The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
As a Packaging Module Development Engineer, you will: Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future ...
As a Packaging Module Development Engineer, you will: Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future ...
Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving ...
Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving ...
As a Packaging Module Development Engineer, you will: • Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future ...
As a Packaging Module Development Engineer, you will: • Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future ...
$127K - $179K/yr
As a Packaging Module Development Engineer, you will: • Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future ...
$127K - $179K/yr
As a Packaging Module Development Engineer, you will: • Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future ...
Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving ...
Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving ...
Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving ...
Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving ...
... Development Engineer to support current and future Ford vehicle models responsible for the design and release and program application work for Passive Safety Electronics, Restraints Control Module ...
... Development Engineer to support current and future Ford vehicle models responsible for the design and release and program application work for Passive Safety Electronics, Restraints Control Module ...
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process ...
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
Programming/script development with artificial intelligence and machine learning concepts. * Previous related work experience in a semiconductor foundry preferred. Join us at Intel and be part of a ...
Programming/script development with artificial intelligence and machine learning concepts. * Previous related work experience in a semiconductor foundry preferred. Join us at Intel and be part of a ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process ...
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
Programming/script development with artificial intelligence and machine learning concepts. * Previous related work experience in a semiconductor foundry preferred. Join us at Intel and be part of a ...
Programming/script development with artificial intelligence and machine learning concepts. * Previous related work experience in a semiconductor foundry preferred. Join us at Intel and be part of a ...
Programming/script development with artificial intelligence and machine learning concepts. * Previous related work experience in a semiconductor foundry preferred. Join us at Intel and be part of a ...
Programming/script development with artificial intelligence and machine learning concepts. * Previous related work experience in a semiconductor foundry preferred. Join us at Intel and be part of a ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
Dearborn, MI · Hybrid
$99K - $166K/yr
... Development Engineer to support current and future Ford vehicle models responsible for the design and release and program application work for Passive Safety Electronics, Restraints Control Module ...
New
Dearborn, MI · Hybrid
$99K - $166K/yr
... Development Engineer to support current and future Ford vehicle models responsible for the design and release and program application work for Passive Safety Electronics, Restraints Control Module ...
New
$49K - $58.5K
3% of jobs
$58.5K - $68K
4% of jobs
$68K - $77.5K
16% of jobs
$78.4K is the 25th percentile. Wages below this are outliers.
$77.5K - $87K
19% of jobs
The median wage is $90.1K / yr.
$87K - $96.5K
24% of jobs
$103K is the 75th percentile. Wages above this are outliers.
$96.5K - $106K
13% of jobs
$106K - $115.5K
6% of jobs
$115.5K - $125K
5% of jobs
$125K - $134.5K
3% of jobs
$134.5K - $144K
5% of jobs
$144K - $153.5K
1% of jobs
$49K
$96.2K
$153.5K
| Aspect | Module Development Engineer | Hardware Design Engineer |
|---|---|---|
| Required Credentials | Bachelor's or Master's in Electrical Engineering, Computer Engineering, or related fields | Bachelor's or Master's in Electrical Engineering, Computer Engineering, or related fields |
| Work Environment | Design, develop, and test electronic modules and components | Design and develop electronic hardware and circuit layouts |
| Employer & Industry Usage | Electronics, automotive, consumer electronics, telecommunications | Electronics, consumer devices, industrial equipment, telecommunications |
Both roles require similar educational backgrounds and are common in electronics and tech industries. The Module Development Engineer focuses on creating complete modules or subsystems, while the Hardware Design Engineer concentrates on designing individual hardware components and circuits. Understanding these distinctions helps job seekers target the right roles based on their skills and career goals.

Full-time
Medical, Retirement, PTO
Posted 2 days ago
New
8.7
Based on 147 frontline employees who took The Breakroom Quiz
11th of 142 rated electronics manufacturers
The Role and Impact
As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.
Key Responsibilities
• Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equipment characterization, and process control.
• Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
• Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
• Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
• Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.
• Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.
• Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.
• Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
• Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.
• Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.
Behavioral Skills
• Demonstrated ability to solve complex technical problems using structured engineering methodologies.
• Strong written and verbal communication skills with the ability to present technical findings to diverse audiences.
• Ability to influence and collaborate across cross-functional teams in technology development and manufacturing environments.
• Proven ability to mentor and develop engineers and technical team members.
• Demonstrated ability to manage multiple priorities and drive results in a fast-paced environment.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
• Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9+ years of industry experience; OR
• Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 6+ years of industry experience; OR
• PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 5+ years of industry experience.
Industry experience must include the following:
• 5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging,
Preferred Qualifications
• Experience leading first-of-a-kind (FOK) process or equipment development programs.
• Experience introducing new hybrid bonding platforms, manufacturing capabilities, or advanced packaging technologies.
• Knowledge of bond interface defect mechanisms, including void formation, adhesion challenges, contamination effects, and material interactions.
• Experience with alignment-sensitive manufacturing processes and overlay performance optimization.
• Experience with process characterization, metrology, defect inspection, or failure analysis techniques.
• Experience improving equipment capability, throughput, utilization, or process performance in a manufacturing environment.
• Experience collaborating with external equipment suppliers and materials vendors on technology development activities.
• Experience supporting technology transfer from development to manufacturing.
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Manufacturing
10,000+ Employees
Santa Clara, CA, US
1968