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Wire Bonding Process Engineer Jobs (NOW HIRING)

Approach Venture LLC

Senior Process Engineer

Austin, TX · On-site

$140K - $180K/yr

Senior Process Engineer - Advanced Packaging & Manufacturing Austin, Texas | On-site Opportunity ... Experience with advanced assembly techniques including die attach, flip-chip bonding, wire bonding ...

Approach Venture

Senior Process Engineer

Austin, TX · On-site

$140K - $180K/yr

Senior Process Engineer - Advanced Packaging & Manufacturing Austin, Texas | On-site Opportunity ... Experience with advanced assembly techniques including die attach, flip-chip bonding, wire bonding ...

Micross

Senior Process Engineer

Milpitas, CA · On-site

$100K - $135K/yr

Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding preferred Knowledge/Skills: * 10 years of Assembly Process Engineering experience, preferred Hands on in Die ...

Micross

Senior Process Engineer

Milpitas, CA · On-site

$100K - $135K/yr

Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding preferred Knowledge/Skills: * 10 years of Assembly Process Engineering experience, preferred Hands on in Die ...

Teledyne

Process Development Engineer

Mountain View, CA · Hybrid

$72K - $96K/yr

Provide process engineering support for thin-film hybrid assembly and MIC processes * Support ... Background in electronics assembly processes such as wire bonding and die attach (preferred)

Recar

Controls Process Engineer, Coating & Bonding

Warsaw, IN · On-site

$80K - $104K/yr

Process Engineering and OEE * Project Management skills * Understanding of relevant NFPA electrical standards * Knowledge of BIW bonding process * Continuous improvement - leading by example, getting ...

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Wire Bonding Process Engineer information

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$49.5K

$92K

$142.5K

How much do wire bonding process engineer jobs pay per year?

As of Jul 6, 2026, the average yearly pay for wire bonding process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in the Wire Bonding Process Engineer position, and why are they important?

A Wire Bonding Process Engineer should possess a strong background in materials science, microelectronics, and process engineering, often supported by a relevant engineering degree. Familiarity with wire bonding equipment (such as wedge and ball bonders), knowledge of semiconductor manufacturing standards, and experience with statistical process control (SPC) tools are typically required. Excellent problem-solving abilities, attention to detail, and the capacity to work well within cross-functional teams will help a candidate excel in this role. These competencies ensure precise and reliable assembly in high-tech manufacturing environments, directly impacting product quality and yield.

What is a Wire Bonding Process Engineer job?

A Wire Bonding Process Engineer is responsible for developing, optimizing, and maintaining wire bonding processes in semiconductor manufacturing. They ensure process stability, troubleshoot defects, and work on continuous improvement initiatives to enhance yield and reliability. Their role involves collaborating with design, quality, and production teams to implement best practices and resolve technical challenges. Proficiency in bonding techniques, materials, and equipment is essential for success in this role.

What are some common daily responsibilities for a Wire Bonding Process Engineer?

As a Wire Bonding Process Engineer, your daily responsibilities typically include monitoring and optimizing the wire bonding process, troubleshooting equipment or yield issues, and collaborating with quality and production teams to implement process improvements. You may also conduct root cause analyses on defects, develop and document standard operating procedures, and train operators on new technologies or techniques. Regular interaction with equipment vendors and participation in cross-functional meetings are common, ensuring alignment on production and quality goals. This hands-on and collaborative environment enables continuous learning and engagement in advancing semiconductor packaging technologies.

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Infographic showing various Wire Bonding Process Engineer job openings in the United States as of June 2026, with employment types broken down into 4% As Needed, 79% Full Time, and 17% Contract. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.
Principal Process Engineer, Die Bonding

Principal Process Engineer, Die Bonding

Micron Technology

Boise, ID • On-site

Full-time

Medical, Dental, Vision, PTO

Posted yesterday

Micron Technology rating

8.7

Company rating: 8.7 out of 10

Based on 41 frontline employees who took The Breakroom Quiz

11th of 141 rated electronics manufacturers

Job description

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.
As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.
Responsibilities:
  • Develop, diagnose, and resolve various die bonding process technologies
  • Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step
  • Lead and participate in continuous yield improvement and cost reduction activities
  • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
  • Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives
  • Support SPC/FDC/RMS/APC and site-to-site portability
  • Support internal and external audits

Minimum Qualifications:
  • A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering
  • Solid engineering knowledge of semiconductor advanced packaging die stacking processes
  • Skilled at designing valid tests and Design of Experiments (DOE)
  • Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs
  • Excellent oral and written communication skills and a strong attention to detail
  • Highly self-motivated and have the ability to work independently, as a group leader, and as a collaborative contributor
  • Knowledge and an understanding of project management

Preferred Qualifications:
  • Masters or Doctorate degree in Engineering, Physics, or related field
  • Experience in working on Die Bonding : Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration
  • Bonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or Integrator

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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