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Contract Semiconductor Wire Bond Jobs (NOW HIRING)

VOLT

Process Engineering Technician

Richardson, TX · On-site

Semiconductor assembly processes such as die attach, wire bond, molding, singulation, wafer thinning/saw, die pick, and related processes * Prototype, NPI (New Product Introduction), or high-mix/low ...

Micross

Sr Process Engineer

San Jose, CA · On-site

$100K - $119K/yr

Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace). * Knowledge in semiconductor manufacturing is a plus. * Self-motivated with the ability to align and ...

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Contract Semiconductor Wire Bond information

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How much do contract semiconductor wire bond jobs pay per hour?

As of Aug 10, 2026, the average hourly pay for contract semiconductor wire bond in the United States is $21.55, according to ZipRecruiter salary data. Most workers in this role earn between $18.27 and $24.52 per hour, depending on experience, location, and employer.

What is the difference between Contract Semiconductor Wire Bond vs Contract Semiconductor Die Attacher?

AspectContract Semiconductor Wire BondContract Semiconductor Die Attacher
Primary RoleAttaches fine wires to connect semiconductor chips to packagesAttaches dies to substrates or packages during assembly
Required SkillsWire bonding techniques, precision handling, equipment operationDie placement, adhesive application, equipment operation
Work EnvironmentCleanroom, electronics manufacturing facilitiesElectronics assembly, cleanroom or production lines
CertificationsTypically requires technical training or certifications in electronics manufacturingSimilar certifications in assembly and handling of semiconductor components

Both roles are essential in semiconductor manufacturing, focusing on different stages of chip assembly. Contract Semiconductor Wire Bonds specialize in connecting chips with fine wires, while Contract Semiconductor Die Attachers focus on placing dies onto substrates. Understanding these differences helps in choosing the right job or service for semiconductor production needs.

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Contract Semiconductor Wire Bond jobs near you
Infographic showing various Contract Semiconductor Wire Bond job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 90% Full Time, 4% Part Time, 1% Temporary, 3% Contract, and 1% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $44,825 per year, or $21.6 per hour.

Automatic/Manual Wire Bonding Operator

MACOM Technology Solutions Holdings

Lowell, MA • On-site

$20 - $35/hr

Full-time

Medical, Dental, PTO

Re-posted 14 days ago

Job description

MACOM designs and manufactures semiconductor productsfor Data Center, Telecommunication and Industrial and Defense applications.Headquartered in Lowell, Massachusetts, MACOM has design centers and salesoffices throughout North America, Europe and Asia. MACOM is certified to theISO9001 international quality standard and ISO14001 environmental managementstandard.
MACOM has more than 75 years of application expertise with multiple designcenters, Si, GaAs and InP fabrication, manufacturing, assembly and test, andoperational facilities throughout North America, Europe, and Asia. Click hereto view our facilities. In addition, MACOM offers foundry services thatrepresent a key core competency within our business.
MACOM sells and distributes products globally via a sales channel comprised ofa direct field sales force, authorized sales representatives and leadingindustry distributors. Our sales team is trained across all of our products togive our customers insights into our entire portfolio.
Automatic/Manual Wire Bonding Operator
This role will be an assembly operator working with Automatic/Manual wire bonding.
Responsibilities:
  • Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
  • Operate and set-up Automatic Gold wire/ribbon bonders (H+K 820 systems or F&K Delvotec) per micro-circuit layout drawings
  • Operator is responsible for proper wire formation, bond appearance and bond strength.
  • Flexibility to be trained in multiple Microelectronics processes that involve Ribbon, ball & wedge wire bonding
  • Capable of performing bond pull/die shear and plotting SPC with data
  • Familiarity of the use of plasma cleaning and other surface preparation for semiconductors and substrates
  • Requires significant attention to detail for production activities and documentation to maintain compliance with MIL-STD 883 requirements
  • Familiarity with FOD prevention and management
  • Familiar with ESD controls

Experience and Education
  • Ability to set-up, operate and adjust (H+K 820 systems or F&K Delvotec) or ability to learn to run a variety of microelectronic production equipment.
  • Minimum of 2 years' experience in microelectronics module assembly area.
  • High School diploma required.

Knowledge and Skill Requirements:
  • Gold wire/ribbon bonding to a variety of die and substrates.
  • Capable of programming equipment helpful
  • Capable of threading wire

Physical Environment and Working Conditions:
  • Clean-room environment with Smocks, masks and gloves.
  • Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

The Hourly Range for this position is $20- $35 perhour. Actual salary offered to candidates will depend on several factors,including but not limited to, work location, relevant candidates' experience,education, and specific knowledge, skills, and abilities.
EEO:
MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis ofrace, color, religion, sex, gender identity, sexual orientation, nationalorigin, age, disability, genetic information, veteran status, military service,marital status, or any other category protected under applicable law.
Reasonable Accommodation:
MACOM is committed to working with and providing reasonable accommodations toqualified individuals with physical and mental disabilities. If you havea disability and are in need of a reasonable accommodation with respect to anypart of the application process please call +1-978-656-2500 or emailHR_Ops@MACOM.com. Provide your name, phone number and the position titleand location in which you are interested, and nature of accommodation needed,and we will get back to you. We also work with current employees whorequest or need reasonable accommodation in order to perform the essentialfunctions of their jobs.
Benefits: This positionoffers a comprehensive benefits package including but not limited to:
• Health, dental, and visioninsurance.
• Employer-sponsored 401(k)plan.
• Paid time off.
• Professional developmentopportunities.

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