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Wire Bonding Process Engineer Jobs (NOW HIRING)

John Galt Staffing

Wire Bonder

Lawrence, MA · Hybrid

$22 - $25/hr

Working proficiency in die attach, wire bonding, and fly wire/tack wire methods * Exposure to soldering and lid seal processes (independent proficiency not required but preferred) * Familiarity with ...

John Galt Staffing

Wire Bonder

Lawrence, MA · On-site

$22 - $25/hr

Working proficiency in die attach, wire bonding, and fly wire/tack wire methods * Exposure to soldering and lid seal processes (independent proficiency not required but preferred) * Familiarity with ...

Mesh Optical Technologies

Process Engineer

Gardena, CA

$90K - $140K/yr

... and wire bonding * Ability to interpret process documentation, equipment specifications, and ... Process Engineer: $90,000.00 - $140,000.00/per year Title and base salary are determined on a case ...

Mesh Optical Technologies

Process Engineer

Gardena, CA · On-site

$90K - $140K/yr

... and wire bonding * Ability to interpret process documentation, equipment specifications, and ... Process Engineer: $90,000.00 - $140,000.00/per year Title and base salary are determined on a case ...

PsiQuantum

Associate Process Engineer

Milpitas, CA · On-site

By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the guidance of ...

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Wire Bonding Process Engineer information

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How much do wire bonding process engineer jobs pay per year?

As of Sep 7, 2026, the average yearly pay for wire bonding process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is a wire bonding process engineer?

A Wire Bonding Process Engineer is responsible for developing, optimizing, and maintaining wire bonding processes in semiconductor manufacturing. They ensure process stability, troubleshoot defects, and work on continuous improvement initiatives to enhance yield and reliability. Their role involves collaborating with design, quality, and production teams to implement best practices and resolve technical challenges. Proficiency in bonding techniques, materials, and equipment is essential for success in this role.

What are some common daily responsibilities for a wire bonding process engineer?

As a Wire Bonding Process Engineer, your daily responsibilities typically include monitoring and optimizing the wire bonding process, troubleshooting equipment or yield issues, and collaborating with quality and production teams to implement process improvements. You may also conduct root cause analyses on defects, develop and document standard operating procedures, and train operators on new technologies or techniques. Regular interaction with equipment vendors and participation in cross-functional meetings are common, ensuring alignment on production and quality goals. This hands-on and collaborative environment enables continuous learning and engagement in advancing semiconductor packaging technologies.

What are the key skills and qualifications needed to thrive in the wire bonding process engineer position, and why are they important?

A Wire Bonding Process Engineer should possess a strong background in materials science, microelectronics, and process engineering, often supported by a relevant engineering degree. Familiarity with wire bonding equipment (such as wedge and ball bonders), knowledge of semiconductor manufacturing standards, and experience with statistical process control (SPC) tools are typically required. Excellent problem-solving abilities, attention to detail, and the capacity to work well within cross-functional teams will help a candidate excel in this role. These competencies ensure precise and reliable assembly in high-tech manufacturing environments, directly impacting product quality and yield.

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Wire Bonding Process Engineer jobs near you
Infographic showing various Wire Bonding Process Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 79% Full Time, 16% Part Time, 3% Contract, and 1% Nights. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Principal Process Engineer, Die Bonding

Micron Technology, Inc

Boise, ID • On-site

$100 - $125/hr

Other

Medical, Dental, Vision, PTO

Re-posted 3 days ago

Micron Technology rating

8.6

Company rating: 8.6 out of 10

Based on 43 frontline employees who took The Breakroom Quiz

26th of 161 rated electronics manufacturers

Job description

Micron Technology

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Principal Process Engineer – Die Bonding

As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Responsibilities
  • Develop, diagnose, and resolve various die bonding process technologies
  • Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step
  • Lead and participate in continuous yield improvement and cost reduction activities
  • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
  • Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives
  • Support SPC/FDC/RMS/APC and site-to-site portability
  • Support internal and external audits
Minimum Qualifications
  • A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering
  • Solid engineering knowledge of semiconductor advanced packaging die stacking processes
  • Skilled at designing valid tests and Design of Experiments (DOE)
  • Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs
  • Excellent oral and written communication skills and a strong attention to detail
  • Highly self‑motivated and have the ability to work independently, as a group leader, and as a collaborative contributor
  • Knowledge and an understanding of project management
Preferred Qualifications
  • Masters or Doctorate degree in Engineering, Physics, or related field
  • Experience in working on Die Bonding: Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration
  • Bonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or Integrator
Job Profile(s)

Semiconductor Process Engineer 5

Relocation Level: TBD

Benefits

Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

Equal Opportunity Employer

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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