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Module Development Engineer Jobs (NOW HIRING)

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

Programming/script development with artificial intelligence and machine learning concepts. * Previous related work experience in a semiconductor foundry preferred. Join us at Intel and be part of a ...

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Module Development Engineer information

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$49K

$96.2K

$153.5K

How much do module development engineer jobs pay per year?

As of Jul 17, 2026, the average yearly pay for module development engineer in the United States is $96,155.00, according to ZipRecruiter salary data. Most workers in this role earn between $79,500.00 and $106,500.00 per year, depending on experience, location, and employer.

What is the difference between Module Development Engineer vs Hardware Design Engineer?

AspectModule Development EngineerHardware Design Engineer
Required CredentialsBachelor's or Master's in Electrical Engineering, Computer Engineering, or related fieldsBachelor's or Master's in Electrical Engineering, Computer Engineering, or related fields
Work EnvironmentDesign, develop, and test electronic modules and componentsDesign and develop electronic hardware and circuit layouts
Employer & Industry UsageElectronics, automotive, consumer electronics, telecommunicationsElectronics, consumer devices, industrial equipment, telecommunications

Both roles require similar educational backgrounds and are common in electronics and tech industries. The Module Development Engineer focuses on creating complete modules or subsystems, while the Hardware Design Engineer concentrates on designing individual hardware components and circuits. Understanding these distinctions helps job seekers target the right roles based on their skills and career goals.

What are the key skills and qualifications needed to thrive as a Module Development Engineer, and why are they important?

To thrive as a Module Development Engineer, you need a strong background in electrical or mechanical engineering, along with experience in module design, testing, and manufacturing processes. Familiarity with CAD software (such as AutoCAD or SolidWorks), simulation tools, and industry-specific standards or certifications (like ISO or Six Sigma) is typically required. Strong analytical thinking, problem-solving abilities, and effective teamwork skills help you excel in cross-functional environments. These competencies ensure high-quality module development, efficient collaboration, and adherence to industry standards for successful project delivery.

What are Module Development Engineers?

Module Development Engineers are professionals who design, develop, and optimize specific modules or components within larger engineering systems, often in industries like semiconductor manufacturing, automotive, or software development. Their work involves collaborating with cross-functional teams, conducting experiments, and integrating new technologies to improve module performance and reliability. They are responsible for troubleshooting issues, implementing design changes, and ensuring that modules meet technical specifications and quality standards.

What are some common challenges a Module Development Engineer faces when integrating new modules into existing systems?

Module Development Engineers often encounter challenges related to compatibility and seamless integration of new modules with legacy systems. Ensuring that new modules meet performance standards without disrupting current workflows requires careful planning and thorough testing. Collaborating closely with cross-functional teams, such as software developers and quality assurance, is essential to identify potential integration issues early. Strong communication skills and a proactive approach to troubleshooting help Module Development Engineers overcome these challenges effectively.
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Module Development Engineer jobs near you
Infographic showing various Module Development Engineer job openings in the United States as of July 2026, with employment types broken down into 1% As Needed, 83% Full Time, 14% Part Time, and 2% Contract. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $96,155 per year, or $46.2 per hour.
Packaging Module Development Engineer

Packaging Module Development Engineer

Intel Corporation

Phoenix, AZ • On-site

Full-time

Medical, Retirement, PTO

Re-posted 11 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

11th of 143 rated electronics manufacturers

Job description

Job Details:
Job Description:
Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving process and equipment innovations critical to Intel's roadmap for assembly packaging platform technologies. Your contributions will empower the manufacturability of next-generation products, ensuring they meet stringent quality, reliability, cost, yield, and productivity requirements. As part of a collaborative and forward-thinking team, you'll tackle complex challenges, develop cutting-edge methods, and push the boundaries of what's possible in packaging technology. Be part of a dynamic environment where your expertise and creativity will make a meaningful impact on Intel's success and leadership in the semiconductor industry.
Key Responsibilities
  • Develop and optimize advanced packaging processes and equipment to support Intel's Glass Core and CPO roadmap.
  • Define and implement process specifications, equipment configurations, and workflows for new technologies, ensuring seamless integration into manufacturing.
  • Apply design of experiments (DOE) principles to characterize process windows and understand the interactions between equipment, materials, and processes.
  • Drive continuous improvements in process capability, quality, reliability, cost, yield, automation, and productivity.
  • Develop and maintain equipment for testing silicon and package technologies under simulated field conditions, including thermal, humidity, and mechanical stress environments.
  • Collaborate with supplier quality and procurement teams to ensure material specifications and vendor performance meet strict quality standards.
  • Lead efforts to develop innovative techniques, tools, and methods to accelerate technology readiness and identify risks early in the development cycle.
  • Document advancements through white papers, technical reports, and data analysis.
  • Partner with cross-functional engineering teams and external stakeholders to address packaging challenges and align solutions with Intel's strategic goals.

Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
  • Bachelor's or MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a related technical field.
  • +4 years of experience in:
    • Process development, equipment adjustment, and manufacturing process control.
    • Design of experiments (DOE) principles and statistical data analysis.
    • Process characterization and statistical process control methodologies.
    • Material testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.

Preferred Qualifications
  • Master's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field.
  • Analytical skills and experience troubleshooting integrated technology challenges.
  • Advanced statistical tools, process control frameworks, and Microsoft Office software suite applications.
  • Experience working with both organic and inorganic materials in packaging processes.
  • 1 year of Photolithography experience.

Join Intel's mission to innovate and lead in the field of advanced packaging technologies. Apply now to become part of the team shaping the future of semiconductor manufacturing.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

What Intel employees say

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Benefits

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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