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Job Details:Job Description: 

The Hard IP and Test Chip Development team, within Intel's Central Engineering Group, is responsible for delivering industrydefining analog and mixedsignal IP for Intel's Client, Datacenter, AI and Foundry customers. The IO team owns high-speed serial IO and die-to-die interfaces across multiple advanced process nodes. We are seeking an experienced Senior Analog Design Engineer to join our engineering team. The successful candidate will be responsible for designing, developing, and optimizing analog and mixed-signal integrated circuits for various applications. This role requires deep technical expertise in analog circuit design and the ability to lead complex projects from concept to production.
Key Responsibilities
Design and Development
Design and simulate analog and mixed-signal circuits including amplifiers, data converters, voltage regulators, PLLs, and other analog building blocks.
Develop circuit architectures and perform detailed transistor-level design.
Create and optimize layouts working closely with layout engineers.
Perform circuit analysis, simulation, and verification using industry-standard tools (Cadence, Synopsys, etc.) using approaches that enable automation and take advantage of available AI-supported solutions.
Technical Leadership
Lead analog design projects from specification to silicon validation.
Mentor junior engineers and provide technical guidance.
Collaborate with cross-functional teams including architecture, logic, verification, physical design, layout, post-silicon manufacturing and validation teams, and SOC partners.
Drive design reviews and ensure adherence to design methodologies.
Facilitate design development and convergence across global teams designing concurrently in numerous process nodes. You will be expected to work with teams in the US and India to ensure design interoperability and solve problems to deliver designs that meet quality and KPI goals.
Validation and Optimization
Develop test plans and oversee silicon characterization.
Debug and resolve design issues during pre and post-silicon phases.
Optimize designs for performance, power, and area requirements.
Ensure designs meet specifications and industry standards.

You are a competitive candidate for this job if you possess these skills and competencies:

. Good communication and documentation skills, with a collaborative and proactive work style.

. Demonstrated ability to work effectively in cross-functional, global teams and contribute to technical reviews.
. Strong analytical thinking, hands-on debugging skills, and an eagerness to learn and share expertise within the team.

In this role, you will drive the definition, design, and verification of high-performance analog blocks, IP top level designs and subsystems (floor planning, power delivery, bump maps), collaborating closely with system architects, logic designers, and layout engineers. The ideal candidate is self-driven, detail-oriented, and passionate about analog design in high-speed IO and die-to-die systems. You will facilitate technical discussions, hold design reviews, and play an active role in post-silicon validation and performance optimization. The position also involves providing guidance to layout engineers and mentoring junior analog designers as needed. Strong problem-solving skills, teamwork, and a willingness to share knowledge and collaborate across disciplines are essential. This role offers an opportunity to develop innovative designs and be part of a highly experienced IO and die-to-die design team focused on delivering next-generation high-speed interconnect solutions. This is an on-site role and you are expected to work in the office at least 4 days per week.

Qualifications:

Minimum Qualifications
Bachelor's degree in Electrical Engineering, Electronics Engineering, or a related field.
6+ years of experience in analog/mixed-signal circuit design for high-speed SerDes or similar applications.

Your experience must include:

• Proven experience in one or more of the following areas: PLL, CDR, CTLE, DFE, ADC, RX AFE, Transmitter (TX), Power Delivery design, IP floor planning, IP top level performance simulation, signal integrity analysis.
• High-speed IO calibration and training algorithms.
• High-speed communication standards such as UCIE and PCIe (Gen5/Gen6/Gen7).
• Core analog design principles, including noise, linearity, matching, and stability.
• Hands-on experience with advanced FinFET CMOS process technologies.
• Analog design and simulation tools such as Cadence Virtuoso/ADE, HSPICE, or equivalent.
• Post-silicon validation, lab measurements, and debug of analog circuits.

Preferred Qualifications

• Master's degree in Electrical Engineering, Electronics Engineering, or a related discipline.
• 7+ years of experience in analog design for high-speed SerDes and/or die-to-die applications.
• In-depth understanding of transmitter and receiver design, CDR loops, and equalization techniques.
• Exposure to next-generation high-speed standards such as PCIe 6.0, 800G Ethernet, or JESD.
• Experience with Verilog-A modeling, MATLAB simulations, and automation scripting (e.g., Python, Tcl).
• Strong understanding of signal integrity concepts, channel modeling, and system-level link analysis.
• Background in standard and advanced package technologies.

Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:US, Oregon, HillsboroBusiness group:The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). The team focuses on customer-driven, end-to-end solutions with short development cycles to deliver measurable business impact across Intel's product and foundry businesses.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $190,610.00-269,100.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.