ZipRecruiter

Log In

1

Wire Bonding Process Engineer Jobs in California

Mesh Optical Technologies

Process Engineer

Gardena, CA

$90K - $140K/yr

... and wire bonding * Ability to interpret process documentation, equipment specifications, and ... Process Engineer: $90,000.00 - $140,000.00/per year Title and base salary are determined on a case ...

Mesh Optical Technologies

Process Engineer

Gardena, CA · On-site

$90K - $140K/yr

... and wire bonding * Ability to interpret process documentation, equipment specifications, and ... Process Engineer: $90,000.00 - $140,000.00/per year Title and base salary are determined on a case ...

PsiQuantum

Associate Process Engineer

Milpitas, CA · On-site

By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the guidance of ...

PsiQuantum

Associate Process Engineer

Milpitas, CA · On-site

By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the guidance of ...

PsiQuantum

Associate Process Engineer

Milpitas, CA · On-site

By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the guidance of ...

next page

Showing results 1-20

All JobsWire Bonding Process Engineer JobsWire Bonding Process Engineer Jobs in California

Wire Bonding Process Engineer information

See California salary details

$48.9K

$90.8K

$140.6K

How much do wire bonding process engineer jobs pay per year?

As of Sep 8, 2026, the average yearly pay for wire bonding process engineer in California is $90,813.00, according to ZipRecruiter salary data. Most workers in this role earn between $73,500.00 and $101,700.00 per year, depending on experience, location, and employer.

What is a wire bonding process engineer?

A Wire Bonding Process Engineer is responsible for developing, optimizing, and maintaining wire bonding processes in semiconductor manufacturing. They ensure process stability, troubleshoot defects, and work on continuous improvement initiatives to enhance yield and reliability. Their role involves collaborating with design, quality, and production teams to implement best practices and resolve technical challenges. Proficiency in bonding techniques, materials, and equipment is essential for success in this role.

What are some common daily responsibilities for a wire bonding process engineer?

As a Wire Bonding Process Engineer, your daily responsibilities typically include monitoring and optimizing the wire bonding process, troubleshooting equipment or yield issues, and collaborating with quality and production teams to implement process improvements. You may also conduct root cause analyses on defects, develop and document standard operating procedures, and train operators on new technologies or techniques. Regular interaction with equipment vendors and participation in cross-functional meetings are common, ensuring alignment on production and quality goals. This hands-on and collaborative environment enables continuous learning and engagement in advancing semiconductor packaging technologies.

What are the key skills and qualifications needed to thrive in the wire bonding process engineer position, and why are they important?

A Wire Bonding Process Engineer should possess a strong background in materials science, microelectronics, and process engineering, often supported by a relevant engineering degree. Familiarity with wire bonding equipment (such as wedge and ball bonders), knowledge of semiconductor manufacturing standards, and experience with statistical process control (SPC) tools are typically required. Excellent problem-solving abilities, attention to detail, and the capacity to work well within cross-functional teams will help a candidate excel in this role. These competencies ensure precise and reliable assembly in high-tech manufacturing environments, directly impacting product quality and yield.

What are popular job titles related to Wire Bonding Process Engineer jobs in California?

For Wire Bonding Process Engineer jobs in California, the most frequently searched job titles are:

What job categories do people searching Wire Bonding Process Engineer jobs in California look for?

The top searched job categories for Wire Bonding Process Engineer jobs in California are:

What cities in California are hiring for Wire Bonding Process Engineer jobs?

Cities in California with the most Wire Bonding Process Engineer job openings:

Wire Bonding Process Engineer jobs near you
Infographic showing various Wire Bonding Process Engineer job openings in California as of August 2026, with employment types broken down into 94% Full Time, 3% Contract, and 3% Nights. Highlights an 95% In-person, and 5% Hybrid job distribution, with an average salary of $90,813 per year, or $43.7 per hour.

Senior Process Engineer

Mesh Optical Technologies

Gardena, CA • On-site

$140K - $180K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 18 days ago

Job description

SENIOR PROCESS ENGINEER

Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that's exactly what we're doing at Mesh.

Our products require semiconductor-grade packaging processes-bumping, dicing, precision bonding, optical alignment, and automated assembly-executed at yield levels and volumes that demand real process engineering discipline. We are seeking a Senior Process Engineer to own the development and qualification of these processes from R&D through production ramp, and to help build high-volume semiconductor packaging process engineering in the US.

RESPONSIBILITIES

  • Own development of wafer prep and die-level packaging processes: bumping, dicing, sub-micron precision bonding, sub-micron optical alignment, flip-chip die bonding, wire-bonding, dispense, fully-automated final assembly and associated materials
  • Own tool selection, materials selection, recipe development, and statistical process control limits to transfer processes from R&D to volume production
  • Translate package and product designs into high volume production processes and collaborate with electrical, mechanical, and photonic circuit design teams to design-for-manufacturing
  • Design production processes from the lab bench through proof of concept and production ramp
  • Establish process limits and feedback process constraints as design rules to design teams
  • Characterize parts with x-ray, FIB cut/SEM, CSAM, and die shear testing, closing the loop with electrical, mechanical, and photonic circuit design teams
  • Act as the technical owner for failure-analysis findings, root cause analysis, and corrective actions
  • Push process yields above 99.9% and thermal-cycle reliability for years-long qualification
  • Provide technical mentorship as we work to build up high-volume semiconductor packaging process engineering in the US

QUALIFICATIONS

  • MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, or similar
  • Extensive (MS + 2 years) hands-on semiconductor process-development experience
  • Strong troubleshooting skills and hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments
  • Demonstrated success qualifying processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding
  • Expertise in statistical quality control and process improvement methodologies, with experience leading internal audits and driving continuous improvement
  • Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams
  • Willingness to work extended hours and weekends as needed

PREFERRED EXPERIENCE

  • 5+ years of fab or wafer level packaging experience (e.g. lithography, etch, CVD, CMP, solder bumping, wafer dicing)
  • Experience integrating photonic devices into complex opto-electronic packages, sub-m die-bonding, wafer prep, and materials used in advanced packaging

COMPENSATION AND BENEFITS:

Pay range: 
Senior Process Engineer: $140,000.00 - $180,000.00/per year

Title and base salary are determined on a case by case basis commensurate with experience and merit.

In addition to base salary, compensation for this role includes:

  • Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
  • Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.
  • Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
  • 401(k) retirement plan access.
  • Relocation assistance to sunny Los Angeles.

Apply