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Semiconductor Wire Bond Jobs (NOW HIRING)

Senior Process Engineer

Milpitas, CA · On-site

$100K - $135K/yr

Experience: * Advanced understanding of Semiconductor processes. * Hands-on Experience in ... in Die Attach, Wire Bond or Mold * Knowledge of basic AutoCAD or Solidworks preferred.

Senior Process Engineer

San Jose, CA · On-site

$100K - $150K/yr

Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace). * Knowledge in semiconductor manufacturing is a plus. * Self-motivated with the ability to align and ...

Semiconductor assembly processes such as die attach, wire bond, molding, singulation, wafer thinning/saw, die pick, and related processes * Prototype, NPI (New Product Introduction), or high-mix/low ...

Sr Process Engineer

San Jose, CA · On-site

$100K - $119K/yr

Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace). * Knowledge in semiconductor manufacturing is a plus. * Self-motivated with the ability to align and ...

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Semiconductor Wire Bond information

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How much do semiconductor wire bond jobs pay per hour?

As of Aug 7, 2026, the average hourly pay for semiconductor wire bond in the United States is $21.55, according to ZipRecruiter salary data. Most workers in this role earn between $18.27 and $24.52 per hour, depending on experience, location, and employer.

What is a semiconductor wire bond technician?

A semiconductor wire bond technician is a specialized worker who connects tiny wires between the semiconductor chip (die) and its package or substrate, using automated or manual wire bonding equipment. This process is crucial for establishing electrical pathways, allowing the chip to communicate with other components on a circuit board. Technicians must have excellent attention to detail, steady hands, and knowledge of cleanroom protocols. Their work is essential in the manufacturing of integrated circuits used in electronics like smartphones, computers, and automotive systems.

What are the key skills and qualifications needed to thrive as a semiconductor wire bond technician, and why are they important?

To thrive as a Semiconductor Wire Bond Technician, you need a strong understanding of microelectronics assembly, fine motor skills, and attention to detail, typically supported by a high school diploma or technical training. Familiarity with wire bonding machines, microscopes, and cleanroom protocols is essential, and some employers may require IPC or similar certifications. Patience, problem-solving abilities, and effective teamwork are important soft skills in this role. These skills ensure precise and reliable connections in semiconductor devices, which are critical for product performance and quality control.

What are some of the common challenges faced by semiconductor wire bond operators, and how are they typically addressed?

Semiconductor Wire Bond operators often encounter challenges such as handling extremely delicate wires, maintaining precise alignment under microscopes, and working in cleanroom environments to prevent contamination. Operators must follow strict protocols and regularly calibrate equipment to ensure consistent bond quality and avoid defects. Continuous training and collaboration with process engineers help address these challenges and enable operators to stay updated with new bonding techniques and technology improvements.

What is the difference between Semiconductor Wire Bond vs Semiconductor Die Attach Technician?

AspectSemiconductor Wire BondSemiconductor Die Attach Technician
Required CredentialsTechnical certifications, training in wire bonding processesTechnical training, certifications in die attach techniques
Work EnvironmentCleanroom, electronics manufacturingCleanroom, assembly line environments
Industry UsageElectronics, semiconductor manufacturingSemiconductor fabrication, electronics assembly
Common Search/ComparisonYesNo

Semiconductor Wire Bond and Semiconductor Die Attach Technician roles both require technical skills and certifications related to semiconductor manufacturing. Wire bond specialists focus on creating electrical connections within chips, often working in cleanrooms, while die attach technicians handle placing and securing semiconductor dies onto substrates. Both are essential in semiconductor production but differ in specific processes and responsibilities.

More about Semiconductor Wire Bond jobs
What are the most commonly searched types of Semiconductor Wire Bond jobs? The most popular types of Semiconductor Wire Bond jobs are:
Infographic showing various Semiconductor Wire Bond job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 90% Full Time, 4% Part Time, 1% Temporary, 3% Contract, and 1% Nights. Highlights an 96% Physical, 1% Hybrid, and 3% Remote job distribution, with an average salary of $44,825 per year, or $21.6 per hour.

Senior Process Engineer

Micross

Milpitas, CA • On-site

$100K - $135K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Re-posted yesterday


Job description

Position Title: Senior Process Engineer

Reports To: General Manager

Department Name: Assembly Engineering

Location: Silicon Valley

Summary:

The Senior Process Engineer will perform IC Assembly process development and improvement directly resulting in increased efficiency and quality on the production floor. This will be achieved through process documentation, operator training, and design of experiments

Essential Duties & Responsibilities:

  • Assembly Engineering support for the Customer and Sales Group to review Customer requirements, and determine the correct process and materials to meet those requirements.
  • Daily interaction directly with customers with regard to technical issues and specification reviews.
  • Manage and define Assembly Processes relating to specific Products and/or Customers.
  • Responsible for conducting thorough Design of Experiments on new IC Assembly Processes with the goal of developing processes and enhancing productivity.
  • Provide DOE, SPC, and yield reporting in a clear and presentable format.
  • Collect Assembly yield data and perform yield analysis for production equipment and customer products.
  • Generate detailed reports and specifications documenting all experimental and process findings and procedures.
  • Assess existing processes and identify areas of improvement and solutions for these systems.
  • Evaluate and provide recommendations on new equipment that will enhance the current production capabilities.
  • Conduct root cause analysis and corrective actions related to process failures.
  • Identify and implement cost, quality, and yield improvements.
  • Flexible to perform other duties as assigned.

Other Duties & Responsibilities:

  • Perform or assist with any operations to maintain workflow, meet schedules and meet quality requirements.
  • Maintain safe work areas, comply with safety procedures, and follow equipment operating rules.
  • Follow clean room and other environmental precautions and procedures.
  • Participate in meetings and work groups to facilitate cross functional activities, communicate issues, obtain approvals, resolve problems, and maintain knowledge of new developments, requirements, and policies.
  • Comply with all quality and ITAR policies, practices, and procedures.
  • Participate in team efforts to achieve departmental and company goals.
  • Contribute to building a positive team spirit.
  • Communicate effectively with all levels of employees.
  • Protect confidential information by not communicating, disclosing, or using for benefit of 3rd parties.
  • Maintain the highest degree of honesty and integrity at all times.
  • Perform other related duties as assigned.

JOB REQUIREMENTS INCLUDE (List as required or preferred)

Education: Bachelor’s Degree in Engineering, Electrical, Mechanical, Material Science, or related field preferred;

Experience:

  • Advanced understanding of Semiconductor processes.
  • Hands-on Experience in Semiconductor Back End Process Engineering required.
  • Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding preferred

Knowledge/Skills:

  • 10 years of Assembly Process Engineering experience, preferred Hands on in Die Attach, Wire Bond or Mold
  • Knowledge of basic AutoCAD or Solidworks preferred.
  • Statistical Process Control, Design of Experiments & FMEA experience are all highly desirable.
  • Detail-oriented, data entry accuracy, problem solver, good analytical skills, team player, multitask capability
  • General computer skills, including Microsoft Office Suite.
  • Strong written and verbal communication skills.

At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.

Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.



Citizenship: Must be a United States Citizen in order to work on sensitive military and aerospace programs.

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SUPERVISORY RESPONSIBILITIES

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