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Wire Bonding Process Engineer Jobs in California

careers@micross.com

Senior Process Engineer

San Jose, CA · On-site

$100K - $150K/yr

Sr. Process Engineer Reports To: Process Engineering Supervisor Summary: Perform functions to ... manufacturing, Au/Al wire bonding, die attach, soldering, lead forming, hermetic sealing ...

careers@micross.com

Senior Process Engineer

San Jose, CA · On-site

$100K - $150K/yr

Sr. Process Engineer Reports To: Process Engineering Supervisor Summary: Perform functions to ... manufacturing, Au/Al wire bonding, die attach, soldering, lead forming, hermetic sealing ...

Doist

Component Process Engineer

San Jose, CA · On-site

$130 - $190/hr

S. in Electrical or Manufacturing Engineering • Experience with optical transceiver manufacturing process such as SMT, die attach, wire bonding and active alignment. • Six Sigma, Statistical ...

Micross

Sr Process Engineer

San Jose, CA · On-site

$100K - $119K/yr

Sr. Process Engineer Reports To: Process Engineering Supervisor Summary: Perform functions to ... manufacturing, Au/Al wire bonding, die attach, soldering, lead forming, hermetic sealing ...

Koch Industries

Senior Optical Engineer

Fremont, CA · On-site

$160K - $220K/yr

... wire bonding, optical fiber management, optical alignment, materials selection. * Strong knowledge of semiconductor wafer processes and interactions with packaging (e.g., thermal budgets ...

PsiQuantum

Senior Optical Process Engineer

Milpitas, CA · On-site

$121K - $156K/yr

The Senior Optical Process Engineer will be responsible for process development and assembly build ... attach, wire-bonding, and AOI. * Demonstrated ability to manage short deadlines and to follow a ...

PsiQuantum

Senior Optical Process Engineer

Milpitas, CA

$121K - $156K/yr

The Senior Optical Process Engineer will be responsible for process development and assembly build ... attach, wire-bonding, and AOI. * Demonstrated ability to manage short deadlines and to follow a ...

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All JobsWire Bonding Process Engineer JobsWire Bonding Process Engineer Jobs in California

Wire Bonding Process Engineer information

See California salary details

$48.9K

$90.8K

$140.6K

How much do wire bonding process engineer jobs pay per year?

As of Aug 23, 2026, the average yearly pay for wire bonding process engineer in California is $90,813.00, according to ZipRecruiter salary data. Most workers in this role earn between $73,500.00 and $101,700.00 per year, depending on experience, location, and employer.

What is a wire bonding process engineer?

A Wire Bonding Process Engineer is responsible for developing, optimizing, and maintaining wire bonding processes in semiconductor manufacturing. They ensure process stability, troubleshoot defects, and work on continuous improvement initiatives to enhance yield and reliability. Their role involves collaborating with design, quality, and production teams to implement best practices and resolve technical challenges. Proficiency in bonding techniques, materials, and equipment is essential for success in this role.

What are some common daily responsibilities for a wire bonding process engineer?

As a Wire Bonding Process Engineer, your daily responsibilities typically include monitoring and optimizing the wire bonding process, troubleshooting equipment or yield issues, and collaborating with quality and production teams to implement process improvements. You may also conduct root cause analyses on defects, develop and document standard operating procedures, and train operators on new technologies or techniques. Regular interaction with equipment vendors and participation in cross-functional meetings are common, ensuring alignment on production and quality goals. This hands-on and collaborative environment enables continuous learning and engagement in advancing semiconductor packaging technologies.

What are the key skills and qualifications needed to thrive in the wire bonding process engineer position, and why are they important?

A Wire Bonding Process Engineer should possess a strong background in materials science, microelectronics, and process engineering, often supported by a relevant engineering degree. Familiarity with wire bonding equipment (such as wedge and ball bonders), knowledge of semiconductor manufacturing standards, and experience with statistical process control (SPC) tools are typically required. Excellent problem-solving abilities, attention to detail, and the capacity to work well within cross-functional teams will help a candidate excel in this role. These competencies ensure precise and reliable assembly in high-tech manufacturing environments, directly impacting product quality and yield.

What are popular job titles related to Wire Bonding Process Engineer jobs in California?

For Wire Bonding Process Engineer jobs in California, the most frequently searched job titles are:

What job categories do people searching Wire Bonding Process Engineer jobs in California look for?

The top searched job categories for Wire Bonding Process Engineer jobs in California are:

What cities in California are hiring for Wire Bonding Process Engineer jobs?

Cities in California with the most Wire Bonding Process Engineer job openings:

Wire Bonding Process Engineer jobs near you
Infographic showing various Wire Bonding Process Engineer job openings in California as of August 2026, with employment types broken down into 94% Full Time, 3% Contract, and 3% Nights. Highlights an 95% In-person, and 5% Hybrid job distribution, with an average salary of $90,813 per year, or $43.7 per hour.

Senior Process Engineer

careers@micross.com

San Jose, CA • On-site

$100K - $150K/yr

Full-time

Re-posted 17 days ago

Job description

Job Description: Sr. Process Engineer

Reports To: Process Engineering Supervisor


Summary:

Perform functions to research, develop, document, qualify, and implement production processes for standard and custom packaged DC-DC converter products. Establish stable manufacturing processes at the prototype phase and release to production. Review, develop, and implement process improvements related to both the design and manufacture of Hybrid Microcircuits and PCB based power circuits.


Essential Duties & Responsibilities:

  • Support process technology transfer from Process Engineering to Manufacturing.
  • Support the development of robust manufacturing processes using Design of Experiments (DOEs).
  • Establish validation and verification criteria for new processes & products.
  • Create and revise documentation detailing production processes and equipment.
  • Provide engineering support to facilitate new processes and troubleshoot problems in assembly areas.
  • Stay abreast of best practices and technologies and update processes to enhance or expand manufacturing capabilities.
  • Review new products to ensure they meet Design for Manufacturing (DFM) criteria.
  • Identify, facilitate, and prioritize opportunities for process improvement.
  • Utilize technical skills associated with Six Sigma, Lean, DRM/DFSS and other appropriate techniques to drive continuous improvement.
  • Follow established procedures to create detailed, accurate, and compliant engineering documentation for Master Validation Plans, pFMEA, Equipment Installation, Qualification and Validation activities.

Other Duties & Responsibilities:

  • Perform or assist with any operations to maintain workflow, meet schedules and meet quality requirements.
  • Maintain safe work areas, comply with safety procedures, and follow equipment operating rules.
  • Follow clean room and other environmental precautions and procedures.
  • Participate in meetings and work groups to facilitate cross functional activities, communicate issues, obtain approvals, resolve problems, and maintain knowledge of new developments, requirements, and policies.
  • Comply with all quality and ITAR policies, practices, and procedures.
  • Participate in team efforts to achieve departmental and company goals.
  • Contribute to building a positive team spirit.
  • Communicate effectively with all levels of employees.
  • Protect confidential information by not communicating, disclosing, or using for benefit of 3rd parties.
  • Maintain the highest degree of honesty and integrity at all times.
  • Perform other related duties as assigned.


Job Qualifications:

  • BSMSE, BSMatE, BSME or equivalent 4-year technical degree.
  • 5-10 years of relevant work experience.
  • CAD, SolidWorks software courses, and/or equivalent experience
  • Experience of expertise in Materials Science and Engineering is a plus.
  • Experience in any of the following processes is a plus: thick-film manufacturing, Au/Al wire bonding, die attach, soldering, lead forming, hermetic sealing, degreasing.


Job Skills:

  • Fast technical document generation/modification in CAD, Word, Excel, etc. (PCB software is a plus).
  • Detail oriented with a clear understanding of DOE and failure analysis concepts.
  • Knowledge in military standards is a plus (MIL-PRF38534, MIL-PRF-38535, MIL-STD-883, JSTD-001).
  • Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace).
  • Knowledge in semiconductor manufacturing is a plus.
  • Self-motivated with the ability to align and change priorities in accordance with business goals.
  • Ability to meet deadlines in a fast-paced environment.
  • Team player who enjoys working with different disciplines.


Tools & Equipment:

  • Computer and peripherals.
  • Standard office equipment.
  • Manual and automatic semiconductor manufacturing equipment.
  • Measuring tools and equipment.
  • Required clean room clothing (gloves, mask, smock, shoe covers).
  • IMPORTANT INFORMATION: This position is in an ITAR-registered facility, US Person (US Citizen or US Permanent resident) status is a must.