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Contract Semiconductor Wire Bond Jobs (NOW HIRING)

Production Technician

Milpitas, CA · On-site

$20 - $25/hr

Two or more years of experience in semiconductor, photonics, optical, electronics, or R&D manufacturing. * Hands-on experience with wire bonding, wire bond inspection, edge coupling, active optical ...

Production Technician

Milpitas, CA · On-site

$19.75 - $24.50/hr

Two or more years of experience in semiconductor, photonics, optical, electronics, or R&D manufacturing. * Hands-on experience with wire bonding, wire bond inspection, edge coupling, active optical ...

Production Technician

Milpitas, CA · On-site

$20 - $25/hr

Two or more years of experience in semiconductor, photonics, optical, electronics, or R&D manufacturing. * Hands-on experience with wire bonding, wire bond inspection, edge coupling, active optical ...

Perform internal visual inspection and wire bond pull to operating various tools such as real time ... Prior semiconductor industry experience preferred. Knowledge/Skills: * Must possess the ability to:

Knowledge or experience with Automatic assembly equipment for Wire bond, Die attach a plus * Knowledge in semiconductor manufacturing a plus. * Self-motivated with the ability to align priorities in ...

ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable ... Wire bond Testing to MIL-STD-883, Method 2011 and 2023 Requirements : * US CITIZENSHIP * High ...

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Contract Semiconductor Wire Bond information

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How much do contract semiconductor wire bond jobs pay per hour?

As of Aug 28, 2026, the average hourly pay for contract semiconductor wire bond in the United States is $21.55, according to ZipRecruiter salary data. Most workers in this role earn between $18.27 and $24.52 per hour, depending on experience, location, and employer.

What is the difference between Contract Semiconductor Wire Bond vs Contract Semiconductor Die Attacher?

AspectContract Semiconductor Wire BondContract Semiconductor Die Attacher
Primary RoleAttaches fine wires to connect semiconductor chips to packagesAttaches dies to substrates or packages during assembly
Required SkillsWire bonding techniques, precision handling, equipment operationDie placement, adhesive application, equipment operation
Work EnvironmentCleanroom, electronics manufacturing facilitiesElectronics assembly, cleanroom or production lines
CertificationsTypically requires technical training or certifications in electronics manufacturingSimilar certifications in assembly and handling of semiconductor components

Both roles are essential in semiconductor manufacturing, focusing on different stages of chip assembly. Contract Semiconductor Wire Bonds specialize in connecting chips with fine wires, while Contract Semiconductor Die Attachers focus on placing dies onto substrates. Understanding these differences helps in choosing the right job or service for semiconductor production needs.

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Infographic showing various Contract Semiconductor Wire Bond job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 89% Full Time, 4% Part Time, 1% Temporary, 3% Contract, and 2% Nights. Highlights an 95% Physical, 2% Hybrid, and 3% Remote job distribution, with an average salary of $44,825 per year, or $21.6 per hour.

Senior/Staff Process Engineer (Wire Bond)

Doist

San Jose, CA • On-site

$120 - $180/hr

Other

Posted 16 days ago


Job description

# Senior/Staff Process Engineer (Wire Bond)Lumilens • San Jose, CA • • 2h agoSave this role or tell us whether you want more jobs like it.**About LUMILENS**At Lumilens we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing - faster, cooler, and massively more efficient. We’re a well-funded startup backed by Mayfield and led by veterans who’ve built and scaled some of the most transformative technologies in the industry. At Lumilens, we’re developing high-speed photonics products purpose-built to power the future of AI infrastructure and high-performance computing. This isn’t incremental innovation, it’s a ground-floor opportunity to rethink the optical layer from the silicon up. You’ll work alongside a team of world-class engineers solving some of the hardest challenges in scaling optical systems. If you're looking for mission, momentum, and the chance to make an outsized impact, jump on the rocket ship. We’re just getting started.**POSITION OVERVIEW**We are seeking an experienced Process Engineer to develop and own manufacturing processes for our optical transceiver product roadmap, including current and next-generation 800G and 1.6T module programs. This role owns process development across the core assembly flow — such as die attach, wire bond, active alignment, and general assembly — from initial process definition through high-volume production. The successful candidate will work closely with contract manufacturers, equipment and material suppliers, and internal design and quality teams to bring new products to yield and instill a culture of continuous improvement. The role requires a hands-on engineer who is eager to learn, develop, and qualify new processes and equipment to support high-volume manufacturing of optical transceivers used in AI data centers.**DUTIES/RESPONSIBILITIES**· Define, develop, prove out, and deploy manufacturing processes for new products across the transceiver assembly flow (e.g., die attach, wire bond, active alignment, and general assembly), implementing continuous improvement projects to achieve yield, throughput, efficiency, scrap, and quality targets.· Own manufacturing process documentation (process specs, work instructions, control plans, FMEA) and review/approve process changes implemented on the production line.· Maintain end-to-end manufacturing ownership: ensure all changes to product, process, materials, and equipment are managed under change control per established QMS requirements.· Lead or support equipment selection and new equipment introduction: define statement of purpose/requirements, work with suppliers and stakeholders to develop process algorithms, machine hardware, and software from buy-off through release to manufacturing.· Collaborate with design engineering and contract manufacturing teams to execute, improve, and sustain manufacturing processes; ensure design for manufacturing (DFM) guidelines are met.· Collaborate with the quality team for planning and execution of qualification, reliability, and burn-in testing in support of new product introduction and process changes.· Analyze process and yield data to identify root cause of excursions and drive corrective/preventive actions across relevant assembly processes.· Prepare process reports by collecting, analyzing, and summarizing information and trends.· Automate manufacturing processes where possible to support scale-up and high-volume production.**SKILLS/EXPERIENCE**· Bachelor's degree in Electrical Engineering, Industrial Engineering, Mechanical Engineering, Physics, or related field, plus 7+ years of experience in high-volume optical transceiver and/or laser manufacturing.· Excellent problem-solving and analytical skills.· In-depth technical knowledge and hands-on experience in the design, development, selection, and implementation of manufacturing processes, equipment, materials, and methodologies for optical assemblies.· Expert in one or more optical transceiver assembly processes, such as die attach, wire bond, active optical alignment, general assembly, product testing, or burn-in.· Expertise in data analysis, statistical process control (SPC), and report generation.· In-depth understanding of quality management systems and applicable quality standard requirements.· Data query and data analysis skills using statistical tools and techniques.· Expertise in optics failure analysis (FA) processes and tools.· Ability to work well in a geographically diverse cross-functional team.· Good command of English communication, both verbal and written, including in-person and virtual presentation skills.· International travel required. #J-18808-Ljbffr