This position is in our semiconductor DieFab area in Santa Rosa, California. We manufacture ... Operators are responsible for following diagrams to solder, epoxy, and wire bond chips to packages ...
This position is in our semiconductor DieFab area in Santa Rosa, California. We manufacture ... Operators are responsible for following diagrams to solder, epoxy, and wire bond chips to packages ...
Senior Package Design Engineer
Boise, ID ยท On-site
... semiconductor packaging and ready to lead at the intersection of silicon, system, and scale. This ... wire bond and flip chip interconnect schemes, and BEOL/RDL flows - Create wire bond diagrams ...
Senior Package Design Engineer
Boise, ID ยท On-site
... semiconductor packaging and ready to lead at the intersection of silicon, system, and scale. This ... wire bond and flip chip interconnect schemes, and BEOL/RDL flows - Create wire bond diagrams ...
Principal Packaging Engineer
Sunnyvale, CA ยท On-site
$170K - $220K/yr
Lead Frame (LF), design, clip design, wire bond * Experiences in RD concept development and novel ... Alpha and Omega Semiconductor, Inc is committed to diversity in our workplace. Qualified applicants ...
Principal Packaging Engineer
Sunnyvale, CA ยท On-site
$170K - $220K/yr
Lead Frame (LF), design, clip design, wire bond * Experiences in RD concept development and novel ... Alpha and Omega Semiconductor, Inc is committed to diversity in our workplace. Qualified applicants ...
... semiconductor packaging and ready to lead at the intersection of silicon, system, and scale. This ... wire bond and flip chip interconnect schemes, and BEOL/RDL flows - Create wire bond diagrams ...
... semiconductor packaging and ready to lead at the intersection of silicon, system, and scale. This ... wire bond and flip chip interconnect schemes, and BEOL/RDL flows - Create wire bond diagrams ...
Senior Engineer, Semiconductor Packaging
Wilmington, MA ยท On-site
$95K - $131K/yr
Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products. * Perform electrical ...
Senior Engineer, Semiconductor Packaging
Wilmington, MA ยท On-site
$95K - $131K/yr
Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products. * Perform electrical ...
Production Technician
Milpitas, CA ยท On-site
$20 - $25/hr
Two or more years of experience in semiconductor, photonics, optical, electronics, or R&D manufacturing. * Hands-on experience with wire bonding, wire bond inspection, edge coupling, active optical ...
Production Technician
Milpitas, CA ยท On-site
$20 - $25/hr
Two or more years of experience in semiconductor, photonics, optical, electronics, or R&D manufacturing. * Hands-on experience with wire bonding, wire bond inspection, edge coupling, active optical ...
Production Technician
Milpitas, CA ยท On-site
$20 - $25/hr
Two or more years of experience in semiconductor, photonics, optical, electronics, or R&D manufacturing. * Hands-on experience with wire bonding, wire bond inspection, edge coupling, active optical ...
Production Technician
Milpitas, CA ยท On-site
$20 - $25/hr
Two or more years of experience in semiconductor, photonics, optical, electronics, or R&D manufacturing. * Hands-on experience with wire bonding, wire bond inspection, edge coupling, active optical ...
Senior Engineer, Semiconductor Packaging
$95K - $131K/yr
Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products. * Perform electrical ...
Senior Engineer, Semiconductor Packaging
$95K - $131K/yr
Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products. * Perform electrical ...
Process Engineer
Apopka, FL ยท On-site
Knowledge or experience with Automatic assembly equipment for Wire bond, Die attach a plus * Knowledge in semiconductor manufacturing a plus. * Self-motivated with the ability to align priorities in ...
Process Engineer
Apopka, FL ยท On-site
Knowledge or experience with Automatic assembly equipment for Wire bond, Die attach a plus * Knowledge in semiconductor manufacturing a plus. * Self-motivated with the ability to align priorities in ...
Principal Reliability/FA Engineer
Newbury, MA ยท On-site
$129.40 - $247.80/hr
... semiconductor devices, surface-mount components, printed circuit boards, and wire-bond and flip-chip modules. Design and execute parametric, RF, and system-level test strategies to enable accurate ...
New
Principal Reliability/FA Engineer
Newbury, MA ยท On-site
$129.40 - $247.80/hr
... semiconductor devices, surface-mount components, printed circuit boards, and wire-bond and flip-chip modules. Design and execute parametric, RF, and system-level test strategies to enable accurate ...
New
ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable ... Wire bond Testing to MIL-STD-883, Method 2011 and 2023 Requirements : * US CITIZENSHIP * High ...
ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable ... Wire bond Testing to MIL-STD-883, Method 2011 and 2023 Requirements : * US CITIZENSHIP * High ...
Assembly Aluminum Wire Bonder
Lawrence, MA ยท On-site
$50K/yr
On-site Industry: Electronics Manufacturing / Semiconductor Components Compensation: $50000 ... Inspect bonded assemblies using microscopes to verify bond integrity and accuracy * Identify ...
Assembly Aluminum Wire Bonder
Lawrence, MA ยท On-site
$50K/yr
On-site Industry: Electronics Manufacturing / Semiconductor Components Compensation: $50000 ... Inspect bonded assemblies using microscopes to verify bond integrity and accuracy * Identify ...
Principal Reliability/FA Engineer
Newbury Park, CA ยท On-site
$108K - $136K/yr
... semiconductor devices, surface-mount components, printed circuit boards, and wire-bond and flip-chip modules. Design and execute parametric, RF, and system-level test strategies to enable accurate ...
Principal Reliability/FA Engineer
Newbury Park, CA ยท On-site
$108K - $136K/yr
... semiconductor devices, surface-mount components, printed circuit boards, and wire-bond and flip-chip modules. Design and execute parametric, RF, and system-level test strategies to enable accurate ...
Sr. Incoming Quality Inspector
Chelmsford, MA ยท On-site
$23 - $32/hr
ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable ... Wire bond Testing to MIL-STD-883, Method 2011 and 2023 Requirements : * US CITIZENSHIP * High ...
Sr. Incoming Quality Inspector
Chelmsford, MA ยท On-site
$23 - $32/hr
ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable ... Wire bond Testing to MIL-STD-883, Method 2011 and 2023 Requirements : * US CITIZENSHIP * High ...
Sr. Incoming Quality Inspector
$23 - $32/hr
ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable ... Wire bond Testing to MIL-STD-883, Method 2011 and 2023 Requirements : * US CITIZENSHIP * High ...
Sr. Incoming Quality Inspector
$23 - $32/hr
ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable ... Wire bond Testing to MIL-STD-883, Method 2011 and 2023 Requirements : * US CITIZENSHIP * High ...
... die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define ... semiconductor or sensor packaging, assembly process development, or failure analysis.
... die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define ... semiconductor or sensor packaging, assembly process development, or failure analysis.
... die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define ... semiconductor or sensor packaging, assembly process development, or failure analysis.
... die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define ... semiconductor or sensor packaging, assembly process development, or failure analysis.
Packaging Process Development Engineer
Fremont, CA ยท On-site
$94K - $130K/yr
... die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define ... semiconductor or sensor packaging, assembly process development, or failure analysis.
Packaging Process Development Engineer
Fremont, CA ยท On-site
$94K - $130K/yr
... die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define ... semiconductor or sensor packaging, assembly process development, or failure analysis.
Senior Process Engineer
San Jose, CA ยท On-site
$100K - $150K/yr
Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace). * Knowledge in semiconductor manufacturing is a plus. * Self-motivated with the ability to align and ...
Quick apply
Senior Process Engineer
San Jose, CA ยท On-site
$100K - $150K/yr
Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace). * Knowledge in semiconductor manufacturing is a plus. * Self-motivated with the ability to align and ...
Senior Process Engineer
Milpitas, CA ยท On-site
$100K - $135K/yr
Experience: * Advanced understanding of Semiconductor processes. * Hands-on Experience in ... in Die Attach, Wire Bond or Mold * Knowledge of basic AutoCAD or Solidworks preferred.
Quick apply
Senior Process Engineer
Milpitas, CA ยท On-site
$100K - $135K/yr
Experience: * Advanced understanding of Semiconductor processes. * Hands-on Experience in ... in Die Attach, Wire Bond or Mold * Knowledge of basic AutoCAD or Solidworks preferred.
Semiconductor Wire Bond information
See salary details
$11.54 - $13.42
3% of jobs
$13.42 - $15.30
9% of jobs
$15.30 - $17.18
4% of jobs
$18.01 is the 25th percentile. Wages below this are outliers.
$17.18 - $19.06
19% of jobs
The median wage is $20.37 / hr.
$19.06 - $20.94
21% of jobs
$20.94 - $22.81
10% of jobs
$23.97 is the 75th percentile. Wages above this are outliers.
$22.81 - $24.69
14% of jobs
$24.69 - $26.57
8% of jobs
$26.57 - $28.45
2% of jobs
$28.45 - $30.33
5% of jobs
$30.33 - $32.21
4% of jobs
$11
$21
$32
How much do semiconductor wire bond jobs pay per hour?
What is a semiconductor wire bond technician?
What are the key skills and qualifications needed to thrive as a semiconductor wire bond technician, and why are they important?
What are some of the common challenges faced by semiconductor wire bond operators, and how are they typically addressed?
What is the difference between Semiconductor Wire Bond vs Semiconductor Die Attach Technician?
| Aspect | Semiconductor Wire Bond | Semiconductor Die Attach Technician |
|---|---|---|
| Required Credentials | Technical certifications, training in wire bonding processes | Technical training, certifications in die attach techniques |
| Work Environment | Cleanroom, electronics manufacturing | Cleanroom, assembly line environments |
| Industry Usage | Electronics, semiconductor manufacturing | Semiconductor fabrication, electronics assembly |
| Common Search/Comparison | Yes | No |
Semiconductor Wire Bond and Semiconductor Die Attach Technician roles both require technical skills and certifications related to semiconductor manufacturing. Wire bond specialists focus on creating electrical connections within chips, often working in cleanrooms, while die attach technicians handle placing and securing semiconductor dies onto substrates. Both are essential in semiconductor production but differ in specific processes and responsibilities.
Other
Re-posted 21 days ago
Job description
- This position is in our semiconductor DieFab area in Santa Rosa, California. We manufacture integrated circuits in support of our internal and external customers.
- You will be part of a team that handles both production and development circuits; you will work closely with engineering groups, area trainers and other operators.
- Though you will be part of a team, you will be working independently to contribute to the area's goals. The scope and complexity of your work will be based on your current capabilities and your ability to gain new skills.
- The bonding service position requires the ability to handle delicate products as instructed by the product documentation and engineering specifications.
- Operators are responsible for following diagrams to solder, epoxy, and wire bond chips to packages so the parts can be tested for future reliability. This position requires hand eye coordination under a microscope.
- Ability to handle small delicate IC's
- Solder, epoxy, and wire bond small IC's under a microscope
- Follow detailed process documentation to prepare test packages for reliability testing
- Ability to communicate effectively with process and reliability engineers
- Experience with inputting data using Microsoft applications
- Working with MES to complete jobs
- Follow strict ESD protocols
Qualities:
- Skilled hand-eye coordination under a microscope
- Team communication and collaboration
- Good verbal and written communication skills
- Lean and 5S experience a plus
- Microsoft Office skills
- Attention to detail.
- Skilled in handling delicate products.
- Strong focus and concentration.
- Excellent verbal and written communication skills.
- High school Diploma
About Tellus Solutions
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Tellus Solutions purpose is to provide effective business solutions leveraging cutting-edge technology and delivered with passion, competence and character. Be the best staffing service provider for our clients. Be the preferred employer of the best caliber professionals.
Industry
It services
Company size
51 - 200 Employees
Headquarters location
Santa Clara, CA, US
Year founded
2005