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Fib Tem Failure Analysis Jobs (NOW HIRING)

TSMC

Failure Analysis Technician F21

Phoenix, AZ

Failure Analysis Technician At TSMC Arizona, brilliance can ignite a world of innovation and launch ... Operating FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis and reporting TEM ...

TSMC

Failure Analysis Technician F21

Phoenix, AZ · On-site

Failure Analysis Technician At TSMC Arizona, brilliance can ignite a world of innovation and launch ... FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis and reporting • TEM ...

TSMC

Failure Analysis Technician

Phoenix, AZ · On-site

Failure Analysis Technician A job at TSMC Arizona offers an opportunity to work at the most ... Operate Dual-Beam FIB to prepare TEM samples or conduct materials analysis (e.g., SIMS & XPS) and ...

TSMC

Failure Analysis Technician

Phoenix, AZ · On-site

Failure Analysis Technician A job at TSMC Arizona offers an opportunity to work at the most ... Operate Dual-Beam FIB to prepare TEM samples or conduct materials analysis (e.g., SIMS & XPS) and ...

Coherent Corp.

Failure Analysis Engineer

Sherman, TX · On-site

... FIB) and DBFIB, scanning electron microscopy (SEM), and transmission electron microscopy (TEM ... failure analysis insights. * Experience developing, maintaining, and improving technical ...

Coherent

Failure Analysis Engineer

Sherman, TX

... FIB) and DBFIB, scanning electron microscopy (SEM), and transmission electron microscopy (TEM ... failure analysis insights. * Experience developing, maintaining, and improving technical ...

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Fib Tem Failure Analysis information

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How much do fib tem failure analysis jobs pay per hour?

As of Jun 10, 2026, the average hourly pay for fib tem failure analysis in the United States is $27.94, according to ZipRecruiter salary data. Most workers in this role earn between $24.04 and $29.81 per hour, depending on experience, location, and employer.

What is FIB TEM Failure Analysis?

FIB TEM Failure Analysis is a technique used in the semiconductor and electronics industries to identify and analyze defects or failures in microelectronic devices. FIB stands for Focused Ion Beam, which is used to precisely prepare thin samples from a device, while TEM stands for Transmission Electron Microscopy, which provides high-resolution imaging of the sample’s internal structure. This method allows engineers to investigate issues at the nanoscale, such as material defects, layer delamination, or contamination, helping improve product reliability and manufacturing processes.

What is the difference between Fib Tem Failure Analysis vs Fib Tem Quality Control Inspector?

AspectFib Tem Failure AnalysisFib Tem Quality Control Inspector
Primary RoleInvestigates and determines causes of product failures and defects in fiber-tempered materialsInspects and monitors fiber-tempered products to ensure quality standards are met
Required SkillsAnalytical skills, failure investigation techniques, knowledge of fiber-tempered materialsAttention to detail, inspection procedures, quality standards knowledge
Work EnvironmentLaboratories, failure analysis labs, manufacturing plantsProduction lines, quality control labs, manufacturing facilities

Fib Tem Failure Analysis focuses on diagnosing why fiber-tempered products fail, while Fib Tem Quality Control Inspector ensures products meet quality standards during production. Both roles require knowledge of fiber-tempered materials but differ in their primary objectives and daily tasks.

What are some common challenges faced by professionals in FIB TEM Failure Analysis, and how can they be addressed?

Professionals in FIB TEM Failure Analysis often encounter challenges such as sample preparation difficulties, minimizing artifact introduction, and interpreting complex microstructural data. Working with delicate or minute samples requires precision and patience, and unexpected results can demand creative troubleshooting. Collaboration with process engineers and design teams is essential to accurately correlate analysis findings with device performance issues. Continuous training on advanced instrumentation and staying updated with new analytical techniques can help address these challenges and improve problem-solving efficiency.

What are the key skills and qualifications needed to thrive as a FIB TEM Failure Analysis Engineer, and why are they important?

To thrive as a FIB TEM Failure Analysis Engineer, you need a solid background in materials science, semiconductor physics, and hands-on experience with Focused Ion Beam (FIB) and Transmission Electron Microscopy (TEM) systems, often supported by a relevant engineering or science degree. Proficiency in operating analytical tools such as FIB, TEM, SEM, and associated software, as well as familiarity with sample preparation techniques, is essential. Strong analytical thinking, attention to detail, and effective communication skills help distinguish top performers in this role. Mastery of these skills ensures accurate identification of root causes for device failures, enabling timely solutions and improvements in semiconductor manufacturing processes.
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Fib Tem Failure Analysis jobs near you

Failure Analysis Technician F21

TSMC

Phoenix, AZ

Other

Posted 17 days ago

TSMC rating

8.2

Company rating: 8.2 out of 10

Based on 19 frontline employees who took The Breakroom Quiz

37th of 139 rated electronics manufacturers

Job description

Failure Analysis Technician

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world's most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona is looking for a Failure Analysis Technician to join our 5-nanometer fab, located in sunny Phoenix, Arizona. As a Failure Analysis Technician, you will demonstrate a strong sense of chip failure analysis and possess an attitude that embodies our core values - Integrity, Commitment, Innovation and Customer Trust.

TSMC Arizona's Product Failure Analysis is responsible for chip failure analysis to reinforce our process robustness and ensure high yield and quality of the wafers.

Job Description:

Your main responsibilities include:

          Operating FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis and reporting

          TEM sample preparation will also include sample pre-treatment such as site marking, de-layering, and other necessary steps.

          Chemicals handling in a safe manner with PPE is required.

          Collecting and organizing data, and reporting to engineers

          Assisting engineers with analytical method development.

          Maintaining laboratory housekeeping (6S) environment and protocols.

          Supporting Fab manufacturing operations and being part of our teams' on-call schedule.

Minimum Qualifications:

Applicants must be legally eligible to work in the United States and have:

          Associate degree (A.A.S.) or Bachelors degree at a Science/Engineering/Technology school or the equivalent education is preferred but not required.

          Experience in TEM sample preparation for semiconductor devices in advanced process nodes (<28nm) is preferred but not required.

          TEM analysis experience/skill in HR-STEM imaging and EDS analysis is preferred but not required.

          Able to work independently and prioritize your tasks on-hand to meet deadlines.

          Must be a team player and have a positive attitude and strong work ethic.

          Be able to handle pressure in a fast-paced working environment.

          Be able to work night and weekend shifts when assigned, and work overtime if needed.

          May be required to work in a clean room environment (Near-line FIB/TEM).

          Basic PC skills (MS Windows OS and MS Office) are required.             

Work Location: Phoenix, AZ

Training Location: Phoenix, AZ

Travel: 0%

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