ZipRecruiter

Log In

1

Wire Bonding Process Engineer Jobs (NOW HIRING)

PsiQuantum

Associate Process Engineer

Milpitas, CA · On-site

  • Medical

  • Life

  • Retirement

  • PTO

By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the guidance of ...

PsiQuantum

Associate Process Engineer

Milpitas, CA

By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the guidance of ...

PsiQuantum

Associate Process Engineer

Milpitas, CA · On-site

  • Medical

  • Life

  • Retirement

  • PTO

By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the guidance of ...

Heico

Process / Quality Engineer

Sunnyvale, CA

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

Process engineering and manufacturing support ... Own and continuously improve die attach, wire bonding, and related microelectronic assembly ...

HEICO

Process / Quality Engineer

Sunnyvale, CA · On-site

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

Process engineering and manufacturing support ... Own and continuously improve die attach, wire bonding, and related microelectronic assembly ...

Lutron Electronics Co., Inc

Process Engineer

Austin, TX · On-site

... onsite Engineering Process Owner to lead and elevate the Ketra advanced packaging line--the ... Experience working with wire bonding or wedge bonding, or similar semiconductor assembly strongly ...

HEICO

Process / Quality Engineer

Sunnyvale, CA · On-site

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

Process engineering and manufacturing support ... Own and continuously improve die attach, wire bonding, and related microelectronic assembly ...

previous pagenext page

Showing results 21-40

All JobsManufacturing JobsElectronics JobsWire Bonding Process Engineer Jobs

Wire Bonding Process Engineer information

See salary details

$49.5K

$92K

$142.5K

How much do wire bonding process engineer jobs pay per year?

As of Aug 18, 2026, the average yearly pay for wire bonding process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is a wire bonding process engineer?

A Wire Bonding Process Engineer is responsible for developing, optimizing, and maintaining wire bonding processes in semiconductor manufacturing. They ensure process stability, troubleshoot defects, and work on continuous improvement initiatives to enhance yield and reliability. Their role involves collaborating with design, quality, and production teams to implement best practices and resolve technical challenges. Proficiency in bonding techniques, materials, and equipment is essential for success in this role.

What are some common daily responsibilities for a wire bonding process engineer?

As a Wire Bonding Process Engineer, your daily responsibilities typically include monitoring and optimizing the wire bonding process, troubleshooting equipment or yield issues, and collaborating with quality and production teams to implement process improvements. You may also conduct root cause analyses on defects, develop and document standard operating procedures, and train operators on new technologies or techniques. Regular interaction with equipment vendors and participation in cross-functional meetings are common, ensuring alignment on production and quality goals. This hands-on and collaborative environment enables continuous learning and engagement in advancing semiconductor packaging technologies.

What are the key skills and qualifications needed to thrive in the wire bonding process engineer position, and why are they important?

A Wire Bonding Process Engineer should possess a strong background in materials science, microelectronics, and process engineering, often supported by a relevant engineering degree. Familiarity with wire bonding equipment (such as wedge and ball bonders), knowledge of semiconductor manufacturing standards, and experience with statistical process control (SPC) tools are typically required. Excellent problem-solving abilities, attention to detail, and the capacity to work well within cross-functional teams will help a candidate excel in this role. These competencies ensure precise and reliable assembly in high-tech manufacturing environments, directly impacting product quality and yield.

More about Wire Bonding Process Engineer jobs

What cities are hiring for Wire Bonding Process Engineer jobs?

Cities with the most Wire Bonding Process Engineer job openings:

What states have the most Wire Bonding Process Engineer jobs?

States with the most job openings for Wire Bonding Process Engineer jobs include:

What job categories do people searching Wire Bonding Process Engineer jobs look for?

The top searched job categories for Wire Bonding Process Engineer jobs are:

Wire Bonding Process Engineer jobs near you
Infographic showing various Wire Bonding Process Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 79% Full Time, 16% Part Time, 3% Contract, and 1% Nights. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Automatic/Manual Wire Bonding Operator

MACOM Technology Solutions Holdings

Lowell, MA

$16.75 - $20.25/hr

Full-time

Re-posted 22 days ago

Job description

Automatic Wire Bonding Operator

Job Description

 This role will be an assembly operator working with Automatic wire bonding equipment.

Responsibilities:

  •  Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
  •  Operate and set-up Automatic Gold wire/ribbon bonders (Palomar 8000, H+K 820 systems or F&K Delvotec) per micro-circuit layout drawings
  •  Operator is responsible for proper wire formation, bond appearance and bond strength.
  •  Flexibility to be trained in multiple Microelectronics processes that involve ball & wedge wire bonding
  •  Capable of performing bond pull/die shear and plotting SPC with data
  •  Familiarity of the use of plasma cleaning and other surface preparation for semiconductors and substrates
  •  Requires significant attention to detail for production activities and documentation to maintain compliance with MIL-STD 883 requirements
  •  Familiarity with FOD prevention and management
  •  Familiar with ESD controls

Apply