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Substrate Engineer Jobs (NOW HIRING)

Substrate manufacturer background is the strongest fit; OSAT packaging engineering experience is also well-suited for this role. Responsibilities & Duties: Product Development * Own new GCS product ...

IC Packaging Design Engineer

Chandler, AZ · On-site

$138K/yr

The ideal candidates will possess strong expertise in package and substrate design, with hands-on ... and reliability engineering teams. * Support design reviews, issue resolution, and continuous ...

OR · On-site

$200K - $280K/yr

Define and review substrate stack-ups, via strategies, impedance control, escape routing, and ... Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a ...

The Global Design, Simulation, and Substrate team at Micron Technology is a world-class group of engineers developing advanced semiconductor packaging solutions for memory products including DRAM and ...

Define and review substrate stack-ups, via strategies, impedance control, escape routing, and ... Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a ...

Sr. Director, Thermal Mechanical

Seattle, WA · On-site +1

$175K - $225K/yr

Collaborate with OSATs, substrate suppliers, thermal solution vendors, and manufacturing partners to enable scalable deployment. What You Bring * MS or PhD in Mechanical Engineering, Thermal ...

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Substrate Engineer information

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$24K

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$172K

How much do substrate engineer jobs pay per year?

As of Jul 14, 2026, the average yearly pay for substrate engineer in the United States is $107,956.00, according to ZipRecruiter salary data. Most workers in this role earn between $83,500.00 and $133,500.00 per year, depending on experience, location, and employer.

What are some common challenges Substrate Engineers face when working on high-density interconnect (HDI) designs?

Substrate Engineers often encounter challenges related to managing signal integrity, thermal performance, and miniaturization when working with HDI designs. Balancing the need for dense routing with electrical performance can be complex, especially as device sizes shrink and layer counts increase. Collaboration with PCB designers, materials scientists, and manufacturing teams is crucial to address these issues and ensure the substrate meets both design and production requirements. Keeping up with evolving technologies and industry standards is also essential for success in this role.

What engineers make $300,000 a year?

Senior engineers in specialized fields such as software engineering, petroleum engineering, and aerospace engineering can earn $300,000 or more annually, especially with extensive experience, advanced skills, and in high-demand industries. Roles involving leadership, complex technical expertise, or working in lucrative markets tend to have higher compensation levels.

What are the 7 types of engineers?

Engineers are typically categorized into various disciplines based on their specialization, including civil, mechanical, electrical, chemical, software, aerospace, and industrial engineering. Substrate engineers, a specialized role in semiconductor manufacturing, focus on designing and developing substrate materials used in electronic devices. Understanding different engineering types helps in identifying the skills and tools relevant to each field, which can be important for career development and job opportunities.

Are materials engineers in high demand?

Materials engineers, including those working as substrate engineers, are in high demand due to the growth of electronics, semiconductor, and advanced manufacturing industries. They often require knowledge of materials properties, testing, and industry standards, with employment prospects driven by technological innovation and manufacturing needs.

What is a Substrate Engineer?

A Substrate Engineer is a professional who specializes in designing, developing, and optimizing the underlying frameworks, often referred to as substrates, for electronic devices or software platforms. In the context of electronics, they work with materials and technologies that form the physical base for circuits and chips, ensuring performance, reliability, and manufacturability. In software, especially blockchain, a Substrate Engineer focuses on building and customizing blockchains using the Substrate framework, handling core logic, consensus, and runtime modules. Their role is crucial for creating robust and scalable systems tailored to specific application requirements.

What engineers make $500,000 a year?

Highly experienced engineers in specialized fields such as software engineering, data engineering, or systems architecture can earn $500,000 or more annually, especially in senior or executive roles at large technology companies. These positions often require advanced skills, certifications, and extensive industry experience, and may include bonuses, stock options, or profit sharing as part of compensation packages.

What is the difference between Substrate Engineer vs Semiconductor Process Engineer?

AspectSubstrate EngineerSemiconductor Process Engineer
CredentialsBachelor's or Master's in Materials Science, Electrical Engineering, or related fieldsBachelor's or Master's in Electrical Engineering, Chemical Engineering, or related fields
Work EnvironmentResearch labs, fabrication facilities, semiconductor manufacturing plantsCleanrooms, fabrication facilities, process development labs
Industry UsageSemiconductor manufacturing, electronics, integrated circuitsSemiconductor fabrication, chip production, process optimization
Common Search/ComparisonYesYes

Substrate Engineers focus on developing and optimizing the materials and layers used in semiconductor devices, while Semiconductor Process Engineers work on the overall manufacturing processes to produce chips efficiently. Both roles require similar educational backgrounds and often collaborate within the semiconductor industry, but their specific responsibilities differ in scope and focus.

What are the key skills and qualifications needed to thrive as a Substrate Engineer, and why are they important?

To thrive as a Substrate Engineer, you need a strong background in materials science, semiconductor fabrication, and electrical engineering, often supported by a relevant engineering degree. Familiarity with industry-standard design tools like Cadence or Mentor Graphics, as well as experience with substrate modeling, PCB design, and analysis software, is typically required. Excellent problem-solving skills, attention to detail, and effective communication are crucial soft skills for collaborating across multidisciplinary teams. These qualifications are essential for ensuring high-quality, reliable substrate designs that meet performance, manufacturability, and cost requirements in advanced electronics manufacturing.
More about Substrate Engineer jobs
What cities are hiring for Substrate Engineer jobs? Cities with the most Substrate Engineer job openings:
What states have the most Substrate Engineer jobs? States with the most job openings for Substrate Engineer jobs include:
Infographic showing various Substrate Engineer job openings in the United States as of July 2026, with employment types broken down into 95% Full Time, 2% Part Time, and 3% Contract. Highlights an 87% Physical, 4% Hybrid, and 9% Remote job distribution, with an average salary of $107,956 per year, or $51.9 per hour.
Principal PCB Engineer - Datacenter / High-Speed Systems

Principal PCB Engineer - Datacenter / High-Speed Systems

Qualcomm

San Diego, CA • On-site

Full-time

Posted 14 days ago


Qualcomm rating

9.6

Company rating: 9.6 out of 10

Based on 5 frontline employees who took The Breakroom Quiz

5th of 209 rated software companies


Job description

Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
We are seeking a highly experienced PCB Engineer to drive next-generation Datacenter and High-performance computing (HPC) platforms.
This role will focus on advanced PCB technologies, manufacturability optimization, and supplier engagement, supporting both NPI and volume production while shaping Qualcomm's future hardware roadmap.
Key Responsibilities
1. PCB Design & Manufacturing Readiness
  • Hands on experience with PCB process including defining and drive PCB design guidelines / stack-up / routing strategy for high-speed, high-layer count datacenter PCB boards

  • Develop and maintain DFM (Design for Manufacturability) libraries to ensure design compliance with supplier capability

  • Collaborate with cross-functional teams (SI/PI, mechanical, thermal, system architecture) to optimize board performance and manufacturability

2. Supplier Engagement & Capability Validation
  • Engage with PCB manufacturers (fabricators & assemblers) to:

  • Understand design rule capability (trace/space, via structures, stack-up complexity, materials)

  • Evaluate BOM capability including advanced laminates, low-loss materials, and new technologies

  • Collect and analyze supplier data to validate manufacturing capability vs design requirements

  • Drive multi-source strategy and supplier qualification for high-volume production

3. NPI & Manufacturing Support
  • Support critical NPI builds for datacenter platforms (AI/Compute PCB boards, high-power systems)

  • Troubleshoot PCB fabrication / assembly issues:

  • Yield excursions

  • Reliability failures

  • Process limitations

  • Lead root cause analysis and implement corrective & preventive actions (CAPA)

4. Technology Roadmap Development
  • Drive PCB technology roadmap in collaboration with suppliers:

  • Advanced via structures (HDI, mSAP, via-in-pad, stacked vias, etc.)

  • New materials (low-loss, high-Tg, ultra-thin core, glass core evolution)

  • High layer count / ultra-high density interconnect solutions

  • Pioneer and implement new structures, technologies, and BOM solutions to advance Qualcomm's platform capability

5. Industry & Competitive Intelligence
  • Monitor industry trends (Datacenter, AI infrastructure, high-speed PCB technology)

  • Perform competitive benchmarking (Hyperscalers, ODM ecosystem, etc.)

  • Identify emerging strategies to ensure Qualcomm remains aligned with leading-edge technology directions

Minimum Qualifications:
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications:
  • BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
  • 15+ years of PCB / substrate engineering experience (Datacenter / server / high-speed system preferred)

Strong understanding of:
  • High-speed design fundamentals (SI/PI, loss, impedance control)
  • Advanced PCB fabrication processes (MLB, HDI, mSAP, build-up, lamination cycles)

  • PCB materials (low-loss laminates/Core & PPG, Cu foil, Plating chemistry, SR, Surface Finish, etc.)
  • Experience working directly with PCB suppliers (fab + assembly/CM)

  • Proven track record in NPI builds and manufacturing issue resolution

  • Experience with AI accelerators / server motherboards / high-power boards (100kW+ rack architecture familiarity preferred)

  • Familiarity with advanced packaging interaction (SiP, substrate, bridge-based systems)

  • Experience driving technology co-development with suppliers

  • Ability to influence cross-functional and executive stakeholders

Key Competencies
  • Strong analytical and problem-solving skills

  • Data-driven decision making

  • Ability to communicate clearly with suppliers, internal teams, and executive leadership

  • Experience managing ambiguity in fast-paced NPI environments

Impact
In this role, you will directly influence:
  • Qualcomm's datacenter and AI hardware competitiveness

  • Supplier ecosystem maturity and scalability

  • Adoption of next-generation PCB technologies and materials

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$201,600.00 - $302,400.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.

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About Qualcomm

Sourced by ZipRecruiter

Qualcomm is enabling a world where everyone and everything can be intelligently connected. You interact with products and technologies made possible by Qualcomm every day, including 5G-enabled smartphones that double as pro-level cameras and gaming devices, smarter vehicles and cities, and the technology behind the smart, connected factories that manufactured your latest purchase. Our powerful connectivity solutions keep you connected—even in remote areas. Qualcomm 5G and AI innovations are the power behind the connected intelligent edge. You’ll find our technologies behind and inside the innovations that deliver significant value across multiple industries and to billions of people every day.

Industry

Technology, communication and media

Company size

10,000+ Employees

Headquarters location

San Diego, CA, US

Year founded

1985