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Chip Design Jobs in Dallas, TX (NOW HIRING)

Texas Instruments

DFM RET Engineer

Dallas, TX · On-site

At 28nm and below, photolithography cannot simply print a chip design as drawn but rather optical diffraction causes critical features to print incorrectly, with direct consequences to yield and ...

Texas Instruments

Digital IC Design Engineer

Dallas, TX

$123K/yr

Conduct chip architecture trade-off analysis to ensure spec compliance at competitive cost * Participate in design reviews and produce thorough design and product documentation * Supervise IC layout ...

Texas Instruments

Digital IC Design Engineer

Dallas, TX · On-site

$123K/yr

Conduct chip architecture trade-off analysis to ensure spec compliance at competitive cost * Participate in design reviews and produce thorough design and product documentation * Supervise IC layout ...

Raytheon

Senior RF Design Engineer

Dallas, TX

Testing or designing RF hybrid (chip and wire) technologies * High speed data converter test/characterization * High power RF design or test experience * Scripting experience (Matlab or Python)

Texas Instruments

DFM RET Engineer

Dallas, TX

At 28nm and below, photolithography cannot simply print a chip design as drawn but rather optical diffraction causes critical features to print incorrectly, with direct consequences to yield and ...

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Showing results 21-40

All JobsChip Design JobsChip Design Jobs in Dallas, TX

Chip Design information

See Dallas, TX salary details

$41.7K

$113.7K

$200.2K

How much do chip design jobs pay per year?

As of Sep 2, 2026, the average yearly pay for chip design in Dallas, TX is $113,740.00, according to ZipRecruiter salary data. Most workers in this role earn between $83,000.00 and $143,100.00 per year, depending on experience, location, and employer.

What is a chip design?

A Chip Design job involves creating and developing semiconductor circuits used in electronic devices. Engineers in this field work on designing, verifying, and testing integrated circuits (ICs) to ensure performance, power efficiency, and reliability. They use specialized software tools for designing hardware and optimizing functionality. Chip designers collaborate with cross-functional teams to bring new processors, memory chips, or custom ASICs from concept to production. This role is crucial in industries like computing, telecommunications, and consumer electronics.

What are the key skills and qualifications needed to thrive in chip design?

To excel in Chip Design, a strong background in electrical engineering, digital and analog circuit design, and semiconductor physics is typically required, often supported by a relevant engineering degree. Familiarity with electronic design automation (EDA) tools like Cadence, Synopsys, and Mentor Graphics, as well as proficiency in hardware description languages (HDLs) such as Verilog or VHDL, are standard prerequisites. Outstanding problem-solving skills, attention to detail, and the ability to collaborate closely with cross-functional teams set candidates apart. These competencies are essential for designing efficient, reliable integrated circuits and meeting the evolving needs of the semiconductor industry.

What are the typical career progression opportunities in chip design?

Chip Design offers a clear pathway for career growth, starting from entry-level positions such as Design Engineer or Verification Engineer and progressing to roles like Lead Designer, Project Manager, or Technical Architect. As you gain experience and demonstrate expertise, opportunities often open up in specialized areas such as physical design, timing analysis, or system architecture. Many professionals also advance to leadership or managerial positions, overseeing teams or entire design projects. Additionally, working in such a fast-evolving field keeps you engaged with the latest technologies and can provide options to transition into adjacent areas like product management or application engineering.

How much do chip designers make?

Chip designers, also known as integrated circuit designers, typically earn between $80,000 and $150,000 annually, depending on experience, education, and location. Senior roles or those with specialized skills in hardware description languages and CAD tools can earn higher salaries, often exceeding $200,000.

How to get a job in chip design?

To get a job in chip design, candidates typically need a bachelor's degree in electrical engineering, computer engineering, or a related field, along with strong skills in digital and analog circuit design, hardware description languages like VHDL or Verilog, and familiarity with CAD tools. Gaining experience through internships, projects, or research can improve employability, and advanced roles may require a master's or Ph.D. in a relevant area. Certifications in specific design tools or methodologies can also enhance prospects.

Is chip design a good career?

Chip design is a specialized field within electrical engineering focused on developing integrated circuits and microprocessors. It offers high demand, competitive salaries, and opportunities for innovation, often requiring skills in hardware description languages and familiarity with CAD tools. Career growth depends on technical expertise and industry experience.

What are popular job titles related to Chip Design jobs in Dallas, TX?

For Chip Design jobs in Dallas, TX, the most frequently searched job titles are:

What job categories do people searching Chip Design jobs in Dallas, TX look for?

The top searched job categories for Chip Design jobs in Dallas, TX are:

What cities near Dallas, TX are hiring for Chip Design jobs?

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Chip Design jobs near you
Infographic showing various Chip Design job openings in Dallas, TX as of August 2026, with employment types broken down into 87% Full Time, and 13% Contract. Highlights an 87% In-person, and 13% Remote job distribution, with an average salary of $113,740 per year, or $54.7 per hour.

Director, Package Design Engineering

Renesas Electronics

Dallas, TX • On-site

Full-time

Posted 16 days ago

Job description

Company Description
Company Description
Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world leading MCUs, SoCs, Analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world's leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you.
Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what's next in electronics and the world.
Job Description
Responsibilities:
  • Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs.
  • Focus on design and development of package and interconnect methods for Renesas's AI/Datacenter Infrastructure Power packaging needs especially Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FET packages. Scope also involves WBG (Ie. SiC & GaN) development along with DBC, AMB substrates and advanced interconnect technologies. Knowledge of wafer level, flip-chip, multi-chip module and power devices will be a plus.
  • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
  • Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
  • Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
  • Resolve all process integration issues by ensuring all window checks are done on critical process steps.
  • Establish production controls and monitors to ensure there is no room for quality incidents.
  • Ensure smooth transition into production & implement ramp up monitor.
  • Work with OSAT/CM to monitor and resolve process issues early in the production phase to ensure only parts with superior quality shipped to customer.
  • Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.
  • Participate in packaging roadmap development & focus on execution.
  • Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
  • Establish & maintain package design rules.

Qualifications
Qualifications:
  • Doctorate/Masters / Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
  • 15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
  • Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
  • Knowledge of wire-bonding & multi-chip module technologies a plus.
  • Strong interpersonal and communication skills.
  • Strong analytical and presentation skills.

Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
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