations. This role delivers timely, accurate failure analysis results to engineering and operations teams, and collaborates with crossfunctional groups to help identify and resolve Fab process and yield issues.

Major Areas of Accountability:

  • Perform high volume routine SEM, FIB, TEM and analytical analysis.
  • Manage assigned samples within the imaging queue and complete highpriority requests within required turnaround times.
  • Summarize results in a report and present via Teams or in-person meetings.
  • Participate in training and crosstraining across failure analysis techniques and toolsets to support team flexibility and workload demands.
  • Schedule necessary PMs on imaging tools to follow Audit requirements.
  • Assist with basic troubleshooting of failure analysis tools to ensure all lab equipment is operational.
  • Operate within established lab safety, quality, and environmental procedures.
  • Collaborate with cross-functional teams to identify and resolve Fab process issues.
  • Be able to work in a team environment and coordinate tool utilization to maximize tool output.

Required Qualifications:

  • Education: Associate degree 
  • Experience: 8-10 years’ related experience operating SEM/FIB/TEM failure analysis tools.
  • Skills:
    • Strong experience in SEM and FIB techniques and toolsets, including tool ownership experience to complete PMs and troubleshoot minor tool issues.
    • Strong experience with TEM techniques preferred.
    • Semiconductor industry experience.
    • Strong organizational and multitasking skills with attention to accuracy and timely execution.
    • Ability to work in a team environment and support shared laboratory resources.
    • Strong computer skills, including Microsoft Office (Outlook, Word, Excel, PowerPoint).
    • Good communication and problem-solving skills.
  • This position is full-time working second shift – Wednesday to Saturday from 3pm to 1:30am. 

Physical Requirements:

  • This position may require sitting and standing for extended periods.