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Wire Bonding Process Engineer Jobs (NOW HIRING)

Mesh Optical Technologies

Process Engineer

Gardena, CA

$90K - $140K/yr

... and wire bonding * Ability to interpret process documentation, equipment specifications, and ... Process Engineer: $90,000.00 - $140,000.00/per year Title and base salary are determined on a case ...

Apex Microtechnology

Process Engineer

Tucson, AZ · On-site

The Process Engineer will report to the Director of Operations and support the execution of ... place, wire-bonding, plasma cleaning, etc.) * Identifying and driving cost down initiatives.

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Wire Bonding Process Engineer information

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$142.5K

How much do wire bonding process engineer jobs pay per year?

As of Jun 15, 2026, the average yearly pay for wire bonding process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in the Wire Bonding Process Engineer position, and why are they important?

A Wire Bonding Process Engineer should possess a strong background in materials science, microelectronics, and process engineering, often supported by a relevant engineering degree. Familiarity with wire bonding equipment (such as wedge and ball bonders), knowledge of semiconductor manufacturing standards, and experience with statistical process control (SPC) tools are typically required. Excellent problem-solving abilities, attention to detail, and the capacity to work well within cross-functional teams will help a candidate excel in this role. These competencies ensure precise and reliable assembly in high-tech manufacturing environments, directly impacting product quality and yield.

What is a Wire Bonding Process Engineer job?

A Wire Bonding Process Engineer is responsible for developing, optimizing, and maintaining wire bonding processes in semiconductor manufacturing. They ensure process stability, troubleshoot defects, and work on continuous improvement initiatives to enhance yield and reliability. Their role involves collaborating with design, quality, and production teams to implement best practices and resolve technical challenges. Proficiency in bonding techniques, materials, and equipment is essential for success in this role.

What are some common daily responsibilities for a Wire Bonding Process Engineer?

As a Wire Bonding Process Engineer, your daily responsibilities typically include monitoring and optimizing the wire bonding process, troubleshooting equipment or yield issues, and collaborating with quality and production teams to implement process improvements. You may also conduct root cause analyses on defects, develop and document standard operating procedures, and train operators on new technologies or techniques. Regular interaction with equipment vendors and participation in cross-functional meetings are common, ensuring alignment on production and quality goals. This hands-on and collaborative environment enables continuous learning and engagement in advancing semiconductor packaging technologies.

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Wire Bonding Process Engineer jobs near you
Infographic showing various Wire Bonding Process Engineer job openings in the United States as of June 2026, with employment types broken down into 33% Full Time, and 67% Contract. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.
Senior Wire Bonding Manufacturing / Process Development Engineer

Senior Wire Bonding Manufacturing / Process Development Engineer

Link Consulting Services

Santa Barbara, CA • On-site

$113K - $151K/yr

Full-time

Posted 14 days ago

Job description

Job Summary:
This position is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing. This role supports production readiness, drives continuous improvement, and ensures process capability, repeatability, and compliance with quality and reliability requirements. The engineer acts as a technical subject matter expert, providing handson support to operators and technicians while collaborating crossfunctionally with Design, Quality, Manufacturing Engineering, and Supply Chain.
Key Responsibilities:
Process Development & Optimization:
  • Develop, refine, and sustain automated wire bonding processes (ball bonding, wedge bonding, ribbon bonding, and related technologies).
  • Establish and optimize bonding parameters, material selections, and tooling configurations for new and existing products.
  • Lead DOE (Design of Experiments) and statistical analysis to improve yield, reduce variation, and enhance process robustness.
  • Define process controls, monitor KPIs, and ensure compliance with industry standards (e.g., MILSTD883, IPCA610, J-STD001).
Production Support:
  • Provide daily engineering support to manufacturing related to wire bond equipment, tooling, and process troubleshooting.
  • Partner with operations and technicians to resolve production issues, material defects, and equipment performance problems.
  • Implement root cause and corrective actions (RCCA), including 5Why, fishbone analysis, and FMEA updates.
  • Support production ramp, maintaining stable throughput while minimizing scrap and rework.
Equipment & Tooling:
  • Serve as equipment owner for automated wire bonders (e.g., Palomar, Hesse, Kulicke & Soffa, or equivalent).
  • Develop and maintain PM procedures, calibration requirements, and equipment qualification documentation.
  • Identify and implement upgrades, automation improvements, and fixturing enhancements to improve reliability and operator safety.
Documentation & Compliance:
  • Create and maintain technical documentation: work instructions, process specifications, PFMEA, control plans, and training materials.
  • Ensure compliant handling of sensitive information and adherence to company, customer, and government requirements.
  • Support internal and external audits through documentation, data, and process demonstrations.
Continuous Improvement:
  • Lead yield improvement projects and cycletime reduction initiatives.
  • Drive process automation and digitalization efforts aligned with factory modernization goals.
  • Support lean manufacturing activities including 5S, standard work development, and waste reduction.
Qualifications:
  • Bachelor’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Manufacturing Engineering, or related field preferred.
  • 3+ years of relevant experience in microelectronics manufacturing, preferably with automated wire bonding.
  • Strong hands-on experience with automated wire bonders and related process inputs (ultrasonic energy, force, time, loop profiles, etc.)
  • Proficiency with SPC, DOE, statistical analysis, and datadriven decision making.
  • Demonstrated ability to troubleshoot both equipment and process-level issues.
  • Ability to read technical drawings, schematics, and material specifications.
Preferred Qualifications:
  • Experience in an aerospace, defense, semiconductor, or high-reliability manufacturing environment.
  • Familiarity with MILSTD883, NASA workmanship standards, and high-reliability bonding requirements.
  • Knowledge of epoxy attach, die bonding, hermetic packaging, or related microelectronic assembly processes.
  • Experience with MES systems and digital process documentation tools.
  • Strong communication skills with the ability to train operators and lead cross-functional projects.
Core Competencies:
  • Technical Problem Solving
  • Process Ownership & Accountability
  • Attention to Detail and Quality Focus
  • Cross-functional Collaboration
  • Continuous Improvement Mindset
  • Strong Documentation and Communication Skills
Successful applicants must be a U.S. Citizen or Perm Resident.
Salary Range: $113,600.00 - $151,400.00 (annual estimate)