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Module Development Engineer Jobs (NOW HIRING)

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$85K - $162K/yr

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral ...

Intel

Thin Films Module Development Engineer

Hillsboro, OR · On-site

$133K - $188K/yr

Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development ...

Intel

Module Development Engineer - CMP

Hillsboro, OR · On-site

Engineers within Intel's Logic Technology Development (LTD) organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century. We innovate leading edge fabrication ...

Intel

Module Development Engineering Manager

Hillsboro, OR · On-site

$133K - $219K/yr

Join Intel's Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting innovative solutions for next-generation technology development in wafer ...

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Module Development Engineer information

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$49K

$96.2K

$153.5K

How much do module development engineer jobs pay per year?

As of Sep 11, 2026, the average yearly pay for module development engineer in the United States is $96,155.00, according to ZipRecruiter salary data. Most workers in this role earn between $79,500.00 and $106,500.00 per year, depending on experience, location, and employer.

What is a module development engineer?

Module Development Engineers are professionals who design, develop, and optimize specific modules or components within larger engineering systems, often in industries like semiconductor manufacturing, automotive, or software development. Their work involves collaborating with cross-functional teams, conducting experiments, and integrating new technologies to improve module performance and reliability. They are responsible for troubleshooting issues, implementing design changes, and ensuring that modules meet technical specifications and quality standards.

What are the key skills and qualifications needed to thrive as a module development engineer?

To thrive as a Module Development Engineer, you need a strong background in electrical or mechanical engineering, along with experience in module design, testing, and manufacturing processes. Familiarity with CAD software (such as AutoCAD or SolidWorks), simulation tools, and industry-specific standards or certifications (like ISO or Six Sigma) is typically required. Strong analytical thinking, problem-solving abilities, and effective teamwork skills help you excel in cross-functional environments. These competencies ensure high-quality module development, efficient collaboration, and adherence to industry standards for successful project delivery.

What are some common challenges a module development engineer faces when integrating new modules into existing systems?

Module Development Engineers often encounter challenges related to compatibility and seamless integration of new modules with legacy systems. Ensuring that new modules meet performance standards without disrupting current workflows requires careful planning and thorough testing. Collaborating closely with cross-functional teams, such as software developers and quality assurance, is essential to identify potential integration issues early. Strong communication skills and a proactive approach to troubleshooting help Module Development Engineers overcome these challenges effectively.

What is the difference between Module Development Engineer vs Hardware Design Engineer?

AspectModule Development EngineerHardware Design Engineer
Required CredentialsBachelor's or Master's in Electrical Engineering, Computer Engineering, or related fieldsBachelor's or Master's in Electrical Engineering, Computer Engineering, or related fields
Work EnvironmentDesign, develop, and test electronic modules and componentsDesign and develop electronic hardware and circuit layouts
Employer & Industry UsageElectronics, automotive, consumer electronics, telecommunicationsElectronics, consumer devices, industrial equipment, telecommunications

Both roles require similar educational backgrounds and are common in electronics and tech industries. The Module Development Engineer focuses on creating complete modules or subsystems, while the Hardware Design Engineer concentrates on designing individual hardware components and circuits. Understanding these distinctions helps job seekers target the right roles based on their skills and career goals.

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Cities with the most Module Development Engineer job openings:

What states have the most Module Development Engineer jobs?

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Module Development Engineer jobs near you
Infographic showing various Module Development Engineer job openings in the United States as of September 2026, with employment types broken down into 1% Internship, 1% As Needed, 81% Full Time, 15% Part Time, and 2% Contract. Highlights an 85% Physical, 3% Hybrid, and 12% Remote job distribution, with an average salary of $96,155 per year, or $46.2 per hour.

Packaging Module Development Engineer

Phoenix, AZ • On-site

Intel
Manufacturing • 10K+ employees
Learn more about Intelexternal

$85K - $162K/yr

Full-time

Medical, Retirement, PTO

Re-posted 8 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

Job description

Job Details:Job Description: 

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development, optimization, and integration of processes and equipment that shape the future of product performance, quality, and reliability. By leveraging your technical expertise, you will help ensure that Intel delivers exceptional results to meet the demands of a rapidly evolving industry.

Key Responsibilities:

  • Design and develop assembly processes and equipment to enable future packaging technologies.
  • Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
  • Create and maintain specifications for processes and equipment using Design of Experiments (DOE) and data analysis principles.
  • Conduct tests under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces, to evaluate silicon and packaging technologies.
  • Oversee the manufacturability of package designs and manage their manufacturing cycles.
  • Establish material specifications and collaborate with supplier quality and procurement teams to ensure compliance with performance requirements.
  • Develop innovative techniques, tools, and quality screens to assess packaging quality and reliability.
  • Set reliability standards based on a strong understanding of failure mechanisms and influence design, material selection, and process development accordingly.
  • Provide consultation and technical support for packaging process improvements and respond to customer and client needs.
  • Drive standardization in product qualification and manufacturing quality systems while collaborating with engineering teams to meet key product milestones.
Qualifications:

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

  • Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field with 1+ years of relevant experience or Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field.

  • Experience listed above should be a combination of the following:

    • Familiarity with equipment adjustment, process characterization, and manufacturability or electronics assembly.

Preferred Qualifications

  • Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

  • Hands-on experience in a technology manufacturing environment or semiconductor packaging processes.

  • Demonstrated ability to collaborate with cross-functional teams and contribute to time-sensitive projects.

We invite you to apply and bring your expertise, creativity, and passion for innovation to Intel. Be a part of our mission to create world-class packaging solutions and help shape the future of technology.

Job Type:College GradShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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