Engineering Group, Engineering Group > Packaging Engineering General Summary: We are seeking a ... Familiarity with advanced packaging interaction (SiP, substrate, bridge-based systems) * Experience ...
Engineering Group, Engineering Group > Packaging Engineering General Summary: We are seeking a ... Familiarity with advanced packaging interaction (SiP, substrate, bridge-based systems) * Experience ...
NPI Process Engineer
Covington, GA · On-site
Substrate manufacturer background is the strongest fit; OSAT packaging engineering experience is also well-suited for this role. Responsibilities & Duties: Product Development * Own new GCS product ...
NPI Process Engineer
Covington, GA · On-site
Substrate manufacturer background is the strongest fit; OSAT packaging engineering experience is also well-suited for this role. Responsibilities & Duties: Product Development * Own new GCS product ...
Electromechanical Packaging Engineer
$150K - $200K/yr
Collaborate with substrate layout, ASIC design, and manufacturing engineers. * Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components ...
Electromechanical Packaging Engineer
$150K - $200K/yr
Collaborate with substrate layout, ASIC design, and manufacturing engineers. * Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components ...
Electromechanical Packaging Engineer
Torrance, CA · On-site
$150K - $200K/yr
Collaborate with substrate layout, ASIC design, and manufacturing engineers. * Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components ...
Electromechanical Packaging Engineer
Torrance, CA · On-site
$150K - $200K/yr
Collaborate with substrate layout, ASIC design, and manufacturing engineers. * Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components ...
Tech Integration Process Engineer
Covington, GA · On-site
$70K - $80K/yr
Company Description Absolics Inc. is the world's first glass substrate manufacturer and a leader in ... Position: TECH INTEGRATION PROCESS ENGINEER Location: COVINGTON, GA JOB SUMMARY: We are seeking a ...
Tech Integration Process Engineer
Covington, GA · On-site
$70K - $80K/yr
Company Description Absolics Inc. is the world's first glass substrate manufacturer and a leader in ... Position: TECH INTEGRATION PROCESS ENGINEER Location: COVINGTON, GA JOB SUMMARY: We are seeking a ...
Staff Package Design Engineer
Austin, TX · On-site
... Engineer to join our Advanced Silicon Packaging team located in our Austin, TX or Tempe, AZ offices ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
Quick apply
Staff Package Design Engineer
Austin, TX · On-site
... Engineer to join our Advanced Silicon Packaging team located in our Austin, TX or Tempe, AZ offices ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
Staff Package Design Engineer
Tempe, AZ · On-site
... Engineer to join our Advanced Silicon Packaging team. In this role, you will design and deliver ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
Quick apply
Staff Package Design Engineer
Tempe, AZ · On-site
... Engineer to join our Advanced Silicon Packaging team. In this role, you will design and deliver ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
... Engineer to join our Advanced Silicon Packaging team located in our Austin, TX or Tempe, AZ offices ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
... Engineer to join our Advanced Silicon Packaging team located in our Austin, TX or Tempe, AZ offices ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
Principal Site Reliability Engineer - CTJ - Secret
Redmond, WA · On-site
$63.75 - $84.75/hr
Substrate services operate at global scale and are designed to deliver high availability ... As a Principal Site Reliability Engineer , you will set technical and operational direction for ...
Principal Site Reliability Engineer - CTJ - Secret
Redmond, WA · On-site
$63.75 - $84.75/hr
Substrate services operate at global scale and are designed to deliver high availability ... As a Principal Site Reliability Engineer , you will set technical and operational direction for ...
... Engineer to join our Advanced Silicon Packaging team. In this role, you will design and deliver ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
... Engineer to join our Advanced Silicon Packaging team. In this role, you will design and deliver ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
Staff Package Design Engineer
Tempe, AZ · On-site
... Engineer to join our Advanced Silicon Packaging team. In this role, you will design and deliver ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
Staff Package Design Engineer
Tempe, AZ · On-site
... Engineer to join our Advanced Silicon Packaging team. In this role, you will design and deliver ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
IC Packaging Design Engineer
Chandler, AZ · On-site
$138K/yr
The ideal candidates will possess strong expertise in package and substrate design, with hands-on ... and reliability engineering teams. * Support design reviews, issue resolution, and continuous ...
IC Packaging Design Engineer
Chandler, AZ · On-site
$138K/yr
The ideal candidates will possess strong expertise in package and substrate design, with hands-on ... and reliability engineering teams. * Support design reviews, issue resolution, and continuous ...
Senior Package Design Engineer
Boise, ID · On-site
The Global Design, Simulation, and Substrate team at Micron Technology is a world-class group of engineers developing advanced semiconductor packaging solutions for memory products including DRAM and ...
Senior Package Design Engineer
Boise, ID · On-site
The Global Design, Simulation, and Substrate team at Micron Technology is a world-class group of engineers developing advanced semiconductor packaging solutions for memory products including DRAM and ...
OR · On-site
$200K - $280K/yr
Define and review substrate stack-ups, via strategies, impedance control, escape routing, and ... Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a ...
The Global Design, Simulation, and Substrate team at Micron Technology is a world-class group of engineers developing advanced semiconductor packaging solutions for memory products including DRAM and ...
The Global Design, Simulation, and Substrate team at Micron Technology is a world-class group of engineers developing advanced semiconductor packaging solutions for memory products including DRAM and ...
Staff Package Design Engineer
Austin, TX · On-site
... Engineer to join our Advanced Silicon Packaging team located in our Austin, TX or Tempe, AZ offices ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
Staff Package Design Engineer
Austin, TX · On-site
... Engineer to join our Advanced Silicon Packaging team located in our Austin, TX or Tempe, AZ offices ... Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and ...
Principal ASIC Package Design Engineer
$200K - $280K/yr
Define and review substrate stack-ups, via strategies, impedance control, escape routing, and ... Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a ...
Principal ASIC Package Design Engineer
$200K - $280K/yr
Define and review substrate stack-ups, via strategies, impedance control, escape routing, and ... Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a ...
Senior ASIC Package Design Engineer
Seattle, WA · On-site
$180K - $260K/yr
Define and review substrate stack-ups, via strategies, impedance control, escape routing, and ... Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a ...
Senior ASIC Package Design Engineer
Seattle, WA · On-site
$180K - $260K/yr
Define and review substrate stack-ups, via strategies, impedance control, escape routing, and ... Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a ...
Reliability & Yield Engineering Manager
Albuquerque, NM · On-site
$93K - $117K/yr
The role will support glass-core and organic-core substrate technologies, including TGV structures ... Primary Responsibilities Yield Engineering * Lead yield improvement programs across the substrate ...
Quick apply
Reliability & Yield Engineering Manager
Albuquerque, NM · On-site
$93K - $117K/yr
The role will support glass-core and organic-core substrate technologies, including TGV structures ... Primary Responsibilities Yield Engineering * Lead yield improvement programs across the substrate ...
Sr. Director, Thermal Mechanical
Seattle, WA · On-site +1
$175K - $225K/yr
Collaborate with OSATs, substrate suppliers, thermal solution vendors, and manufacturing partners to enable scalable deployment. What You Bring * MS or PhD in Mechanical Engineering, Thermal ...
Sr. Director, Thermal Mechanical
Seattle, WA · On-site +1
$175K - $225K/yr
Collaborate with OSATs, substrate suppliers, thermal solution vendors, and manufacturing partners to enable scalable deployment. What You Bring * MS or PhD in Mechanical Engineering, Thermal ...
Substrate Engineer information
See salary details
$24K - $37.5K
0% of jobs
$37.5K - $50.9K
5% of jobs
$50.9K - $64.4K
8% of jobs
$64.4K - $77.8K
6% of jobs
$83.4K is the 25th percentile. Wages below this are outliers.
$77.8K - $91.3K
13% of jobs
The median wage is $104.7K / yr.
$91.3K - $104.7K
18% of jobs
$104.7K - $118.2K
16% of jobs
$129.2K is the 75th percentile. Wages above this are outliers.
$118.2K - $131.6K
11% of jobs
$131.6K - $145.1K
9% of jobs
$145.1K - $158.5K
8% of jobs
$158.5K - $172K
5% of jobs
$24K
$108K
$172K
How much do substrate engineer jobs pay per year?
What are some common challenges Substrate Engineers face when working on high-density interconnect (HDI) designs?
What engineers make $300,000 a year?
What are the 7 types of engineers?
Are materials engineers in high demand?
What is a Substrate Engineer?
What engineers make $500,000 a year?
What is the difference between Substrate Engineer vs Semiconductor Process Engineer?
| Aspect | Substrate Engineer | Semiconductor Process Engineer |
|---|---|---|
| Credentials | Bachelor's or Master's in Materials Science, Electrical Engineering, or related fields | Bachelor's or Master's in Electrical Engineering, Chemical Engineering, or related fields |
| Work Environment | Research labs, fabrication facilities, semiconductor manufacturing plants | Cleanrooms, fabrication facilities, process development labs |
| Industry Usage | Semiconductor manufacturing, electronics, integrated circuits | Semiconductor fabrication, chip production, process optimization |
| Common Search/Comparison | Yes | Yes |
Substrate Engineers focus on developing and optimizing the materials and layers used in semiconductor devices, while Semiconductor Process Engineers work on the overall manufacturing processes to produce chips efficiently. Both roles require similar educational backgrounds and often collaborate within the semiconductor industry, but their specific responsibilities differ in scope and focus.
What are the key skills and qualifications needed to thrive as a Substrate Engineer, and why are they important?

Full-time
Posted 14 days ago
Qualcomm rating
9.6
Based on 5 frontline employees who took The Breakroom Quiz
5th of 209 rated software companies
Job description
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
We are seeking a highly experienced PCB Engineer to drive next-generation Datacenter and High-performance computing (HPC) platforms.
This role will focus on advanced PCB technologies, manufacturability optimization, and supplier engagement, supporting both NPI and volume production while shaping Qualcomm's future hardware roadmap.
Key Responsibilities
1. PCB Design & Manufacturing Readiness
- Hands on experience with PCB process including defining and drive PCB design guidelines / stack-up / routing strategy for high-speed, high-layer count datacenter PCB boards
- Develop and maintain DFM (Design for Manufacturability) libraries to ensure design compliance with supplier capability
- Collaborate with cross-functional teams (SI/PI, mechanical, thermal, system architecture) to optimize board performance and manufacturability
2. Supplier Engagement & Capability Validation
- Engage with PCB manufacturers (fabricators & assemblers) to:
- Understand design rule capability (trace/space, via structures, stack-up complexity, materials)
- Evaluate BOM capability including advanced laminates, low-loss materials, and new technologies
- Collect and analyze supplier data to validate manufacturing capability vs design requirements
- Drive multi-source strategy and supplier qualification for high-volume production
3. NPI & Manufacturing Support
- Support critical NPI builds for datacenter platforms (AI/Compute PCB boards, high-power systems)
- Troubleshoot PCB fabrication / assembly issues:
- Yield excursions
- Reliability failures
- Process limitations
- Lead root cause analysis and implement corrective & preventive actions (CAPA)
4. Technology Roadmap Development
- Drive PCB technology roadmap in collaboration with suppliers:
- Advanced via structures (HDI, mSAP, via-in-pad, stacked vias, etc.)
- New materials (low-loss, high-Tg, ultra-thin core, glass core evolution)
- High layer count / ultra-high density interconnect solutions
- Pioneer and implement new structures, technologies, and BOM solutions to advance Qualcomm's platform capability
5. Industry & Competitive Intelligence
- Monitor industry trends (Datacenter, AI infrastructure, high-speed PCB technology)
- Perform competitive benchmarking (Hyperscalers, ODM ecosystem, etc.)
- Identify emerging strategies to ensure Qualcomm remains aligned with leading-edge technology directions
Minimum Qualifications:
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications:
- BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
- 15+ years of PCB / substrate engineering experience (Datacenter / server / high-speed system preferred)
Strong understanding of:
- High-speed design fundamentals (SI/PI, loss, impedance control)
- Advanced PCB fabrication processes (MLB, HDI, mSAP, build-up, lamination cycles)
- PCB materials (low-loss laminates/Core & PPG, Cu foil, Plating chemistry, SR, Surface Finish, etc.)
- Experience working directly with PCB suppliers (fab + assembly/CM)
- Proven track record in NPI builds and manufacturing issue resolution
- Experience with AI accelerators / server motherboards / high-power boards (100kW+ rack architecture familiarity preferred)
- Familiarity with advanced packaging interaction (SiP, substrate, bridge-based systems)
- Experience driving technology co-development with suppliers
- Ability to influence cross-functional and executive stakeholders
Key Competencies
- Strong analytical and problem-solving skills
- Data-driven decision making
- Ability to communicate clearly with suppliers, internal teams, and executive leadership
- Experience managing ambiguity in fast-paced NPI environments
Impact
In this role, you will directly influence:
- Qualcomm's datacenter and AI hardware competitiveness
- Supplier ecosystem maturity and scalability
- Adoption of next-generation PCB technologies and materials
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$201,600.00 - $302,400.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
About Qualcomm
Sourced by ZipRecruiter
Qualcomm is enabling a world where everyone and everything can be intelligently connected. You interact with products and technologies made possible by Qualcomm every day, including 5G-enabled smartphones that double as pro-level cameras and gaming devices, smarter vehicles and cities, and the technology behind the smart, connected factories that manufactured your latest purchase. Our powerful connectivity solutions keep you connected—even in remote areas. Qualcomm 5G and AI innovations are the power behind the connected intelligent edge. You’ll find our technologies behind and inside the innovations that deliver significant value across multiple industries and to billions of people every day.
Industry
Technology, communication and media
Company size
10,000+ Employees
Headquarters location
San Diego, CA, US
Year founded
1985