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Module Development Engineer Jobs in Utah (NOW HIRING)

Navitas Semiconductor

Partner with Product Engineering, Device Engineering, Test Engineering, Quality, Supply Chain ... Lead development of advanced module architectures, including substrate technologies, high-voltage ...

LVT

Senior Connectivity Engineer

American Fork, UT

$93K - $128K/yr

ABOUT THIS ROLE As a Senior Connectivity Engineer, you shape how information moves across every LVT ... modem modules and connected-device platforms throughout the product development lifecycle.

Worky

Staff Software Engineer - Platform

Lehi, UT · On-site

$140 - $200/hr

Evolve and maintain module and design-system infrastructure, ensuring consistency, high performance ... Leverage AI-assisted tools to improve development velocity, streamline repetitive infrastructure ...

LVT

Senior Connectivity Engineer

American Fork, UT · On-site

$109K - $144K/yr

ABOUT THIS ROLE As a Senior Connectivity Engineer, you shape how information moves across every LVT ... modem modules and connected-device platforms throughout the product development lifecycle.

LVT

Senior Connectivity Engineer

American Fork, UT · On-site

$109K - $144K/yr

ABOUT THIS ROLE As a Senior Connectivity Engineer, you shape how information moves across every LVT ... modem modules and connected-device platforms throughout the product development lifecycle.

Sunrun

Staff ERP Engineer

Lehi, UT

$158K/yr

Lead the development and configuration of Oracle ERP modules, including Order Management, Inventory ... Collaborate with cross-functional teams (Salesforce, Data & Analytics, Engineering, Security ...

krg technology inc

.Net Developer

Salt Lake City, UT · On-site

$46.75 - $61.75/hr

... development environments used within the assigned product group (e.g. .Net, Visual Studio, Microsoft, C#, C++) Experience creating software products, modules, and features using C#, C++, etc.

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Module Development Engineer information

What is a module development engineer?

Module Development Engineers are professionals who design, develop, and optimize specific modules or components within larger engineering systems, often in industries like semiconductor manufacturing, automotive, or software development. Their work involves collaborating with cross-functional teams, conducting experiments, and integrating new technologies to improve module performance and reliability. They are responsible for troubleshooting issues, implementing design changes, and ensuring that modules meet technical specifications and quality standards.

What are the key skills and qualifications needed to thrive as a module development engineer?

To thrive as a Module Development Engineer, you need a strong background in electrical or mechanical engineering, along with experience in module design, testing, and manufacturing processes. Familiarity with CAD software (such as AutoCAD or SolidWorks), simulation tools, and industry-specific standards or certifications (like ISO or Six Sigma) is typically required. Strong analytical thinking, problem-solving abilities, and effective teamwork skills help you excel in cross-functional environments. These competencies ensure high-quality module development, efficient collaboration, and adherence to industry standards for successful project delivery.

What are some common challenges a module development engineer faces when integrating new modules into existing systems?

Module Development Engineers often encounter challenges related to compatibility and seamless integration of new modules with legacy systems. Ensuring that new modules meet performance standards without disrupting current workflows requires careful planning and thorough testing. Collaborating closely with cross-functional teams, such as software developers and quality assurance, is essential to identify potential integration issues early. Strong communication skills and a proactive approach to troubleshooting help Module Development Engineers overcome these challenges effectively.

What is the difference between Module Development Engineer vs Hardware Design Engineer?

AspectModule Development EngineerHardware Design Engineer
Required CredentialsBachelor's or Master's in Electrical Engineering, Computer Engineering, or related fieldsBachelor's or Master's in Electrical Engineering, Computer Engineering, or related fields
Work EnvironmentDesign, develop, and test electronic modules and componentsDesign and develop electronic hardware and circuit layouts
Employer & Industry UsageElectronics, automotive, consumer electronics, telecommunicationsElectronics, consumer devices, industrial equipment, telecommunications

Both roles require similar educational backgrounds and are common in electronics and tech industries. The Module Development Engineer focuses on creating complete modules or subsystems, while the Hardware Design Engineer concentrates on designing individual hardware components and circuits. Understanding these distinctions helps job seekers target the right roles based on their skills and career goals.

What are popular job titles related to Module Development Engineer jobs in Utah?

For Module Development Engineer jobs in Utah, the most frequently searched job titles are:

What job categories do people searching Module Development Engineer jobs in Utah look for?

The top searched job categories for Module Development Engineer jobs in Utah are:

What cities in Utah are hiring for Module Development Engineer jobs?

Cities in Utah with the most Module Development Engineer job openings:

Module Development Engineer jobs near you

Sr. Director, SiC Power Module Development

Navitas Semiconductor

Full-time

Posted 13 days ago

Job description

Leadership Roles and Responsibilities
  • Lead the development and execution of the SiC power module technology roadmap supporting high-voltage and ultra-high-voltage product platforms.
  • Build, lead, and develop a global organization of package, module, materials, process, reliability, and manufacturing engineers.
  • Drive the development of advanced power module packaging technologies from concept and prototype through qualification, safe launch, manufacturing ramp, and production release.
  • Establish module architectures, design rules, material strategies, and assembly processes that enable industry-leading performance, reliability, manufacturability, and cost.
  • Own technical execution of power module development programs across all development phases and applicable product development gates.
  • Lead development activities at OSAT partners, ensuring process capability, quality, capacity readiness, documentation, and operational execution.
  • Drive design-for-manufacturing, design-for-reliability, design-for-test, and technical risk mitigation throughout the product development cycle.
  • Establish robust package and module development methods, including requirements management, DFMEA, design reviews, qualification plans, technology readiness assessments, and manufacturing readiness reviews.
  • Partner with Product Engineering, Device Engineering, Test Engineering, Quality, Supply Chain, Operations, and Business Units to ensure successful product execution.
  • Define the long-term OSAT strategy, including technology capability development, supplier qualification, capacity planning, and second-source initiatives.
  • Serve as the senior technical interface with customers, suppliers, and manufacturing partners for SiC power module technologies.
  • Drive continuous improvement in quality, yield, cycle time, cost, and operational performance across module manufacturing operations.
Technical Roles and Responsibilities
  • Define the technology roadmap for next-generation SiC power modules supporting 1.2kV through ultra-high-voltage platforms 2.3kV and higher.
  • Lead development of advanced module architectures, including substrate technologies, high-voltage isolation systems, terminal designs, interconnect structures, current-sharing approaches, and thermal-management solutions.
  • Establish module electrical, thermal, mechanical, reliability, manufacturability, and cost requirements and lead engineering tradeoff decisions throughout development.
  • Drive selection, characterization, and qualification of AMB and DBC substrates; die-attach and sintering materials; wire, ribbon, and clip interconnects; molding and encapsulation materials; thermal-interface materials; housings; and high-voltage insulation systems.
  • Lead electrical, electro-thermal, thermal, and mechanical simulation activities, including parasitic extraction, finite-element analysis, stress and warpage modeling, electric-field analysis, power-cycling life prediction, and partial-discharge assessment.
  • Define assembly process technologies, specifications, controls, and process windows for die attach and sintering, substrate attach, wire and ribbon bonding, clip attach, encapsulation, transfer molding, housing assembly, cleaning, curing, marking, and traceability.
  • Drive structured design of experiments, process characterization, SPC, Cpk improvement, defect reduction, and manufacturing yield improvement at OSATs.
  • Lead root-cause analysis and corrective actions for complex module failures, including delamination, die-attach voiding, sinter fatigue, interconnect degradation, thermal runaway, insulation breakdown, partial-discharge failures, moisture ingress, and housing or substrate cracking.
  • Work with test engineering to define wafer-sort, known-good-die, wafer-level burn-in, reliability screening, module final-test, high-voltage isolation, and partial-discharge test strategies
  • Lead technical evaluations and qualifications of OSATs, substrate suppliers, assembly-equipment vendors, material suppliers, and external reliability laboratories.
  • Own technical release criteria, control plans, safe-launch requirements, manufacturing readiness, and post-release monitoring for new module platforms.
  • Serve as the company technical authority for SiC power module architecture, packaging materials, assembly processes, qualification strategy, reliability, and manufacturing readiness.
Required Qualifications
  • M.S. or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related technical discipline.
  • 15+ years of semiconductor packaging or power module development experience, including significant technical leadership responsibility.
  • Proven experience developing and releasing power semiconductor modules from concept and prototype through qualification and production.
  • Deep knowledge of power module architectures, packaging materials, assembly processes, thermal management, electrical parasitics, high-voltage isolation, and reliability engineering.
  • Demonstrated experience leading module development and industrialization with OSATs or outsourced manufacturing partners.
  • Strong understanding of JEDEC, AEC-Q, and relevant industrial or automotive qualification methodologies.
  • Proven record of building and leading global, multidisciplinary engineering teams.
  • Experience managing complex development programs involving multiple internal functions, suppliers, and manufacturing partners.
  • Excellent leadership, communication, executive presentation, and data-driven decision-making skills.
  • Ability to travel internationally as required.
Preferred Technical Expertise
  • SiC MOSFET power modules across 1.2kV, 1.7kV, 2.3kV, 3.3kV, and higher voltage classes.
  • Ultra-high-voltage insulation design, electric-field management, creepage and clearance, and partial-discharge mitigation.
  • AMB/DBC substrate technology and high-reliability substrate attachment.
  • Pressureless or pressure-assisted silver sintering and advanced die-attach technologies.
  • High-current wire, ribbon, and clip interconnect technologies.
  • Power-module thermal management, electro-thermal modeling, power cycling, and lifetime prediction.
  • Automotive, industrial, renewable-energy, energy-storage, traction, or grid-infrastructure applications.
  • Known-good-die, wafer-level burn-in, and module-level high-voltage test solutions.
  • OSAT power module industrialization, second-source qualification, safe launch, and high-volume manufacturing ramp.
  • Experience developing technology roadmaps and building engineering organizations during rapid growth.
Leadership Expectations
  • Build a high-performance engineering culture focused on technical excellence, accountability, execution, innovation, and continuous improvement.
  • Develop technical leadership capability and succession plans across the global organization.
  • Drive effective collaboration across engineering, operations, quality, supply chain, and business teams.
  • Establish clear goals, metrics, ownership, and development plans to enable organizational success.
  • Foster strong, transparent partnerships with OSATs, material suppliers, equipment vendors, and technology partners.
  • Champion disciplined decision-making, risk management, and on-time closure of technical issues.

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