SAMTEC
SAMTEC

60 Samtec Senior Applications Engineer Jobs Hiring Near You

Descripcion Puesto en Samtec, Inc Founded in 1976, Samtec is a privately held, $950 million global ... The Senior SI Test Engineer will mentor fellow engineers, lead root-cause analysis activities, and ...

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and ... applications. IC development tasks include the architecture definition, circuit design, synthesis ...

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Advanced Packaging Engineer

Advanced Packaging Engineer

Samtec, Inc

Colorado Springs, CO • On-site

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

This job post has expired today. Applications are no longer accepted.


Samtec rating

8.4

Company rating: 8.4 out of 10

Based on 8 frontline employees who took The Breakroom Quiz

22nd of 139 rated electronics manufacturers


Job description

Founded in 1976, Samtec is a privately held, $1 billion global manufacturer of broad line electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service. 
 

Position Summary

The Advanced Packaging Engineer is a senior individual contributor responsible for conceiving, architecting, and maturing next‑generation optical and optoelectronic technologies. This role focuses on future‑state capability creation, advanced materials and packaging architectures, and long‑term technology differentiation. The position operates upstream of production and is not responsible for sustaining engineering or day‑to‑day manufacturing support.


Essential Duties and Responsibilities

Advanced Technology & Architecture Development

  • Define and develop next‑generation optical and optoelectronic packaging architectures.
  • Lead architectural trade studies considering optical performance, materials behavior, and future scalability.
  • Establish technology concepts that enable future product families and platforms.

Research & Early‑Stage Development

  • Research emerging materials, processes, and assembly technologies aligned with long‑term company roadmaps.
  • Lead feasibility studies, proof‑of‑concept efforts, and early‑stage demonstrations.
  • Evaluate technology readiness levels and define pathways for maturation.

Characterization & Reliability Strategy

  • Define characterization and reliability evaluation methodologies for early‑stage technologies.
  • Analyze optical, mechanical, and thermal data to inform design decisions.
  • Identify technical risks and failure mechanisms early in development.

Technology Strategy & Roadmapping

  • Contribute to long‑term optics and optoelectronics technology roadmaps.
  • Identify capability gaps and propose strategic development initiatives.
  • Support senior leadership through technical reviews and risk assessments.

External Collaboration

  • Identify, evaluate, and partner with material suppliers, equipment vendors, and research institutions.
  • Lead joint development initiatives with external partners.
  • Influence external technology roadmaps to align with future needs.

Technical Leadership

  • Serve as a recognized technical authority for advanced optical technologies.
  • Contribute to intellectual property, publications, and technical knowledge growth.
  • Mentor engineers on advanced technology concepts.

Required Education

  • BS in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or a related field required.
  • MS or Ph.D. preferred.

Required Experience

  • 15+ years of experience in optical, optoelectronic, or advanced microelectronics development.
  • Extensive background in materials, packaging architectures, and advanced process development.
  • Demonstrated experience creating and maturing new technologies from concept through early validation.
  • Proven record of technical leadership and independent problem solving.
 
Salary and benefit offerings:
The preferred location for this position is the Samtec Vista Design Center in San Diego/Vista, CA. At this site, the salary range is $187,000 – $212,000 annually, based on experience, plus generous Samtec bonuses paid three times per year (February, August, and late fall).
A secondary option is the Silicon Valley Design Center in Santa Clara, CA, where the salary range is $220,000 – $250,000 annually, based on experience, plus the same bonus structure.
The third location is the Samtec Microelectronics facility in Colorado Springs, CO, with a salary range of $159,000 – $180,000 annually, based on experience, plus bonuses as noted above.
Relocation assistance is available only for moves to the preferred location (San Diego/Vista, CA).
Samtec's generous benefits package includes medical (HSA/PPO) dental, vision, hearing, group life, AD&D, short- and long-term disability, EAP, 401K match / profit sharing (Samtec will contribute 7% of your total gross pay to your 401(k) plan regardless of any contributions you make and will match the first 5% of your contribution to the 401(k)-plan dollar for dollar), plus other voluntary options, as well as paid time off.
 
Apply now if you have what it takes and are interested in joining Samtec’s vaunted culture, with competitive salaries and world-class benefits.
 
 

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About SAMTEC

Sourced by ZipRecruiter

Industry

Electrical equipment, appliance, and component manufacturing

Company size

1,001 - 5,000 Employees

Headquarters location

New Albany, IN, US

Year founded

1976

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