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Fib Tem Failure Analysis Jobs in Georgia (NOW HIRING)

Absolics Inc

Process Integration Engineer

Covington, GA · On-site

Familiarity with metrology and failure analysis techniques across the flow (SEM, FIB cross-section, CD-SEM, overlay metrology, electrical test) * Understanding of registration, overlay, and CD budget ...

Absolics Inc

Process Integration Engineer

Covington, GA · On-site

Familiarity with metrology and failure analysis techniques across the flow (SEM, FIB cross-section, CD-SEM, overlay metrology, electrical test) * Understanding of registration, overlay, and CD budget ...

Allegro MicroSystems

$115K - $170K/yr

Familiarity with failure analysis techniques (SEM, EDX, FIB). * Exceptional ability to communicate complex technical issues to both internal executives and external foundry partners. * A "resident ...

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Fib Tem Failure Analysis information

What is FIB TEM failure analysis?

FIB TEM Failure Analysis is a technique used in the semiconductor and electronics industries to identify and analyze defects or failures in microelectronic devices. FIB stands for Focused Ion Beam, which is used to precisely prepare thin samples from a device, while TEM stands for Transmission Electron Microscopy, which provides high-resolution imaging of the sample’s internal structure. This method allows engineers to investigate issues at the nanoscale, such as material defects, layer delamination, or contamination, helping improve product reliability and manufacturing processes.

What are the key skills and qualifications needed to thrive as a FIB TEM failure analysis engineer?

To thrive as a FIB TEM Failure Analysis Engineer, you need a solid background in materials science, semiconductor physics, and hands-on experience with Focused Ion Beam (FIB) and Transmission Electron Microscopy (TEM) systems, often supported by a relevant engineering or science degree. Proficiency in operating analytical tools such as FIB, TEM, SEM, and associated software, as well as familiarity with sample preparation techniques, is essential. Strong analytical thinking, attention to detail, and effective communication skills help distinguish top performers in this role. Mastery of these skills ensures accurate identification of root causes for device failures, enabling timely solutions and improvements in semiconductor manufacturing processes.

What are some common challenges faced by professionals in FIB TEM failure analysis, and how can they be addressed?

Professionals in FIB TEM Failure Analysis often encounter challenges such as sample preparation difficulties, minimizing artifact introduction, and interpreting complex microstructural data. Working with delicate or minute samples requires precision and patience, and unexpected results can demand creative troubleshooting. Collaboration with process engineers and design teams is essential to accurately correlate analysis findings with device performance issues. Continuous training on advanced instrumentation and staying updated with new analytical techniques can help address these challenges and improve problem-solving efficiency.

What is the difference between Fib Tem Failure Analysis vs Fib Tem Quality Control Inspector?

AspectFib Tem Failure AnalysisFib Tem Quality Control Inspector
Primary RoleInvestigates and determines causes of product failures and defects in fiber-tempered materialsInspects and monitors fiber-tempered products to ensure quality standards are met
Required SkillsAnalytical skills, failure investigation techniques, knowledge of fiber-tempered materialsAttention to detail, inspection procedures, quality standards knowledge
Work EnvironmentLaboratories, failure analysis labs, manufacturing plantsProduction lines, quality control labs, manufacturing facilities

Fib Tem Failure Analysis focuses on diagnosing why fiber-tempered products fail, while Fib Tem Quality Control Inspector ensures products meet quality standards during production. Both roles require knowledge of fiber-tempered materials but differ in their primary objectives and daily tasks.

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What job categories do people searching Fib Tem Failure Analysis jobs in Georgia look for?

The top searched job categories for Fib Tem Failure Analysis jobs in Georgia are:

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Fib Tem Failure Analysis jobs near you

Dielectric and Polymer Materials Engineer

Absolics Inc

Covington, GA • On-site

$90K - $150K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Re-posted 28 days ago

Job description

Job Title: R&D Engineer - Dielectric and Polymer Materials Expert for Advanced Packaging applications

Location: Covington, GA

Job Type: Full-Time

 

About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.

Job Description:

You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization. In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly. Requirements. This role requires both materials science depth and process integration awareness. You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.

 

Key Responsibilities:

  • Characterize dielectric film properties (electrical, thermal, mechanical) and correlate to process and reliability outcomes
  • Select, qualify, and support process window definition of advanced packaging dielectrics (example ABF, PBO, PSPI, polyimide, inorganic films) for RDL build-up
  • Support determination of optimal processing conditions for these materials across the various process teams critical to the overall fabrication process flow
  • Evaluate emerging dielectric materials and technologies (e.g., low-Dk/Df, glass core compatible systems) for roadmap fit
  • Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
  • Investigate and resolve adhesion, delamination, cracking, or CTE-mismatch failures through materials and process analysis
  • Run reliability qualification testing (HAST, TCT) and interpret dielectric-driven failure mechanisms

Required Skills:

  • Hands-on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCB
  • Deep knowledge of dielectric patterning approaches: photoexposure, develop, and cure sequences for photosensitive materials; or lamination and laser drill for non-photosensitive films
  • Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
  • Understanding of dielectric-to-metal adhesion, CTE mismatch, and stress management in multilayer stacks
  • Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
  • Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms
  • Fluent in English; proficiency in Korean is a plus.

Preferred Skills

  • Direct experience with glass core or glass interposer dielectric process integration
  • Deep Familiarity with low-Dk/low-Df materials targeting high-frequency and AI/HPC applications
  • Knowledge of plasma-enhanced CVD or PVD inorganic dielectrics for thin-film packaging
  • Experience with CMP of dielectric films in damascene or hybrid bonding contexts
  • Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB-SEM, TEM, laminography)
  • Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
  • Track record of material supplier engagement and collaborative efforts for material testing and qualification
  • Publication record or patent activity in dielectric materials for packaging is a plus

Education

  • Ph.D. in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or related field preferred
  • M.S. with 3+ years of relevant industry or research experience considered

Benefits: 

  • 401K 6% matching (NO vesting period)
  • Healthcare 100% support (Health, Dental, Vision)
  • Life, STD, LTD 100 % support
  • Cell phone allowance
  • PTO and self-development

SALARY:

  • $90,000 - $150,000

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