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Dice Technical Jobs (NOW HIRING)

Dice

Solutions Engineer

Charlotte, NC · On-site

Genesis10 is currently seeking a Technical Project Manager for a contract position with a Global ... Dice is the go-to career marketplace for tech professionals. Founded in 2010, the company is ...

Dice

Solutions Engineer

Pennington, NJ · On-site

S. seeking a Technical Project Manager for a contract position with a Global Financial Institution ... Dice is the go-to career marketplace for tech professionals. Founded in 2010, the company is ...

Dice

Solutions Engineer

Plano, TX · On-site

They are seeking a Technical Project Manager responsible for leading the planning, deployment, and ... Dice is the go-to career marketplace for tech professionals. Founded in 2010, the company is ...

Dice

Frontend Software Engineer II

... technical judgment to discern when manual coding yields better results. Company : Dice is the go-to career marketplace for tech professionals. Founded in 2010, the company is headquartered in ...

Royer

Dice Operator

Madison, IN

$18/hr

Efficiently operate a production machines to produce products that satisfy customer requirements of quality, cost, and time using the most economical means. Follow the rules specified in the Royer ...

The Judge Group

Technical Recruiter

Dallas, TX

Responsibilities As a Technical Recruiter , you will: * Leverage your experience to source and ... Dice, etc. * Build relationships with top candidates and establish a pipeline of qualified ...

The Judge Group

Technical Recruiter

Dallas, TX

As a Technical Recruiter , you will: * Leverage your experience to source and screen top talent ... Dice, etc. * Build relationships with top candidates and establish a pipeline of qualified ...

The Judge Group

Technical Recruiter

Dallas, TX · On-site

Responsibilities As a Technical Recruiter , you will: * Leverage your experience to source and ... Dice, etc. * Build relationships with top candidates and establish a pipeline of qualified ...

Stem Xpert

Software Technical Lead

Barrington, IL

... Dice.com), direct phone sourcing, networking (LinkedIn), vendors and referrals. Sourcing ... Technical Lead Duration: Long Term Location: Barrington, IL Visa: GC/USC/H1B Job Type: Full Time ...

RiseIT Solutions

Technical Recruiter

Jacksonville, FL · On-site

IT Technical Recruiter Location: Jacksonville, FL (on site, no remote) Salary: Annual Salary ... Strong experience utilizing Top Job Boards including Monster, DICE, CareerBuilder amp; LinkedIn to ...

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How much do dice technical jobs pay per hour?

As of Jun 19, 2026, the average hourly pay for dice technical in the United States is $49.97, according to ZipRecruiter salary data. Most workers in this role earn between $37.50 and $62.26 per hour, depending on experience, location, and employer.

What jobs pay $10,000 a month without a degree?

For a Dice Technical role, high-paying positions without a degree often include specialized IT roles such as network architects, cybersecurity analysts, or cloud engineers, which rely on technical skills, certifications, and experience. These jobs typically require expertise in specific tools and environments and can pay $10,000 or more monthly for experienced professionals. Continuous learning and certifications like Cisco, AWS, or CompTIA can enhance earning potential in these fields.

What is the difference between Dice Technical vs Network Technician?

AspectDice TechnicalNetwork Technician
Required CertificationsCompTIA A+, Cisco CCNA, Microsoft certificationsCompTIA Network+, Cisco CCNA, Microsoft certifications
Work EnvironmentData centers, IT departments, technical supportNetwork infrastructure, troubleshooting, installation
Industry UsageIT services, technology companies, consulting firmsTelecommunications, enterprise IT, service providers

Dice Technical and Network Technician roles share similar certifications and work environments, focusing on IT infrastructure. However, Dice Technical often encompasses broader technical support and hardware expertise, while Network Technicians specialize specifically in network setup, maintenance, and troubleshooting. Both roles are vital in maintaining organizational IT systems, with overlapping skills but distinct focus areas.

What jobs pay 500,000 a year in the US?

In the US, high-paying roles such as senior executives, specialized surgeons, and successful entrepreneurs can earn $500,000 or more annually. Certain technical leadership positions, like Chief Technology Officer or Vice President of Engineering, especially in large companies, also have the potential for such compensation, often including bonuses and stock options.

What are typical challenges faced by a Dice Technical Specialist when supporting diverse client environments?

Dice Technical Specialists often work with clients who use a wide range of technologies and platforms, which can make troubleshooting and providing solutions complex. Adapting quickly to different systems and staying updated on the latest tech trends are essential. Strong communication skills are also important, as the role frequently involves translating technical concepts for non-technical clients and collaborating with cross-functional teams. Successfully balancing multiple client priorities and projects can be challenging but is key to thriving in this dynamic environment.

What hot tech job pays $775 000?

A Dice Technical role such as a senior software engineer, data scientist, or cybersecurity executive can potentially earn $775,000 or more annually, especially with extensive experience, specialized skills, and leadership responsibilities. High-paying tech jobs often require advanced certifications, strong problem-solving abilities, and experience with cutting-edge tools or platforms.

Is Dice a legitimate job site?

Dice is a well-known online platform that specializes in tech job listings and is considered a legitimate resource for job seekers in the technology industry. It offers verified job postings, company profiles, and tools for applying to positions, making it a trusted site for tech professionals. However, users should still exercise caution and verify individual job postings before applying.

What are the key skills and qualifications needed to thrive as a Dice Technical professional, and why are they important?

To thrive as a Technical Specialist (such as those working with Dice, a leading tech job platform), you need a solid background in information technology, computer science, or a related field, often supported by a relevant degree or certifications. Familiarity with job board management systems, applicant tracking systems (ATS), and data analysis tools is typically required. Strong problem-solving abilities, attention to detail, and effective communication skills help professionals excel in fast-paced, client-facing environments. These competencies ensure efficient technical support, optimized platform use, and high client satisfaction in the recruitment and technology sector.

What are Dice Technical roles?

Dice Technical refers to job positions listed on Dice.com that focus on information technology and engineering fields. These roles can include software developers, network engineers, data analysts, cybersecurity specialists, and other technology professionals. Dice Technical jobs are typically sought after by employers looking for candidates with specific technical skills and experience. The platform serves as a specialized job board connecting tech talent with companies in need of their expertise.
More about Dice Technical jobs
What cities are hiring for Dice Technical jobs? Cities with the most Dice Technical job openings:
What states have the most Dice Technical jobs? States with the most job openings for Dice Technical jobs include:
What job categories do people searching Dice Technical jobs look for? The top searched job categories for Dice Technical jobs are:
Dice Technical jobs near you
Infographic showing various Dice Technical job openings in the United States as of June 2026, with employment types broken down into 11% As Needed, and 89% Part Time. Highlights an 91% Physical, 7% Hybrid, and 2% Remote job distribution, with an average salary of $103,941 per year, or $50 per hour.

Process Engineering Manager - CMP, Dice, Grind & Bonding

SkyWater Technology Foundry, Inc.

Kissimmee, FL • On-site

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 14 days ago

Job description

Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location - employees join together to improve the world.
Explore what's possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.
Step into the future. SkyWater's values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees - and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.
Are you bold thinking? Find your place on our team and help us change the world!
Position Summary:
The Process Engineering Manager - CMP, Dice, Grind and Bonding leads a team of process engineers and technical contributors responsible for wafer fabrication process development, sustaining, yield improvement, and technology transfer activities across assigned modules. This role provides senior technical and people leadership across chemical mechanical planarization, wafer dicing, grinding / thinning, wafer bonding, debonding, surface preparation, cleans, and related metrology in a cleanroom manufacturing environment.
Primary Scope: CMP, post-CMP cleans, wafer dicing, grinding, thinning, backgrind, wafer bonding, debonding, surface preparation, related metrology, process control, sustaining, development, qualification, and transfer.
People Leadership Expectations
  • Serve as the direct people leader for an engineering team, with accountability for team performance, engagement, development, and execution against business priorities.
  • Set clear goals, priorities, and expectations for individual contributors; ensure employees understand how their work supports fab, customer, program, and business objectives.
  • Provide regular coaching, feedback, recognition, and career development support for employees at varying levels of experience.
  • Build technical depth across the team by creating development plans, supporting knowledge sharing, strengthening process ownership, and delegating meaningful technical ownership.
  • Assess team capability, identify skill gaps, and partner with leadership, HR, and Talent Acquisition on workforce planning, hiring, onboarding, retention, and succession planning.
  • Create a culture of accountability, collaboration, safety, technical rigor, continuous improvement, and respectful communication.
  • Conduct performance management activities including goal setting, check-ins, development discussions, performance feedback, and corrective action when needed.
  • Develop future leaders by creating stretch assignments, mentoring high-potential employees, and building a bench of capable process owners.

Major Area of Accountability:
  • Lead process development, optimization, qualification, and sustaining activities for CMP, dice, grind, bonding, debonding, cleans, and associated metrology processes.
  • Provide senior-level technical direction for CMP, slurry / pad selection, endpoint strategies, post-CMP cleans, wafer dicing, grind / thinning, wafer bonding, debonding, surface preparation, and related module-level integration interactions.
  • Drive process capability, yield improvement, defect reduction, surface quality, planarity, particle control, wafer strength, die quality, bonding integrity, void reduction, and cost-of-ownership initiatives.
  • Lead root-cause investigations and corrective actions for process excursions, yield limiters, defectivity issues, tool matching gaps, contamination concerns, wafer damage, bonding defects, and reliability risks.
  • Apply structured problem-solving methodologies such as 8D, 3D, Fishbone, 5 Why, fault-tree analysis, and other formal root-cause tools.
  • Use DOE, SPC, process capability analysis, and statistical methods to improve process control, manufacturability, and long-term stability.
  • Partner with integration, device, product, equipment, quality, operations, reliability, and program teams to resolve complex technical issues and meet customer commitments.
  • Guide new technology development, process transfer, process release, and qualification activities across CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration / advanced packaging platforms.
  • Establish and monitor key process metrics including yield, defect density, removal rate, non-uniformity, dishing / erosion, surface roughness, die quality, wafer thickness, bonding strength, voiding, process capability, documentation health, and excursion response.
  • Ensure compliance with safety, quality, documentation, change-control, customer, and cleanroom operating requirements.
  • Communicate status, risks, recovery plans, resource needs, and execution priorities clearly to senior leadership and cross-functional stakeholders.

Required Qualifications:
Education
  • B.S., M.S., or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, or another relevant engineering discipline.

Experience and/or Training
  • Minimum of 15 years of experience in a wafer fabrication cleanroom environment.
  • Minimum of 2 years of leadership, supervisory, or management experience, preferably with direct people leadership responsibility.
  • Experience as a process or area owner for at least two relevant process areas such as CMP, post-CMP cleans, wafer dicing, grinding / thinning, wafer bonding, debonding, surface preparation, or related module processes.
  • Experience working in CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration / advanced packaging fabrication environments.
  • Demonstrated experience leading structured problem-solving efforts using 8D, 3D, Fishbone, 5 Why, fault-tree analysis, or similar methodologies.
  • Strong working knowledge of DOE, SPC, process capability analysis, and statistical methods, with the ability to teach and lead others in their application.
  • Demonstrated ability to lead cross-functional teams, manage multiple technical priorities, and deliver results in a fast-paced manufacturing or development environment.
  • Strong interpersonal skills with the ability to influence, coach, and develop engineers and technical staff.
  • Excellent written and verbal communication skills.
  • Demonstrated ability to meet commitments, manage multiple projects simultaneously, and shift priorities based on business needs.
  • Passion for leading teams, developing people, and building strong engineering capability.
  • U.S. Citizenship is required. This position will require the holding of, or ability to obtain, a government security clearance.

Preferred Qualifications:
  • Experience with CMP consumables, slurry / pad selection, endpoint strategies, post-CMP cleans, metal contamination control, or wafer surface preparation.
  • Experience with wafer dicing, backgrind, wafer thinning, edge quality, chipping reduction, wafer handling, or die-level defect reduction.
  • Experience with wafer-to-wafer, die-to-wafer, fusion, hybrid, adhesive, eutectic, or temporary bonding processes.
  • Advanced degree in engineering, materials science, physics, or a related technical field.
  • Experience supporting both process development and production sustaining environments.
  • Experience supporting government, aerospace, defense, or other high-reliability customer programs.
  • Experience with security-sensitive manufacturing environments.

The annual salary range for this role is $136,960 - $205,440. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate.
SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well other employee financial benefits including 401k match, life insurance and opportunities to purchase SkyWater stock at a discounted rate.
Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.
SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or Recruiting@SkyWatertechnology.com.
EOE, including disability/vets

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