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Wire Bonding Process Engineer Jobs (NOW HIRING)

RLA Engineering LLC

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MEMS Process Engineer

Corvallis, OR · On-site

Position Summary This position is responsible for supporting various wafer bonding processes ... The wafer fab process engineer will collaborate with product R&D teams to make decisions on process ...

PsiQuantum

Associate Process Engineer

Milpitas, CA · On-site

By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the guidance of ...

Lutron Electronics Co., Inc

Process Engineer

Austin, TX · On-site

... onsite Engineering Process Owner to lead and elevate the Ketra advanced packaging line--the ... Experience working with wire bonding or wedge bonding, or similar semiconductor assembly strongly ...

Johnson Service Group

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Manufacturing / Process Engineer - Automation

Cypress, CA · On-site

$95K - $120K/yr

... AOI), wire bonding, and pick-and-place systems. Key Responsibilities * Program, optimize, and ... Bachelor's degree in Manufacturing Engineering, Process Engineering, Mechanical Engineering ...

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Micross

Senior Process Engineer

Milpitas, CA · On-site

$100K - $135K/yr

Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding preferred Knowledge/Skills: * 10 years of Assembly Process Engineering experience, preferred Hands on in Die ...

Micross

Senior Process Engineer

Milpitas, CA · On-site

$100K - $135K/yr

Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding preferred Knowledge/Skills: * 10 years of Assembly Process Engineering experience, preferred Hands on in Die ...

Recar

Controls Process Engineer, Coating & Bonding

Warsaw, IN · On-site

$80K - $104K/yr

Process Engineering and OEE * Project Management skills * Understanding of relevant NFPA electrical standards * Knowledge of BIW bonding process * Continuous improvement - leading by example, getting ...

Teledyne

Process Development Engineer

Mountain View, CA · Hybrid

$72K - $96K/yr

Provide process engineering support for thin-film hybrid assembly and MIC processes * Support ... Background in electronics assembly processes such as wire bonding and die attach (preferred)

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Wire Bonding Process Engineer information

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How much do wire bonding process engineer jobs pay per year?

As of Jun 15, 2026, the average yearly pay for wire bonding process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in the Wire Bonding Process Engineer position, and why are they important?

A Wire Bonding Process Engineer should possess a strong background in materials science, microelectronics, and process engineering, often supported by a relevant engineering degree. Familiarity with wire bonding equipment (such as wedge and ball bonders), knowledge of semiconductor manufacturing standards, and experience with statistical process control (SPC) tools are typically required. Excellent problem-solving abilities, attention to detail, and the capacity to work well within cross-functional teams will help a candidate excel in this role. These competencies ensure precise and reliable assembly in high-tech manufacturing environments, directly impacting product quality and yield.

What is a Wire Bonding Process Engineer job?

A Wire Bonding Process Engineer is responsible for developing, optimizing, and maintaining wire bonding processes in semiconductor manufacturing. They ensure process stability, troubleshoot defects, and work on continuous improvement initiatives to enhance yield and reliability. Their role involves collaborating with design, quality, and production teams to implement best practices and resolve technical challenges. Proficiency in bonding techniques, materials, and equipment is essential for success in this role.

What are some common daily responsibilities for a Wire Bonding Process Engineer?

As a Wire Bonding Process Engineer, your daily responsibilities typically include monitoring and optimizing the wire bonding process, troubleshooting equipment or yield issues, and collaborating with quality and production teams to implement process improvements. You may also conduct root cause analyses on defects, develop and document standard operating procedures, and train operators on new technologies or techniques. Regular interaction with equipment vendors and participation in cross-functional meetings are common, ensuring alignment on production and quality goals. This hands-on and collaborative environment enables continuous learning and engagement in advancing semiconductor packaging technologies.

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Wire Bonding Process Engineer jobs near you
Infographic showing various Wire Bonding Process Engineer job openings in the United States as of June 2026, with employment types broken down into 33% Full Time, and 67% Contract. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.
MEMS Process Engineer

MEMS Process Engineer

RLA Engineering LLC

Corvallis, OR • On-site

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 18 days ago

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Job description

Position Summary

This position is responsible for supporting various wafer bonding processes (microbond WC) for the high-volume fabrication of MEMS (silicon wafer). The candidate will use their understanding of fabrication processes and product development methodologies to achieve the yield goals of assigned toolset/process step(s). The wafer fab process engineer will collaborate with product R&D teams to make decisions on process quality based on data and statistical analysis.

Duties and Responsibilities

  • Develop fundamental understanding of assigned fabrication processes and product development methodologies against target yields
  • Determine wafer surface preparation and pre-bond cleaning requirements (plasma, wet cleans, dehydration bakes) to achieve high bond strength and low defectivity
  • Confirm bond alignment, bond tool operation, and post-bond thermal processing (bakes/cures) to ensure mechanical integrity and yield
  • Collaborate with:

· Other process and tooling engineers to execute process characterization, optimization, and margin studies including SPC, DOE, yield analysis, and defect reduction

·Equipment engineering, integration, and quality teams to drive process stability and continuous improvement

  • Contribute to FA by troubleshooting bond-related excursions such as delamination, voiding, particle-driven defects, and thickness non-uniformity
  • Support NPI, process transfer, and documentation (work instructions, process flows, FMEA, and control plans)
  • Occasionally work 40+ hours in a week to meet certain team milestones
  • Perform other duties as needed

Education and Credential Requirements

  • Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field
  • Due to project scope - US Citizenship is a requirement to be eligible for this role. Eligible to work in the US without RLA sponsorship for employment visa status

Experience Requirements

  • 3-5 years of experience in a wafer bonding process engineer role
  • Wafer bonding processes supporting volume manufacturing and R&D environments
  • Wafer-to-wafer and wafer-to-carrier bonding (e.g., direct bond, adhesive bond, oxide bond, plasma/anodic bond) used in MEMS and advanced device integration
  • Familiar with IR inspection, metrology, and cross-section analysis to evaluate bond voids, alignment accuracy, and interface quality
  • Use of Quality Systems, Statistical Process Control, Design of Experiments, and basic statistical data analysis on tooling design, process development, and improvements
  • Preferred experience:

· Worked on MEMS products

· Collaboration with Mechanical Tooling and Process Engineers on designing custom jigs/fixtures for wafer handling

Skills Requirements

  • Ability to read, write, and speak English proficiently
  • High proficiency using productivity software such as M365 (Word, Outlook, Excel, PowerPoint, Visio, Teams and SharePoint)
  • Ability to use agile/scrum project/program management principles and methodologies to consistently meet task deadlines, triage changing priorities, and track issues to resolution
  • Ability to collaborate across diverse teams with a customer service mindset

Work Environment

  • The position typically operates in a standard office environment and/or from employee’s home
  • Be able to lift and/or move up to 25 pounds

Company Description

Founded in 2010 and based in Vancouver, WA, RLA Engineering is a premier engineering design firm. We partner with clients from start-ups to industry leaders across the U.S. to help bring great products to life. From concept to prototype, we provide test & measurement and product design solutions powered by deep technical expertise.