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Wire Bonding Process Engineer Jobs (NOW HIRING)

Mesh Optical Technologies

Process Engineer

Gardena, CA · On-site

$90K - $140K/yr

... and wire bonding * Ability to interpret process documentation, equipment specifications, and ... Process Engineer: $90,000.00 - $140,000.00/per year Title and base salary are determined on a case ...

Quinstar Technology Inc

Senior Wire Bonder

Torrance, CA · On-site

$27.05 - $35.70/hr

... complete complex bonding tasks and ensure workmanship meets strict engineering and quality ... Accurately document manufacturing steps, inspections, and process verifications on production ...

QuinStar Technology, Inc

Senior Wire Bonder

Torrance, CA · On-site

$27.05 - $35.70/hr

... complete complex bonding tasks and ensure workmanship meets strict engineering and quality ... Accurately document manufacturing steps, inspections, and process verifications on production ...

Quinstar Technology Inc

Senior Wire Bonder

Torrance, CA

$27.05 - $35.70/hr

... complete complex bonding tasks and ensure workmanship meets strict engineering and quality ... Accurately document manufacturing steps, inspections, and process verifications on production ...

PsiQuantum

Associate Process Engineer

Milpitas, CA · On-site

By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the guidance of ...

PsiQuantum

Associate Process Engineer

Milpitas, CA

By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the guidance of ...

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Wire Bonding Process Engineer information

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$49.5K

$92K

$142.5K

How much do wire bonding process engineer jobs pay per year?

As of Jun 15, 2026, the average yearly pay for wire bonding process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in the Wire Bonding Process Engineer position, and why are they important?

A Wire Bonding Process Engineer should possess a strong background in materials science, microelectronics, and process engineering, often supported by a relevant engineering degree. Familiarity with wire bonding equipment (such as wedge and ball bonders), knowledge of semiconductor manufacturing standards, and experience with statistical process control (SPC) tools are typically required. Excellent problem-solving abilities, attention to detail, and the capacity to work well within cross-functional teams will help a candidate excel in this role. These competencies ensure precise and reliable assembly in high-tech manufacturing environments, directly impacting product quality and yield.

What is a Wire Bonding Process Engineer job?

A Wire Bonding Process Engineer is responsible for developing, optimizing, and maintaining wire bonding processes in semiconductor manufacturing. They ensure process stability, troubleshoot defects, and work on continuous improvement initiatives to enhance yield and reliability. Their role involves collaborating with design, quality, and production teams to implement best practices and resolve technical challenges. Proficiency in bonding techniques, materials, and equipment is essential for success in this role.

What are some common daily responsibilities for a Wire Bonding Process Engineer?

As a Wire Bonding Process Engineer, your daily responsibilities typically include monitoring and optimizing the wire bonding process, troubleshooting equipment or yield issues, and collaborating with quality and production teams to implement process improvements. You may also conduct root cause analyses on defects, develop and document standard operating procedures, and train operators on new technologies or techniques. Regular interaction with equipment vendors and participation in cross-functional meetings are common, ensuring alignment on production and quality goals. This hands-on and collaborative environment enables continuous learning and engagement in advancing semiconductor packaging technologies.

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Wire Bonding Process Engineer jobs near you
Infographic showing various Wire Bonding Process Engineer job openings in the United States as of June 2026, with employment types broken down into 33% Full Time, and 67% Contract. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.
Senior Microelectronics Process Engineer

Senior Microelectronics Process Engineer

Paradromics

Austin, TX • On-site

$103K - $133K/yr

Full-time

Posted yesterday

Job description

Microelectronics Process Engineer
About Paradromics
Brain-related illness is one of the last great frontiers in medicine, not because the brain is unknowable, but because it has been inaccessible. Paradromics is building a brain-computer interface (BCI) platform that records brain activity at the highest possible resolution: the individual neuron. AI algorithms then decode this massive amount of brain-data, enabling the seamless translation of thought into treatments.
Our first clinical application, the Connexus® BCI, will help people who are unable to speak, due to ALS, spinal cord injuries and stroke, to communicate independently through digital devices. However, the capabilities of our BCI platform go far beyond our first application. With the brain in direct communication with digital devices, we can leverage technology to transform how we treat conditions ranging from sensory and motor deficits to untreatable mental illness.
The Role
Paradromics is seeking a Microelectronics Process Engineer to join the Process Engineering team in Austin, TX. This role will own and improve in-house backend microfabrication and microelectronics assembly processes that are critical to delivering reliable, high-performance medical devices. The ideal candidate is hands-on, data-driven, and comfortable taking full ownership of manufacturing processes from development through production.
Responsibilities
  • Own and maintain in-house backend microfabrication and microelectronics assembly processes, including wire bonding, flip chip bonding, solder bumping, underfill/epoxy dispensing, reflow, and related SMT processes.
  • Maintain in-house testing protocols, ensuring accurate functional and parametric characterization of devices and subcomponents.
  • Drive yield, quality, and cycle-time improvements through structured process improvement initiatives, including DOE and root cause analysis.
  • Lead efforts to bring currently outsourced microelectronics assembly processes in-house where feasible.
  • Investigate, document, and disposition non-conformances related to owned processes.
  • Collaborate closely with design, quality, and supply chain teams to support product development, scaling, and process transfer.

Required Education
  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related technical field.

Required Qualifications
  • 7+ years of hands-on experience with backend microfabrication and/or SMT processes (e.g., wire bonding, flip chip bonding, epoxy/flux dispensing, solder bumping, reflow).
  • Demonstrated experience owning manufacturing processes, writing operations procedures, and driving measurable yield improvements.
  • Strong data analysis skills, including data extraction, statistical analysis, and visualization.
  • Familiarity with Python for Data Analysis and automated electrical tests.
  • Strong cross-functional communication skills and the ability to work effectively with design, reliability, and operations teams.

Preferred Qualifications
  • Experience transferring processes from R&D to production or bringing outsourced processes in-house.
  • Prior experience using Oscilliscopes, Source meters, Multi-meter and Signal Generators for testing electrical components.
  • Experience applying structured problem-solving methodologies such as DOE, 8D, 5-Why, or Ishikawa analysis.
  • Knowledge of industry standards such as IPC, JEDEC, and MIL-STD related to microelectronics assembly and testing.
  • Experience in regulated industries, particularly medical devices.

Paradromics is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, or national origin.

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