Position Summary:
As an Equipment Engineer you will own all assigned toolsets. The preferred candidate will have the ability to troubleshoot difficult and poorly defined problems in relation to the mechanics, electronics, and process using tool knowledge/experience, SPC, schematics, and other available resources. The candidate will have extensive collaboration with the area maintenance team and process engineering. Some collaboration will be with tool vendors, other area engineers/managers, procurement, and production.
Major Area of Accountability:
* Provide technical leadership and management of 200/300MM Semiconductor processing equipment in at least one of the following areas: Wet Etch /Wafer Clean, Electroplate (ECD), Compression Mold, Die Attach, CMP (some areas may be combined).
* Work with process engineering and equipment maintenance technicians to drive root cause corrective actions of equipment failures, implement permanent solutions and eliminate chronic and long-term down events.
* Lead continuous improvement teams to drive tool matching, availability, throughput improvements and reduce risk.
* Complete new tool start-up and tool upgrades to increase fab capability, capacity, lower costs and improve yields.
* Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations.
* Participate in cross-functional teams that create efficiencies across all layers of the organization.
* The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.
Required Qualifications:
* Education:Bachelor of Science or in Mechanical, Electrical or Chemical Engineering or Materials Science, Physics or other relevant Engineering discipline.
* 1-3 years of experience within respective area of expertise.
* Experience must include High Vacuum and Toxic Gas Delivery systems.
* Experience with application of structured problem-solving methodology.
* Positive interpersonal skills, highly energetic and self-motivated.
* Outstanding written and verbal communication skills.
* Demonstrated ability to meet requirements and deliver results.
* Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs
US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
Preferred Qualifications:
* Experience with Compression Mold, Die Attach or CMP equipment
* Experience with Automated Fault Detection and Classification Systems (FDC).
* Strong background with utilizing SPC.
* High level of understanding of equipment component behavior.
* Experience Integrating Equipment Maintenance Management Software