What you'll do The Packaging Engineer position requires handling all aspects of packaging ... The packaging development process includes package definition, stack-up, substrate layout, bond ...
What you'll do The Packaging Engineer position requires handling all aspects of packaging ... The packaging development process includes package definition, stack-up, substrate layout, bond ...
... substrate fit and routing studies to evaluate design tradeoffs in performance, cost, and ... Engineering, or a STEM related field Experience listed above should be in the following:
... substrate fit and routing studies to evaluate design tradeoffs in performance, cost, and ... Engineering, or a STEM related field Experience listed above should be in the following:
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$135K/yr
... substrate fit and routing studies to evaluate design tradeoffs in performance, cost, and ... Engineering, or a STEM related field Experience listed above should be in the following:
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$135K/yr
... substrate fit and routing studies to evaluate design tradeoffs in performance, cost, and ... Engineering, or a STEM related field Experience listed above should be in the following:
... substrate suppliers • Work closely with suppliers and factory engineers to identify capabilities and capacities for all key processes and material sets used in our fcCSP product roadmap. (ABF ...
... substrate suppliers • Work closely with suppliers and factory engineers to identify capabilities and capacities for all key processes and material sets used in our fcCSP product roadmap. (ABF ...
Director, Chiplets/FCBGA BU
Tempe, AZ · On-site
To include: substrate design, silicon to package interconnects, product assembly material ... Work closely with customer package engineering and Amkor factory engineering to understand ...
Director, Chiplets/FCBGA BU
Tempe, AZ · On-site
To include: substrate design, silicon to package interconnects, product assembly material ... Work closely with customer package engineering and Amkor factory engineering to understand ...
Manufacturing Assembler
Tucson, AZ · On-site
$15.50 - $19.25/hr
Our core competencies include systems engineering, program management, logistics, production ... to substrate, lockwire experience etc. • Ability to document and interpret technical ...
Manufacturing Assembler
Tucson, AZ · On-site
$15.50 - $19.25/hr
Our core competencies include systems engineering, program management, logistics, production ... to substrate, lockwire experience etc. • Ability to document and interpret technical ...
Substrate Engineer information
What are some common challenges Substrate Engineers face when working on high-density interconnect (HDI) designs?
Substrate Engineers often encounter challenges related to managing signal integrity, thermal performance, and miniaturization when working with HDI designs. Balancing the need for dense routing with electrical performance can be complex, especially as device sizes shrink and layer counts increase. Collaboration with PCB designers, materials scientists, and manufacturing teams is crucial to address these issues and ensure the substrate meets both design and production requirements. Keeping up with evolving technologies and industry standards is also essential for success in this role.
What engineers make $300,000 a year?
Senior engineers in specialized fields such as software engineering, petroleum engineering, and aerospace engineering can earn $300,000 or more annually, especially with extensive experience, advanced skills, and in high-demand industries. Roles involving leadership, complex technical expertise, or working in lucrative markets tend to have higher compensation levels.
What are the 7 types of engineers?
Engineers are typically categorized into various disciplines based on their specialization, including civil, mechanical, electrical, chemical, software, aerospace, and industrial engineering. Substrate engineers, a specialized role in semiconductor manufacturing, focus on designing and developing substrate materials used in electronic devices. Understanding different engineering types helps in identifying the skills and tools relevant to each field, which can be important for career development and job opportunities.
Are materials engineers in high demand?
Materials engineers, including those working as substrate engineers, are in high demand due to the growth of electronics, semiconductor, and advanced manufacturing industries. They often require knowledge of materials properties, testing, and industry standards, with employment prospects driven by technological innovation and manufacturing needs.
What is a Substrate Engineer?
A Substrate Engineer is a professional who specializes in designing, developing, and optimizing the underlying frameworks, often referred to as substrates, for electronic devices or software platforms. In the context of electronics, they work with materials and technologies that form the physical base for circuits and chips, ensuring performance, reliability, and manufacturability. In software, especially blockchain, a Substrate Engineer focuses on building and customizing blockchains using the Substrate framework, handling core logic, consensus, and runtime modules. Their role is crucial for creating robust and scalable systems tailored to specific application requirements.
What engineers make $500,000 a year?
Highly experienced engineers in specialized fields such as software engineering, data engineering, or systems architecture can earn $500,000 or more annually, especially in senior or executive roles at large technology companies. These positions often require advanced skills, certifications, and extensive industry experience, and may include bonuses, stock options, or profit sharing as part of compensation packages.
What is the difference between Substrate Engineer vs Semiconductor Process Engineer?
| Aspect | Substrate Engineer | Semiconductor Process Engineer |
|---|---|---|
| Credentials | Bachelor's or Master's in Materials Science, Electrical Engineering, or related fields | Bachelor's or Master's in Electrical Engineering, Chemical Engineering, or related fields |
| Work Environment | Research labs, fabrication facilities, semiconductor manufacturing plants | Cleanrooms, fabrication facilities, process development labs |
| Industry Usage | Semiconductor manufacturing, electronics, integrated circuits | Semiconductor fabrication, chip production, process optimization |
| Common Search/Comparison | Yes | Yes |
Substrate Engineers focus on developing and optimizing the materials and layers used in semiconductor devices, while Semiconductor Process Engineers work on the overall manufacturing processes to produce chips efficiently. Both roles require similar educational backgrounds and often collaborate within the semiconductor industry, but their specific responsibilities differ in scope and focus.
What are the key skills and qualifications needed to thrive as a Substrate Engineer, and why are they important?
To thrive as a Substrate Engineer, you need a strong background in materials science, semiconductor fabrication, and electrical engineering, often supported by a relevant engineering degree. Familiarity with industry-standard design tools like Cadence or Mentor Graphics, as well as experience with substrate modeling, PCB design, and analysis software, is typically required. Excellent problem-solving skills, attention to detail, and effective communication are crucial soft skills for collaborating across multidisciplinary teams. These qualifications are essential for ensuring high-quality, reliable substrate designs that meet performance, manufacturability, and cost requirements in advanced electronics manufacturing.
What are popular job titles related to Substrate Engineer jobs in Arizona? For Substrate Engineer jobs in Arizona, the most frequently searched job titles are:
What job categories do people searching Substrate Engineer jobs in Arizona look for? The top searched job categories for Substrate Engineer jobs in Arizona are:
Viasat rating
4.2
Based on 7 frontline employees who took The Breakroom Quiz
79th of 82 rated telecommunications companies
Job description
About us
One team. Global challenges. Infinite opportunities. At Viasat, we're on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We're looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.
What you'll do
The Packaging Engineer position requires handling all aspects of packaging development. This means planning, crafting, and developing advanced or novel packaging. The role also involves managing packaging efforts related to radio frequency communication devices. The products range from IC's, System In Packages, sub-assemblies, and modules. The packaging development process includes package definition, stack-up, substrate layout, bond diagram, drawings, predictive modeling combined with system testing, technical risk/cost assessment, materials and process characterization, compilation of formal documentation, collaborating with sub-contractors and internal assembly and reliability resources, and final release of product.
The day-to-day
Job responsibilities include but not limited to:
What you'll need
What will help you on the job
#LI-AF1
Salary range
$155,500.00 - $246,000.00 / annually.For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $193,500.00- $290,500.00/ annually
At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience. Base pay may vary depending on job-related knowledge, skills, and experience. Additional cash or stock incentives may be provided as part of the compensation package, in addition to a range of medical, financial, and/or other benefits, dependent on the position offered. Learn more about Viasat's comprehensive benefit offerings that are focused on your holistic health and wellness at https://careers.viasat.com/benefits.
EEO Statement
Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click here.
One team. Global challenges. Infinite opportunities. At Viasat, we're on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We're looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.
What you'll do
The Packaging Engineer position requires handling all aspects of packaging development. This means planning, crafting, and developing advanced or novel packaging. The role also involves managing packaging efforts related to radio frequency communication devices. The products range from IC's, System In Packages, sub-assemblies, and modules. The packaging development process includes package definition, stack-up, substrate layout, bond diagram, drawings, predictive modeling combined with system testing, technical risk/cost assessment, materials and process characterization, compilation of formal documentation, collaborating with sub-contractors and internal assembly and reliability resources, and final release of product.
The day-to-day
Job responsibilities include but not limited to:
- Working closely with project development teams and product groups (RFIC, MMIC, Module) to develop the next generation/sophisticated/novel packaging solution for RF communication products
- Define packages and materials that meet product requirements for reliability, performance, manufacturability, and cost.
- Ensure all packaging work is completed for New Product and New Technology Introductions
- Develop and manage packaging documentation including SOWs, package drawings, and process flow
- Build and layout of semiconductor packages including QFN, SiP, WL-CSP, RDL, Flip Chip, FO-WLP and Interposers
- Ensure early success in package development with modeling and simulation for thermal, mechanical, and electrical
- Technically oversee vendors in the manufacture of said packages in conjunction with manufacturing engineers
- apply your assembly knowledge of die attach, Wirebond, bumping, overmolding to advise product groups on options available to solve problems
- identify suitable IC, sub-assembly, and module package options and perform feasibility studies for new products
- interact with product groups for package/cost optimization along with mechanical engineering
- specify and conduct reliability testing by vendors to insure the reliability of the packaged product
- Coordinate package related activities across multiple organizations including Marketing, Design, Applications, Test, Assembly Engineering, Quality, and Manufacturing (internal and external factories)
- Address and solve materials and processing issues that may occur during the development process
- Manage the package process using industry standard project management tools.
- Develop and maintain the packaging and technology roadmap through proposal support and long term technology programs
What you'll need
- 10+ years in semiconductor packaging including experience in package assembly process, package engineering, quality & reliability and the intersection/relationship of packaging to test.
- Bachelor's Degree in Electrical, Mechanical, Materials Engineering or related technical discipline
- Deep understanding of micro-electronic package structure, mechanical, electrical and thermal performance.
- Solid grasp of heat transfer and its relation to material properties
- Packaging knowledge in RFIC, millimeterware, System In Package, sub-assembly, and/or modules.
- Experience in semiconductor package design with demonstrated experience in one or more of the following: QFN, SiP, BGA, WL-CSP, Flip Chip and Bumping or FO-WLP
- Strong understanding of Die Prep, Assembly (die attach, Wirebond, flip chip, etc) and Surface Mount Technology (SMT) process-equipment is desired.
- Have a high tolerance for ambiguity and solid interpersonal skills
- In-depth knowledge of interconnect reliability daisy chain testing, CPI and BLR.
- Understands the metallization schemes for laminates, interposers and SMT.
- Knowledge of statistical methods and Building of Experiments
- Must be able to work autonomously and help determine methods and procedures.
- Customer service oriented.
- Ability to work with build teams to translate IC/system requirements input packaging configurations
- Ability to manage and drive packaging
- US Government position. US Citizenship required
- Ability to travel up to 10%
This is an onsite role based in Tempe, AZ
What will help you on the job
- Strong Preference for RF, Microwave or mmWave experience
- Experience with package build software like Cadence APD/SiP
- Experience with electronic compose and layout tools such as Cadence Concept HDL, Mentor Graphics DxDesigner, or Zuken
- Prior volume OSAT experience is highly desired
- Experience in ITAR and Mil programs
- SolidWorks tool usage
- Knowledge or exposure of wafer to wafer bonding
- Knowledgeable about ATE
- IMAPs and/or MEPTEC membership
- Knows the latest semiconductor packaging trends.
- Understands MIL-STD-883 and JEDEC requirements.
- Proficient user of Microsoft Excel and other Office products.
#LI-AF1
Salary range
$155,500.00 - $246,000.00 / annually.For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $193,500.00- $290,500.00/ annually
At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience. Base pay may vary depending on job-related knowledge, skills, and experience. Additional cash or stock incentives may be provided as part of the compensation package, in addition to a range of medical, financial, and/or other benefits, dependent on the position offered. Learn more about Viasat's comprehensive benefit offerings that are focused on your holistic health and wellness at https://careers.viasat.com/benefits.
EEO Statement
Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click here.
About ViaSat
Sourced by ZipRecruiter
At Viasat, we're on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate.
Industry
Telecommunications
Company size
5,001 - 10,000 Employees
Headquarters location
Carlsbad, CA, US
Year founded
1986