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Ai Chip Design Rtl Jobs in Colorado (NOW HIRING)

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages ... AI), networking, high-performance computing (HPC), and 5G base stations.These designs include ...

Broadcom is seeking an IC package-design engineer for complex flip-chip-BGA packages for industry ... AI), networking, high-performance computing (HPC), and 5G base stations.These designs include ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages ... AI), networking, high-performance computing (HPC), and 5G base stations. These designs include ...

Senior Product Manager

Colorado Springs, CO

$124K - $164K/yr

While deep protocol-level PCIe chip design expertise is not required, you must bring a strong, holistic understanding of modern data center server architectures-specifically AI/ML server topologies ...

Come join the team creating technology that fuels the next generation AI/ML networks, mobile ... BSEE and 18+ years of industry experience in RTL design is a must, or MSEE and 16 experience using ...

Join a world-class engineering group developing custom CMOS ASICs for cutting-edge AI, Cellular ... Gain exposure to the complete ASIC design cycle -- from RTL to GDSII and silicon bring‑up.

Come join the team creating technology that fuels the next generation AI/ML networks, mobile ... BSEE and 18+ years of industry experience in RTL design is a must, or MSEE and 16 experience using ...

Our team works closely with networking chip design teams in co-designing new hardware features and ... Today, we stand at the beginning of the next era, the AI computing era, ignited by a new computing ...

... AI), networking, high-performance computing (HPC), and 5G base stations.These designs include ... BSEE/MSEE or similar field and 12+ years of experience in flip-chip-BGA package design, including ...

Our team works closely with networking chip design teams in co-designing new hardware features and ... Today, we stand at the beginning of the next era, the AI computing era, ignited by a new computing ...

Join a world-class engineering group developing custom CMOS ASICs for cutting-edge AI, Cellular ... Gain exposure to the complete ASIC design cycle - from RTL to GDSII and silicon bring-up.

Join a world-class engineering group developing custom CMOS ASICs for cutting-edge AI, Cellular ... Gain exposure to the complete ASIC design cycle - from RTL to GDSII and silicon bring-up.

FPGA Designer

Denver, CO · On-site

$126K - $174K/yr

RTL design and verification including test benches, functional simulations, and timing closure ... Embraces AI as part of a modern engineering toolkit * Degree as a B.A.Sc., B.Eng. or equivalent

Showing results 41-60

Ai Chip Design Rtl information

What is an AI Chip Design RTL engineer?

AI Chip Design RTL (Register Transfer Level) engineers are specialists who design the digital logic for chips used in artificial intelligence applications. They use hardware description languages like Verilog or VHDL to create and validate the architecture and functionality of these chips before they are manufactured. Their work ensures that AI processors are efficient, high-performing, and meet the requirements of modern AI workloads. RTL engineers collaborate closely with verification, software, and hardware teams to optimize chip performance and power consumption.

What skills and qualifications are needed to thrive as an AI Chip Design RTL engineer?

To thrive as an AI Chip Design RTL Engineer, you need a solid background in digital design, computer architecture, and proficiency in Hardware Description Languages (HDLs) like Verilog or VHDL, often supported by a degree in electrical or computer engineering. Experience with simulation tools (e.g., ModelSim, Synopsys), ASIC/FPGA design flows, and relevant certifications are highly valued. Strong problem-solving abilities, attention to detail, and effective teamwork and communication skills help you excel in collaborative and complex design environments. These competencies are crucial for creating efficient, reliable AI hardware that meets performance and power requirements in a fast-evolving field.

What are common challenges faced by AI Chip Design RTL engineers during the verification process?

AI Chip Design RTL engineers often encounter challenges in ensuring their designs meet complex functional and performance requirements, especially given the rapid pace of AI hardware advancements. Verification can be particularly demanding due to the need to simulate and test intricate AI workloads, manage large datasets, and debug subtle timing or logic errors. Collaboration with verification teams, system architects, and software engineers is essential to address these issues efficiently and to ensure seamless integration of the RTL code into the broader chip design. Staying up-to-date with the latest verification tools and methodologies is also crucial for success in this role.

What is the difference between Ai Chip Design Rtl vs Ai Chip Verification Engineer?

AspectAi Chip Design RtlAi Chip Verification Engineer
Primary FocusDeveloping and implementing Register Transfer Level (RTL) code for AI chipsVerifying and validating RTL designs to ensure functionality
Skills RequiredHDL languages (Verilog/VHDL), digital design, FPGA/ASIC knowledgeSimulation, testbench creation, debugging, scripting skills
Work EnvironmentDesign teams, hardware development labs, EDA toolsVerification teams, simulation environments, test setups
CertificationsHardware design certifications, FPGA/ASIC trainingVerification methodologies, UVM, SystemVerilog certifications

While Ai Chip Design Rtl focuses on creating the hardware description code for AI chips, Ai Chip Verification Engineer ensures that the RTL design functions correctly through rigorous testing. Both roles require knowledge of HDL languages and work closely within hardware development teams, but their core responsibilities differ—design versus verification.

What job categories do people searching Ai Chip Design Rtl jobs in Colorado look for?

The top searched job categories for Ai Chip Design Rtl jobs in Colorado are:

What cities in Colorado are hiring for Ai Chip Design Rtl jobs?

Cities in Colorado with the most Ai Chip Design Rtl job openings:

Infographic showing various Ai Chip Design Rtl job openings in Colorado as of August 2026, with employment types broken down into 87% Full Time, 9% Part Time, and 4% Contract. Highlights an 84% Physical, 5% Hybrid, and 11% Remote job distribution.

Package Design Engineer

Fort Collins, CO

Broadcom
Semiconductor and Electronic Component Manufacturing • 10K+ employees

$134K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 14 days ago


Broadcom rating

8.7

Company rating: 8.7 out of 10

Based on 23 frontline employees who took The Breakroom Quiz


Job description

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Job Description:

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

RESPONSIBILITIES:

  • Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.

  • Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.

  • Schedule, prioritize, & track your work across 2+ projects simultaneously

  • General flip-chip BGA package design & engineering

  • Project management and customer interface for your design projects

  • Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.

  • Physical design (layout) is a foundational responsibility in this role


EDUCATION/EXPERIENCE & REQUIREMENTS:

  • BSEE or similar field and 8+ years' experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 6+ years' work experience

  • Knowledge of package-level signal integrity and power integrity, to apply to package designs

  • Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.

  • Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

  • Self-management and organization skills

  • Preferred candidates will also have1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

OTHER REQUIREMENTS

  • This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position.


Compensation and Benefits


The annual base salary range for this position is USD 121,900.00 To USD 195,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.


Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.


Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.


If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.


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