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Contract Semiconductor Wire Bond Jobs (NOW HIRING)

careers@micross.com

Senior Process Engineer

San Jose, CA · On-site

$100K - $150K/yr

Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace). * Knowledge in semiconductor manufacturing is a plus. * Self-motivated with the ability to align and ...

Micross

Senior Process Engineer

Milpitas, CA · On-site

$100K - $135K/yr

Experience: * Advanced understanding of Semiconductor processes. * Hands-on Experience in ... in Die Attach, Wire Bond or Mold * Knowledge of basic AutoCAD or Solidworks preferred.

Micross

Senior Process Engineer

Milpitas, CA · On-site

$100K - $135K/yr

Experience: * Advanced understanding of Semiconductor processes. * Hands-on Experience in ... in Die Attach, Wire Bond or Mold * Knowledge of basic AutoCAD or Solidworks preferred.

careers@micross.com

Senior Process Engineer

San Jose, CA · On-site

$100K - $150K/yr

Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace). * Knowledge in semiconductor manufacturing is a plus. * Self-motivated with the ability to align and ...

VOLT

Process Engineering Technician

Richardson, TX · On-site

Semiconductor assembly processes such as die attach, wire bond, molding, singulation, wafer thinning/saw, die pick, and related processes * Prototype, NPI (New Product Introduction), or high-mix/low ...

Micross

Sr Process Engineer

San Jose, CA · On-site

$100K - $119K/yr

Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace). * Knowledge in semiconductor manufacturing is a plus. * Self-motivated with the ability to align and ...

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All JobsContract Semiconductor Wire Bond Jobs

Contract Semiconductor Wire Bond information

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How much do contract semiconductor wire bond jobs pay per hour?

As of Aug 7, 2026, the average hourly pay for contract semiconductor wire bond in the United States is $21.55, according to ZipRecruiter salary data. Most workers in this role earn between $18.27 and $24.52 per hour, depending on experience, location, and employer.

What is the difference between Contract Semiconductor Wire Bond vs Contract Semiconductor Die Attacher?

AspectContract Semiconductor Wire BondContract Semiconductor Die Attacher
Primary RoleAttaches fine wires to connect semiconductor chips to packagesAttaches dies to substrates or packages during assembly
Required SkillsWire bonding techniques, precision handling, equipment operationDie placement, adhesive application, equipment operation
Work EnvironmentCleanroom, electronics manufacturing facilitiesElectronics assembly, cleanroom or production lines
CertificationsTypically requires technical training or certifications in electronics manufacturingSimilar certifications in assembly and handling of semiconductor components

Both roles are essential in semiconductor manufacturing, focusing on different stages of chip assembly. Contract Semiconductor Wire Bonds specialize in connecting chips with fine wires, while Contract Semiconductor Die Attachers focus on placing dies onto substrates. Understanding these differences helps in choosing the right job or service for semiconductor production needs.

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Contract Semiconductor Wire Bond jobs near you
Infographic showing various Contract Semiconductor Wire Bond job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 90% Full Time, 4% Part Time, 1% Temporary, 3% Contract, and 1% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $44,825 per year, or $21.6 per hour.

Senior OSAT Engineer (Part-Time, Contract)

Altera Corporation

San Jose, CA • On-site

$159K - $230K/yr

Part-time

Re-posted 23 days ago

Job description

Job Details:
Job Description:
About Altera
Altera is a global leader in FPGA and programmable logic solutions, enabling innovation in data center, communications, automotive, aerospace, and industrial markets. As we expand manufacturing capabilities for next-generation programmable devices, we are strengthening our OSAT engineering organization to deliver world-class backend manufacturing performance.
Role Summary
We are seeking a highly skilled Senior OSAT Engineer to drive outsourced assembly and test engineering activities across Altera's global supplier network. You will lead NPI readiness, yield optimization, cost improvements, and qualification activity for packaging and test flows supporting Altera's FPGA/SoC product lineup. This role requires strong semiconductor backend engineering experience, hands-on problem solving, and the ability to collaborate closely with OSAT partners and cross-functional stakeholders.
Key Responsibilities
  • Lead technical engagement with OSAT suppliers on assembly and test process development, yield ramp, quality improvement, and volume manufacturing readiness.
  • Drive new product introduction (NPI) from engineering builds through production release, ensuring OSAT capability meets electrical/thermal/mechanical requirements for FPGA and SoC products.
  • Optimize packaging and test architectures for performance, cost, and reliability: flip-chip BGA, high-pin-count packages, substrate technologies, wafer-level solutions, burn-in/FT coverage.
  • Monitor and improve backend yield performance using data-driven analysis; identify systemic issues and lead root cause / corrective actions.
  • Partner with Test Engineering, Packaging, Product Engineering, DFM, and Quality teams on process optimization, failure analysis, and manufacturability improvements.
  • Implement and maintain process control systems, SPC methodologies, automation improvements, and lean manufacturing principles at OSAT.
  • Support cost reduction initiatives including BOM optimization, process simplification, and cycle time improvements.
  • Track supplier performance metrics (yield, DPPM, cost, cycle time, OEE) and provide updates with risk assessments and mitigation plans.
  • Lead or support reliability testing and package qualification activities aligned to industry standards (JEDEC, IPC, AEC-Q).
  • Maintain strong technical relationship and communication cadence with OSAT partners to ensure transparency, collaboration, and escalation management.

Salary Range
The pay range below is for Bay Area California only. This is a part-time, hourly position that pays the equivalent hourly rate of the below salary range. Actual salary may vary based on a number of factors including job location, job-related knowledge, skills, experiences, trainings, etc.
$159,700 - $230,000 USD
We use artificial intelligence to screen, assess, or select applicants for the position. Applicants must be eligible for any required U.S. export authorizations.
Qualifications:
Qualifications:
Minimum Requirements
  • Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
  • 10+ years of semiconductor assembly, packaging, or test engineering experience.
  • Hands-on experience with OSAT manufacturing environments, including wafer finishing, substrate attach, interconnect packaging, test, and burn-in.
  • Strong technical understanding of backend manufacturing flows: flip-chip, wire bond, underfill, molding, final test, reliability stress and analysis.
  • Proven ability to analyze yield, reliability, and cost data to drive engineering decisions and improvements.
  • Demonstrated success working with international suppliers and cross-functional teams.
  • Strong written and verbal communication skills, including technical reporting and supplier engagement.

Preferred Qualifications
  • FPGA, ASIC, or SoC backend experience, particularly high-pin-count or high-power devices.
  • Experience in automotive or high-reliability product qualifications (AEC-Q / ISO standards).
  • Familiarity with advanced packaging: 2.5D/3D, fan-out WLP, heterogeneous integration.
  • Knowledge of supply chain risk mitigation, dual sourcing, and volume scaling strategies.
  • Experience with automation, traceability systems, and smart factory/manufacturing analytics.

Job Type:
Regular
Shift:
Shift 1 (United States of America)
Primary Location:
San Jose, California, United States
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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