Wire Bonding Process Engineer Jobs in California

Job Title: Process / Quality Engineer

Pyramid Semiconductor, part of the HEICO group (www.heico.com, NYSE HEI), develops and manufactures high-reliability semiconductor products for aerospace, defense, and other mission-critical applications. Our small, experienced team works across engineering, operations, and quality to sustain trusted legacy devices and solve complex product-obsolescence challenges for our customers.

We are seeking a hands-on Process & Quality Engineer to strengthen and continuously improve our semiconductor assembly processes, with particular emphasis on die attach and wire bonding. This role is well suited to a mechanical, manufacturing, or related engineer who enjoys working directly with production equipment, operators, tooling, fixtures, and packages-and who can convert practical shop-floor knowledge into stable, documented, and repeatable processes.

Because we operate with a lean team, the engineer will also contribute to Pyramid's quality management system, internal and external audits, corrective actions, and compliance with ISO 9001 and AS9100 requirements. The balance between process and quality work will vary with production priorities, customer programs, and the audit calendar.

Main responsibilities:

• Own and continuously improve die attach, wire bonding, and related microelectronic assembly processes.
• Develop, qualify, document, and maintain robust process parameters, work instructions, travelers, inspection criteria, and operator training materials.
• Design fixtures, tooling, workholding solutions, and mechanical package features that improve manufacturability, repeatability, quality, and operator safety.
• Provide hands-on production support by troubleshooting equipment, material, process, and workmanship issues and implementing sustainable corrective actions.

• Support and strengthen the quality management system in accordance with ISO 9001, AS9100, customer requirements, and applicable internal procedures.
• Participate in internal, customer, registrar, and other third-party audits; help prepare objective evidence, respond to findings, and verify corrective-action effectiveness.
• Lead or support root-cause investigations, nonconformance reviews, corrective and preventive actions, and continuous-improvement projects using disciplined problem-solving methods.
• Assist with risk assessments, process controls, inspection plans, supplier-quality issues, document control, training records, calibration, and configuration/change control.

Key qualifications:

• Bachelor's degree in Mechanical Engineering, Manufacturing Engineering, Materials Engineering, Industrial Engineering, or a closely related discipline.
• Hands-on engineering experience in semiconductor packaging, microelectronics assembly, electronics manufacturing, or another precision-manufacturing environment.
• Working knowledge of die attach, wire bonding, tooling/fixture design, mechanical design, manufacturing documentation, and process troubleshooting.
• Experience using 2D/3D CAD tools and reading or creating engineering drawings; practical knowledge of dimensions, tolerances, materials, and manufacturability.
• Demonstrated ability to investigate process problems, determine root cause, implement corrective actions, and verify results with data.
• Strong written and verbal communication skills, with the ability to work effectively with operators, technicians, engineers, suppliers, auditors, customers, and management.
• Comfort working in a small-company environment where priorities can change and the engineer is expected to contribute both strategically and hands-on.

Compensation and benefits:

BCBS and Kaiser medical plans with different options

• Dental and vision plans
• 401(k) with employer match
• Sick and Vacation time
• Health Savings Account (HSA) with Company Contributions

We are committed to providing our employees with opportunities for growth and development.