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Wire Bonding Process Engineer Jobs (NOW HIRING)

The Process Engineer is responsible for coordinating and overseeing all activities related to ... Analyze bonding process performance (yield, scrap rate, UPH, Cp/Cpk) relative to production ...

Senior Process Engineer

Gardena, CA

$140K - $180K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

... wire-bonding, dispense, fully-automated final assembly and associated materials * Own tool ... Senior Process Engineer: $140,000.00 - $180,000.00/per year Title and base salary are determined on ...

Senior Process Engineer

Gardena, CA · On-site

$140K - $180K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

... wire-bonding, dispense, fully-automated final assembly and associated materials * Own tool ... Senior Process Engineer: $140,000.00 - $180,000.00/per year Title and base salary are determined on ...

Wire bonding Technician

Lexington, MA · On-site

$21.25 - $28.75/hr

ABOUT THE JOB We are seeking a Wire Bonding Technician to join our team, focusing on the packaging ... In this role, you will collaborate with engineers in a clean room environment to handle and test ...

Wire bonding Technician

Lexington, MA

$21.25 - $28.75/hr

ABOUT THE JOB We are seeking a Wire Bonding Technician to join our team, focusing on the packaging ... In this role, you will collaborate with engineers in a clean room environment to handle and test ...

The Process Engineer, Closures & Bonding for the coating and bonding line is responsible for designing, implementing, and optimizing manufacturing processes related to the coating and bonding of ...

Wire bonding Technician

Lexington, MA · On-site

$41.35 - $54.81/hr

Work with engineers to package, test and wire bond custom infrared image sensors in a clean room ... Talent acquisition process and the security of our candidates. We've observed a rise in ...

Process Engineer

Gardena, CA · On-site

$90K - $140K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

... and wire bonding * Ability to interpret process documentation, equipment specifications, and ... Process Engineer: $90,000.00 - $140,000.00/per year Title and base salary are determined on a case ...

Process Engineer

Gardena, CA · On-site

$90K - $140K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

... and wire bonding * Ability to interpret process documentation, equipment specifications, and ... Process Engineer: $90,000.00 - $140,000.00/per year Title and base salary are determined on a case ...

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Wire Bonding Process Engineer information

See salary details

$49.5K

$92K

$142.5K

How much do wire bonding process engineer jobs pay per year?

As of Aug 18, 2026, the average yearly pay for wire bonding process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is a wire bonding process engineer?

A Wire Bonding Process Engineer is responsible for developing, optimizing, and maintaining wire bonding processes in semiconductor manufacturing. They ensure process stability, troubleshoot defects, and work on continuous improvement initiatives to enhance yield and reliability. Their role involves collaborating with design, quality, and production teams to implement best practices and resolve technical challenges. Proficiency in bonding techniques, materials, and equipment is essential for success in this role.

What are some common daily responsibilities for a wire bonding process engineer?

As a Wire Bonding Process Engineer, your daily responsibilities typically include monitoring and optimizing the wire bonding process, troubleshooting equipment or yield issues, and collaborating with quality and production teams to implement process improvements. You may also conduct root cause analyses on defects, develop and document standard operating procedures, and train operators on new technologies or techniques. Regular interaction with equipment vendors and participation in cross-functional meetings are common, ensuring alignment on production and quality goals. This hands-on and collaborative environment enables continuous learning and engagement in advancing semiconductor packaging technologies.

What are the key skills and qualifications needed to thrive in the wire bonding process engineer position, and why are they important?

A Wire Bonding Process Engineer should possess a strong background in materials science, microelectronics, and process engineering, often supported by a relevant engineering degree. Familiarity with wire bonding equipment (such as wedge and ball bonders), knowledge of semiconductor manufacturing standards, and experience with statistical process control (SPC) tools are typically required. Excellent problem-solving abilities, attention to detail, and the capacity to work well within cross-functional teams will help a candidate excel in this role. These competencies ensure precise and reliable assembly in high-tech manufacturing environments, directly impacting product quality and yield.

More about Wire Bonding Process Engineer jobs

What cities are hiring for Wire Bonding Process Engineer jobs?

Cities with the most Wire Bonding Process Engineer job openings:

What states have the most Wire Bonding Process Engineer jobs?

States with the most job openings for Wire Bonding Process Engineer jobs include:

Infographic showing various Wire Bonding Process Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 79% Full Time, 16% Part Time, 3% Contract, and 1% Nights. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Manufacturing Technician - Wire Bonding

Microchip Technology

Lowell, MA • On-site

Full-time

Medical, Retirement

Re-posted 21 days ago


Microchip Technology rating

8.0

Company rating: 8.0 out of 10

Based on 33 frontline employees who took The Breakroom Quiz

59th of 159 rated electronics manufacturers


Job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.
People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it's won us countless awards for diversity and workplace excellence.
Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.
Visit our careers page to see what exciting opportunities and company perks await!
Job Description:
We are seeking a skilled Manufacturing Technician specializing in wire bonding to support semiconductor device fabrication and microelectronics assembly. The ideal candidate brings hands-on experience in precision assembly and artisan-level fabrication processes, with the ability to independently translate product requirements into optimized process setups.
  • Perform component wire bonding for RF transistor packaged devices using automatic and semi-automatic wire bonders; conduct bond pull testing to verify bond integrity
  • Set up, calibrate, and operate multiple wire bonding and test systems concurrently, managing workflow to meet production targets and product specifications
  • Interpret engineering drawings, build sheets, and process documentation to accurately execute manufacturing tasks
  • Execute production work with a high level of precision, maintaining consistent quality and throughput
  • Independently adjust equipment and process parameters, including loop height and bond placement, to optimize performance and product quality
  • Collaborate with test technicians and engineering personnel to refine wire bonding processes and establish optimal operating conditions
  • Perform rework, repair, and modification of assemblies, including solder component removal and replacement
  • Troubleshoot production and equipment issues, documenting and escalating as needed to support timely resolution and continuous process improvement
  • Maintain accurate production records and ensure compliance with quality and manufacturing standards

Requirements/Qualifications:
  • Trade school or vocational school certification in electronics, manufacturing, or a related field
  • 2-5 years of hands-on experience in semiconductor or microelectronics manufacturing
  • Strong technical aptitude with demonstrated competency in artisan / craftsman processes
  • Ability to work independently ensuring product requirement translation for an optimized process set-up
  • Strong attention to detail and manual dexterity
  • Ability to read schematics and technical documentation
  • Proficient computer skills required to access and interpret engineering drawings, and work instructions

Preferred Requirements/Qualifications:
  • Experience in cleanroom environments
  • Familiarity with high-reliability or aerospace-grade manufacturing standards

U.S. Export Controls Requirements: This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).
Travel Time:
0% - 25%
Physical Attributes:
Carrying, Crouching, Feeling, Foot Controls, Handling, Hearing, Kneeling, Lifting, Noise and/or vibration, Other, Pulling, Pushing, Reaching, Seeing, Talking, Works Alone, Works Around Others
Physical Requirements:
Able to lift, push, pull, 25lbs, carry 15lbs, sit 10%, stand 60% walk 40 %, must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, works alone, works around others
Pay Range:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature. Find more information about all our benefits at the link below:
Benefits of working at Microchip
The hourly pay range for this position, which could be performed in the US, is $22.50/hr - $35.00/hr.*
*Range is dependent on numerous factors including job location, skills and experience.
Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.
For more information on applicable equal employment regulations, please refer to the Know Your Rights: Workplace Discrimination is Illegal Poster.
To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.

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