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Remote Semiconductor Packaging Jobs (NOW HIRING)

... semiconductor, advanced packaging, solar manufacturing, and data center projects. This role is ... This can be a fully remote job. The successful candidate will work closely with the ...

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Remote Semiconductor Packaging information

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$12

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$27

How much do remote semiconductor packaging jobs pay per hour?

As of Sep 6, 2026, the average hourly pay for remote semiconductor packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What is remote semiconductor packaging?

Remote semiconductor packaging refers to the process of designing, developing, or managing the packaging of semiconductor devices from a remote location, often using digital tools and collaboration software. This job involves tasks such as evaluating materials, designing package layouts, and ensuring thermal and electrical performance, all coordinated online. Remote professionals in this role frequently work with global teams, and may be responsible for tasks ranging from simulation to quality assurance. As the semiconductor industry becomes more globalized and digital, remote packaging roles are increasingly common and essential.

What are the key skills and qualifications needed to thrive as a remote semiconductor packaging engineer?

To excel as a Remote Semiconductor Packaging Engineer, you need a solid background in materials science, electronics, and mechanical engineering, usually supported by a relevant engineering degree. Familiarity with CAD tools like AutoCAD or SolidWorks, semiconductor process simulation software, and industry standards such as IPC or JEDEC is vital. Strong problem-solving abilities, attention to detail, and effective remote communication are essential soft skills for collaborating across global teams. These competencies enable engineers to design robust, efficient packaging solutions while maintaining quality and productivity from a distance.

What are some common challenges faced by professionals in remote semiconductor packaging roles, and how can they be addressed?

Professionals in remote semiconductor packaging often face challenges related to cross-functional collaboration, as they must coordinate with design, manufacturing, and QA teams across different time zones and locations. Effective communication using collaborative platforms, regular virtual meetings, and clear documentation are essential to ensure alignment. Additionally, remote work requires strong self-management skills to stay updated on process changes and troubleshoot technical issues independently. Proactively seeking feedback and engaging with team forums can help overcome isolation and keep projects on track.

What is the difference between Remote Semiconductor Packaging vs Remote Semiconductor Test Engineer?

AspectRemote Semiconductor PackagingRemote Semiconductor Test Engineer
CredentialsTypically requires engineering degrees, certifications in packaging processesRequires engineering degrees, certifications in testing methodologies
Work EnvironmentManufacturing facilities, labs, or remote design officesTesting labs, design offices, or remote testing setups
Industry UsageUsed in semiconductor manufacturing, assembly, and packaging companiesUsed in semiconductor testing, quality assurance, and validation firms

Remote Semiconductor Packaging focuses on assembling and protecting semiconductor devices, often involving physical processes and manufacturing environments. In contrast, Remote Semiconductor Test Engineers specialize in testing and validating semiconductor products to ensure quality. While both roles require technical expertise and engineering credentials, their daily tasks and work environments differ significantly, catering to different stages of semiconductor production.

More about Remote Semiconductor Packaging jobs

What cities are hiring for Remote Semiconductor Packaging jobs?

Cities with the most Remote Semiconductor Packaging job openings:

What are the most commonly searched types of Semiconductor Packaging jobs?

The most popular types of Semiconductor Packaging jobs are:

What states have the most Remote Semiconductor Packaging jobs?

States with the most job openings for Remote Semiconductor Packaging jobs include:

What job categories do people searching Remote Semiconductor Packaging jobs look for?

The top searched job categories for Remote Semiconductor Packaging jobs are:

Infographic showing various Remote Semiconductor Packaging job openings in the United States as of August 2026, with employment types broken down into 83% Full Time, 12% Part Time, 1% Temporary, 2% Contract, and 2% Nights. Highlights an 96% Physical, 1% Hybrid, and 3% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.

Pick & Place Integration Manufacturing Engineer

Formfactor

Livermore, CA • On-site, Remote

$110K - $145K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 9 days ago


FormFactor rating

6.7

Company rating: 6.7 out of 10

Based on 8 frontline employees who took The Breakroom Quiz


Job description

Forming Our Future together

FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle - from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor's products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America.

Rooted in our core values - Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People - we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.

Shift:

The regular hours for this position are day shift.

Job Description:

The Pick & Place Integration Manufacturing Engineer will support the development, qualification, and implementation of Tight Pitch manufacturing processes for Gelly Gang products. This position will work closely with the Wafer Engineering team to develop new Tight Pitch designs and convert existing products to the new manufacturing platform. The engineer will play a key role in improving product quality, manufacturing efficiency, and cycle time while supporting VPS strategic initiatives.

Key Responsibilities:

  • Partner with the Wafer Engineering team to support the development of new Tight Pitch products.

  • Lead the conversion of existing Gelly Gang products to Tight Pitch manufacturing.

  • Develop, optimize, and sustain semiconductor manufacturing processes to improve yield, quality, and productivity.

  • Support process qualification, validation, and implementation for new and existing products.

  • Establish and maintain robust process controls using SPC, process capability analysis, and data-driven decision making.

  • Analyze manufacturing data, identify process improvements, and implement corrective actions.

  • Create and maintain engineering documentation, including work instructions, process specifications, FMEAs, control plans, and manufacturing procedures.

  • Support engineering change implementation and new product introductions (NPI).

  • Train manufacturing technicians and operators on new processes, equipment, and best manufacturing practices.

  • Collaborate with Manufacturing, Quality, Product Engineering, and Wafer Engineering to resolve technical issues and drive continuous improvement initiatives.

  • Provide hands-on support during equipment qualification, production ramp, and process troubleshooting.

Skills:

Automation Engineering, Automation Systems, Engineering Process, Manufacturing Engineering, Manufacturing Process Engineering, Mechanical Engineering, Problem Resolution, Semiconductor Engineering, SPC Charts, SPC Implementation, Statistical Process Control (SPC), Troubleshooting, Work Instructions, Writing Work Instructions

Education & Experience:

Minimum of 5 years of related experience with a Bachelor's degree; or 3 years and a Master's degree; or a PhD without experience; or equivalent work| Required

Pay Range:

$110,700.00 - $145,320.00

Pay Range Explained:

This role in Livermore, California pays between $110,700.00 and $145,320.00 per year, depending on your experience, skills, and background. Pay may vary in other locations. We offer a full benefits package, including medical, dental, vision, life insurance, disability coverage, a 401(k) with company match, employee stock purchase plan (ESPP), and paid time off. You'll also be eligible for quarterly profit-sharing bonuses and flexible spending or savings accounts.

Equal Employment Opportunity Statement

FormFactor is an equal opportunity employer. FormFactor complies with all national, state, and local laws that seek to promote equal opportunities for any applicant or employee without regard to age, race, color, gender, gender identity/expression, national origin, sexual orientation, religion, disability, marital status, pregnancy or related condition, military service, or any other legally protected characteristics. These protections apply to all aspects of employment, including but not limited to, recruitment, hiring, training, promotions, and compensation.

For roles that are designated as remote-eligible, employees cannot be located in:AL, AK, AR, DE, GA, HI, IL, IA, KY, LA, ME, MD, MS, MO, NE, NV, NJ, NM, ND, OK, PA, RI, SC, SD, TN, WV, WI, WY. This list is continuously evolving and being updated, please check back with us if the state you live in is on the exclusion list. A role is remote-eligible only when it is listed as "Remote" in the job location.


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