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Contract Semiconductor Wire Bond Jobs (NOW HIRING)

Micron

Senior Package Design Engineer

Boise, ID · On-site

... semiconductor packaging and ready to lead at the intersection of silicon, system, and scale. This ... wire bond and flip chip interconnect schemes, and BEOL/RDL flows - Create wire bond diagrams ...

PsiQuantum

Production Technician

Milpitas, CA · On-site

$20 - $25/hr

Two or more years of experience in semiconductor, photonics, optical, electronics, or R&D manufacturing. * Hands-on experience with wire bonding, wire bond inspection, edge coupling, active optical ...

PsiQuantum

Production Technician

Milpitas, CA · On-site

$20 - $25/hr

Two or more years of experience in semiconductor, photonics, optical, electronics, or R&D manufacturing. * Hands-on experience with wire bonding, wire bond inspection, edge coupling, active optical ...

Micross Components

Process Engineer

Apopka, FL · On-site

Knowledge or experience with Automatic assembly equipment for Wire bond, Die attach a plus * Knowledge in semiconductor manufacturing a plus. * Self-motivated with the ability to align priorities in ...

Skyworks

Principal Reliability/FA Engineer

Newbury Park, CA

$108K - $136K/yr

... semiconductor devices, surface-mount components, printed circuit boards, and wire-bond and flip-chip modules. Design and execute parametric, RF, and system-level test strategies to enable accurate ...

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Contract Semiconductor Wire Bond information

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How much do contract semiconductor wire bond jobs pay per hour?

As of Aug 7, 2026, the average hourly pay for contract semiconductor wire bond in the United States is $21.55, according to ZipRecruiter salary data. Most workers in this role earn between $18.27 and $24.52 per hour, depending on experience, location, and employer.

What is the difference between Contract Semiconductor Wire Bond vs Contract Semiconductor Die Attacher?

AspectContract Semiconductor Wire BondContract Semiconductor Die Attacher
Primary RoleAttaches fine wires to connect semiconductor chips to packagesAttaches dies to substrates or packages during assembly
Required SkillsWire bonding techniques, precision handling, equipment operationDie placement, adhesive application, equipment operation
Work EnvironmentCleanroom, electronics manufacturing facilitiesElectronics assembly, cleanroom or production lines
CertificationsTypically requires technical training or certifications in electronics manufacturingSimilar certifications in assembly and handling of semiconductor components

Both roles are essential in semiconductor manufacturing, focusing on different stages of chip assembly. Contract Semiconductor Wire Bonds specialize in connecting chips with fine wires, while Contract Semiconductor Die Attachers focus on placing dies onto substrates. Understanding these differences helps in choosing the right job or service for semiconductor production needs.

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What are the most commonly searched types of Semiconductor Wire Bond jobs? The most popular types of Semiconductor Wire Bond jobs are:
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Contract Semiconductor Wire Bond jobs near you
Infographic showing various Contract Semiconductor Wire Bond job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 90% Full Time, 4% Part Time, 1% Temporary, 3% Contract, and 1% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $44,825 per year, or $21.6 per hour.

Manufacturing Operations, Bonding Services

Tellus Solutions

Santa Rosa, CA • On-site

Other

Re-posted 22 days ago

Job description

Duties:
  • This position is in our semiconductor DieFab area in Santa Rosa, California. We manufacture integrated circuits in support of our internal and external customers.
  • You will be part of a team that handles both production and development circuits; you will work closely with engineering groups, area trainers and other operators.
  • Though you will be part of a team, you will be working independently to contribute to the area's goals. The scope and complexity of your work will be based on your current capabilities and your ability to gain new skills.
  • The bonding service position requires the ability to handle delicate products as instructed by the product documentation and engineering specifications.
  • Operators are responsible for following diagrams to solder, epoxy, and wire bond chips to packages so the parts can be tested for future reliability. This position requires hand eye coordination under a microscope.
Key Responsibilities:
  • Ability to handle small delicate IC's
  • Solder, epoxy, and wire bond small IC's under a microscope
  • Follow detailed process documentation to prepare test packages for reliability testing
  • Ability to communicate effectively with process and reliability engineers
  • Experience with inputting data using Microsoft applications
  • Working with MES to complete jobs
  • Follow strict ESD protocols
Skills:
Qualities:
  • Skilled hand-eye coordination under a microscope
  • Team communication and collaboration
  • Good verbal and written communication skills
  • Lean and 5S experience a plus
  • Microsoft Office skills
Desired Qualities:
  • Attention to detail.
  • Skilled in handling delicate products.
  • Strong focus and concentration.
  • Excellent verbal and written communication skills.
Education:
  • High school Diploma
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About Tellus Solutions

Sourced by ZipRecruiter

Tellus Solutions purpose is to provide effective business solutions leveraging cutting-edge technology and delivered with passion, competence and character. Be the best staffing service provider for our clients. Be the preferred employer of the best caliber professionals.

Industry

It services

Company size

51 - 200 Employees

Headquarters location

Santa Clara, CA, US

Year founded

2005

Social media

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