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Chip Design Engineer Jobs in Arizona (NOW HIRING)

I/O Design Engineer

Chandler, AZ · On-site

$110 - $176/hr

Support chip-level integration and silicon bring-up in test chips and customer products. Technical ... MS or PhD in Electrical Engineering. * 6+ years of I/O or analog circuit design experience. * Deep ...

Support chip-level integration and silicon bring-up in test chips and customer products. Technical ... MS or PhD in Electrical Engineering. * 6+ years of I/O or analog circuit design experience. * Deep ...

Support chip-level integration and silicon bring-up in test chips and customer products. Technical ... MS or PhD in Electrical Engineering. * 6+ years of I/O or analog circuit design experience. * Deep ...

CPU RTL Design Engineer

Phoenix, AZ · On-site

$141K - $269K/yr

As a CPU Logic Design Engineer, you will play a critical role in designing and optimizing the logic ... into full-chip designs. Your expertise will be pivotal in defining architecture and ...

RF Design Engineer II

Tucson, AZ · On-site

$80 - $100/hr

Effector RF Design Department is responsible for designing RF and microwave hardware, including ... designing RF hybrid (chip and wire) technologies, and high‑speed data converter test ...

Staff Analog Design Engineer

Chandler, AZ · On-site

$198K/yr

Simulate and verify circuit and chip-level performance using Spectre and mixed-signal methodologies ... Engineering, or related field: * Bachelor's with 7+ years of relevant IC design experience.

Senior Analog Design Engineer

Chandler, AZ · On-site

$198K/yr

Simulate and verify circuit and chip-level performance using Spectre and mixed-signal methodologies ... Engineering, or related field: * Bachelor's with 5+ years of relevant IC design experience.

Principal RF Design Engineer

Tucson, AZ · On-site

$107.50 - $204.50/hr

Design of circuit card assemblies (CCAs) with RF or mixed signals. * Work in a lab to accomplish ... Testing or designing RF hybrid (chip and wire) technologies. * High‑speed data converter test ...

Senior Digital Design Engineer

Chandler, AZ · On-site

$133K/yr

In this role, you will contribute to the design of system-on-chip (SoC) devices, digital signal ... Degree in Electrical Engineering, Computer Engineering, or a related technical field. * Bachelor ...

Showing results 21-40

Chip Design Engineer information

See Arizona salary details

$37.7K

$82.1K

$147.7K

How much do chip design engineer jobs pay per year?

As of Sep 6, 2026, the average yearly pay for chip design engineer in Arizona is $82,145.00, according to ZipRecruiter salary data. Most workers in this role earn between $63,400.00 and $91,800.00 per year, depending on experience, location, and employer.

What is a chip design engineer?

A Chip Design Engineer is responsible for designing and developing integrated circuits (ICs) used in electronic devices. They work with hardware description languages (HDLs) like Verilog or VHDL to create digital or analog circuit designs. Their role includes logic design, verification, simulation, and testing to ensure performance and power efficiency. They collaborate with teams across hardware, software, and manufacturing to bring chips from concept to production. Chip Design Engineers are essential in industries like consumer electronics, automotive, and telecommunications.

What are some typical projects or daily tasks for a chip design engineer?

As a Chip Design Engineer, your daily tasks often include designing and simulating integrated circuits, reviewing schematics, writing and verifying code in hardware description languages, and collaborating closely with layout engineers and verification teams. You may also participate in design reviews, troubleshoot potential issues, and optimize chip performance to meet specific requirements. Working with cross-functional teams, including software engineers and product managers, is common to ensure the chip integrates seamlessly with end products. This role provides opportunities to see your designs progress from concept to final manufacturing, offering valuable hands-on experience at each stage of development.

What are the key skills and qualifications needed to thrive as a chip design engineer?

To thrive as a Chip Design Engineer, you need a solid background in electrical engineering, digital and analog circuit design, and experience with VLSI principles, usually backed by a relevant degree. Proficiency with industry-standard tools like Cadence, Synopsys, and experience in HDL languages (such as Verilog or VHDL) is highly valued, as are certifications like Certified IC Designer. Strong problem-solving abilities, attention to detail, and effective teamwork and communication skills help set you apart. These competencies are critical for developing reliable, high-performance chips in a collaborative and deadline-driven environment.

How much do chip design engineers make?

Chip design engineers typically earn a median annual salary ranging from $90,000 to $130,000, depending on experience, location, and industry. Senior engineers with specialized skills in VLSI design or FPGA development can earn higher salaries, often exceeding $150,000 annually.

What does a chip design engineer do?

A chip design engineer develops and designs integrated circuits and microchips used in electronic devices. They use electronic design automation (EDA) tools, create schematics, simulate circuit performance, and collaborate with manufacturing teams to ensure the chips meet specifications and quality standards.

What is the salary of chip design engineer?

The average salary of a chip design engineer varies by experience and location but typically ranges from $80,000 to $150,000 annually. Senior engineers with specialized skills in VLSI design and FPGA development can earn higher salaries, often exceeding $180,000. Certifications and proficiency in tools like Cadence or Synopsys can also influence compensation.

What cities in Arizona are hiring for Chip Design Engineer jobs?

Cities in Arizona with the most Chip Design Engineer job openings:

Infographic showing various Chip Design Engineer job openings in Arizona as of August 2026, with employment types broken down into 87% Full Time, 11% Part Time, and 2% Contract. Highlights an 85% Physical, 4% Hybrid, and 11% Remote job distribution, with an average salary of $82,145 per year, or $39.5 per hour.

Senior Staff Package Design Engineer

Renesas Electronics

Tempe, AZ • On-site

Full-time

Posted 12 days ago


Job description

Company Description
Job Description
  • Design and develop package and interconnect methods for Renesas's packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging.
  • Package technologies qualification for consumer & industrial power as well as automotive power applications.
  • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
  • Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
  • Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
  • Resolve all process integration issues by ensuring all window checks are done on critical process steps.
  • Establish production controls and monitor to ensure there is no room for quality incidents.
  • Ensure smooth transition into production & implement ramp up monitor.
  • Work with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer.
  • Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA.
  • Participate in packaging roadmap development & focus on execution.
  • Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
  • Establish & maintain package design rules.

Qualifications
• Doctorate/Masters / Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
• Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.
Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
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