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Semiconductor Failure Analysis Jobs (NOW HIRING)

Gain hands-on experience in semiconductor failure analysis workflows * Develop understanding of electrical fault isolation and physical analysis techniques * Learn to interpret I-V curve and ATE test ...

We are adding a team member to perform failure analysis on mixed-signal IC devices. Are you a ... Knowledge of semiconductor device physics. * Excellent analytical skills and problem-solving ...

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Semiconductor Failure Analysis information

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$15

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How much do semiconductor failure analysis jobs pay per hour?

As of Jun 6, 2026, the average hourly pay for semiconductor failure analysis in the United States is $27.94, according to ZipRecruiter salary data. Most workers in this role earn between $24.04 and $29.81 per hour, depending on experience, location, and employer.

What is semiconductor failure analysis?

Semiconductor failure analysis is the process of investigating and determining the root causes of defects or malfunctions in semiconductor devices, such as microchips and integrated circuits. This involves various techniques like microscopy, electrical testing, and material analysis to pinpoint where and why a failure has occurred. Failure analysis is crucial in improving product reliability, guiding design improvements, and supporting quality control in semiconductor manufacturing. Professionals in this field work closely with engineers and manufacturers to identify issues, prevent future failures, and enhance overall device performance.

What are the key skills and qualifications needed to thrive as a Semiconductor Failure Analysis Engineer, and why are they important?

To thrive as a Semiconductor Failure Analysis Engineer, you need a solid background in electrical engineering, materials science, or physics, often supported by a relevant bachelor’s or master’s degree. Familiarity with analytical tools like scanning electron microscopes (SEM), focused ion beam (FIB) systems, and failure analysis software is typically required, along with knowledge of industry standards. Strong problem-solving skills, attention to detail, and effective communication are essential soft skills for interpreting results and collaborating with cross-functional teams. These competencies ensure accurate identification of root causes and help drive improvements in device reliability and manufacturing processes.

What is the difference between Semiconductor Failure Analysis vs Semiconductor Test Engineer?

AspectSemiconductor Failure AnalysisSemiconductor Test Engineer
CredentialsEngineering degree, certifications in failure analysisEngineering degree, certifications in testing and validation
Work EnvironmentLaboratories, cleanrooms, failure analysis labsProduction lines, testing labs, R&D facilities
Industry UsageUsed to identify and troubleshoot device failuresUsed to verify device performance and quality

Semiconductor Failure Analysts focus on diagnosing and troubleshooting device failures using specialized techniques, while Semiconductor Test Engineers develop and execute testing procedures to ensure device quality. Both roles require engineering backgrounds and work closely within the semiconductor industry, but their primary objectives differ: failure analysis aims to identify issues, whereas testing ensures product reliability.

What are some common challenges faced in a Semiconductor Failure Analysis role, and how can they be addressed?

Professionals in Semiconductor Failure Analysis often encounter challenges such as identifying root causes of complex failures, working with highly miniaturized and sensitive devices, and keeping up with evolving semiconductor technologies. Addressing these challenges requires a methodical approach to testing and analysis, strong collaboration with design and manufacturing teams, and ongoing training on the latest analytical techniques and tools. Developing effective communication skills is also crucial, as findings must be clearly reported to both technical and non-technical stakeholders to guide corrective actions.
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Infographic showing various Semiconductor Failure Analysis job openings in the United States as of May 2026, with employment types broken down into 87% Full Time, and 13% Part Time. Highlights an 90% Physical, 2% Hybrid, and 8% Remote job distribution, with an average salary of $58,107 per year, or $27.9 per hour.
Failure Analysis Engineer, Microelectronics (Starlink)

Failure Analysis Engineer, Microelectronics (Starlink)

SpaceX

Bastrop, TX

Other

Posted 27 days ago


SpaceX rating

8.7

Company rating: 8.7 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

13th of 59 rated aerospace companies


Job description

FAILURE ANALYSIS ENGINEER, MICROELECTRONICS (STARLINK)

Starlink is SpaceX's ambitious goal to bring high-quality internet to the globe by building a constellation of thousands of satellites in low Earth orbit (LEO) using our Falcon 9 and Starship reusable rockets. We are developing millions of devices for end users to link our customers to our satellites.

As a Failure Analysis Engineer on the Starlink team, you will perform detailed root cause failure analysis on microelectronic components and packaging to support high-volume manufacturing, qualification, and field returns. You will leverage advanced laboratory tools and physics-of-failure techniques to identify failure mechanisms and drive corrective actions that improve the reliability of our satellite constellation and user terminals.

RESPONSIBILITIES:

  • Own end-to-end root cause failure analysis investigations on microelectronics failing in manufacturing, test, and field, from initial failure characterization through final corrective action verification
  • Conduct advanced electrical fault isolation and characterization using curve trace, TDR, RF characterization, Lock-in Thermography, OBIRCH, EBIRCH, EBAC, nanoprobing, and related techniques to precisely localize defects in complex devices
  • Perform advanced physical failure analysis using SEM, FIB, EDS, SAM, cross-sectioning, and related techniques to identify failure mechanisms in silicon, packaging, and interconnects
  • Apply physics-of-failure principles and deep knowledge of semiconductor failure modes (electromigration, thermal fatigue, delamination, EOS/ESD, solder joint fatigue, etc.) to determine root causes
  • Drive corrective actions by working directly with silicon design, packaging, and manufacturing teams to implement and validate design or process changes based on FA findings
  • Author detailed technical reports documenting failure modes, root cause conclusions, supporting data, and corrective action effectiveness
  • Develop and improve failure analysis techniques and workflows to support new packaging technologies and advanced materials

BASIC QUALIFICATIONS:

  • Bachelor's degree in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline 
  • 2+ years of hands-on experience in microelectronics failure analysis or materials characterization (internship experience is applicable)

PREFERRED SKILLS AND EXPERIENCE:

  • Master's or PhD in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline with a focus on microelectronics or failure analysis
  • Direct experience with failure analysis tools and techniques (SEM, FIB, EDS, cross-sectioning, fault isolation, or equivalent)
  • Strong understanding of semiconductor physics and common microelectronics failure mechanisms (electromigration, thermal fatigue, delamination, solder joint fatigue, electrical overstress/ESD, etc.)
  • Proficiency with advanced FA tools including SEM, FIB, SAM, and EDS
  • Hands-on experience in electrical characterization and fault isolation techniques such as IV curves, RF/VNA measurement, LIT, OBIRCH, EBIRCH, EBAC, nanoprobing, photon emission, or voltage contrast
  • Experience applying JEDEC and AEC reliability test standards and physics-of-failure methodologies to root cause investigations
  • Experience analyzing complex datasets with Python, JMP, or similar tools
  • Excellent problem-solving, communication, and technical writing skills

ADDITIONAL REQUIREMENTS:

  • Ability to work overtime and weekends as needed
  • Ability to work in a cleanroom or ESD-controlled environment when required

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