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Semiconductor Failure Analysis Engineer Jobs (NOW HIRING)

Cree

Failure Analysis Engineer

Fayetteville, AR

Failure analysis laboratory process engineer in Fayetteville, AR. Individual will provide support ... Working knowledge of semiconductor process technology and device functionality * Great soft skills ...

Apple

Silicon Failure Analysis Engineer

Austin, TX · On-site

... Failure Analysis Engineer! As a member of our dynamic group, you will have the rare and great ... semiconductor, IC, and PCB design Knowledge of semiconductor physics and advanced fabrication ...

Apple

Silicon Failure Analysis Engineer

Austin, TX

... Failure Analysis Engineer! As a member of our dynamic group, you will have the rare and great ... semiconductor, IC, and PCB design Knowledge of semiconductor physics and advanced fabrication ...

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Semiconductor Failure Analysis Engineer information

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How much do semiconductor failure analysis engineer jobs pay per year?

As of Jun 28, 2026, the average yearly pay for semiconductor failure analysis engineer in the United States is $93,179.00, according to ZipRecruiter salary data. Most workers in this role earn between $70,000.00 and $118,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in the Semiconductor Failure Analysis Engineer position, and why are they important?

To thrive as a Semiconductor Failure Analysis Engineer, you need a strong foundation in electrical engineering, materials science, and semiconductor device physics, typically supported by a relevant bachelor’s or advanced degree. Familiarity with tools such as Scanning Electron Microscopes (SEM), Focused Ion Beam (FIB) systems, and failure analysis software, as well as certifications like IPC-A-610, are highly advantageous. Strong analytical thinking, attention to detail, and effective communication skills help you work efficiently within multidisciplinary teams. These skills are vital for identifying, diagnosing, and resolving complex device failures to support product reliability and innovation.

What is a Semiconductor Failure Analysis Engineer job?

A Semiconductor Failure Analysis Engineer identifies and analyzes defects in semiconductor devices to determine root causes of failures. They use techniques such as electron microscopy, spectroscopy, and electrical testing to diagnose issues. Their work helps improve manufacturing processes, enhance product reliability, and support quality assurance. They collaborate with design, process, and reliability engineers to recommend corrective actions. This role is critical in industries like consumer electronics, automotive, and telecommunications, where semiconductor performance is essential.

What are common daily responsibilities for a Semiconductor Failure Analysis Engineer?

A Semiconductor Failure Analysis Engineer typically investigates device failures using advanced analytical techniques such as microscopy, electrical testing, and thermal analysis. Daily tasks often include collaborating with design, manufacturing, and reliability teams, preparing detailed reports on root cause findings, and recommending corrective actions. The role involves hands-on laboratory work, data interpretation, and sometimes fielding urgent analyses to support production timelines. This dynamic environment offers variety and opportunities to directly influence improvements in product quality.

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Semiconductor Failure Analysis Engineer jobs near you
Infographic showing various Semiconductor Failure Analysis Engineer job openings in the United States as of June 2026, with employment types broken down into 3% Internship, 6% As Needed, 68% Full Time, 14% Part Time, and 9% Contract. Highlights an 90% Physical, 2% Hybrid, and 8% Remote job distribution, with an average salary of $93,179 per year, or $44.8 per hour.
Failure Analysis Engineer, Microelectronics (Starlink)

Failure Analysis Engineer, Microelectronics (Starlink)

SpaceX

Bastrop, TX

Other

Posted 19 days ago

SpaceX rating

8.7

Company rating: 8.7 out of 10

Based on 144 frontline employees who took The Breakroom Quiz

14th of 60 rated aerospace companies

Job description

FAILURE ANALYSIS ENGINEER, MICROELECTRONICS (STARLINK)

Starlink is SpaceX's ambitious goal to bring high-quality internet to the globe by building a constellation of thousands of satellites in low Earth orbit (LEO) using our Falcon 9 and Starship reusable rockets. We are developing millions of devices for end users to link our customers to our satellites.

As a Failure Analysis Engineer on the Starlink team, you will perform detailed root cause failure analysis on microelectronic components and packaging to support high-volume manufacturing, qualification, and field returns. You will leverage advanced laboratory tools and physics-of-failure techniques to identify failure mechanisms and drive corrective actions that improve the reliability of our satellite constellation and user terminals.

RESPONSIBILITIES:

  • Own end-to-end root cause failure analysis investigations on microelectronics failing in manufacturing, test, and field, from initial failure characterization through final corrective action verification
  • Conduct advanced electrical fault isolation and characterization using curve trace, TDR, RF characterization, Lock-in Thermography, OBIRCH, EBIRCH, EBAC, nanoprobing, and related techniques to precisely localize defects in complex devices
  • Perform advanced physical failure analysis using SEM, FIB, EDS, SAM, cross-sectioning, and related techniques to identify failure mechanisms in silicon, packaging, and interconnects
  • Apply physics-of-failure principles and deep knowledge of semiconductor failure modes (electromigration, thermal fatigue, delamination, EOS/ESD, solder joint fatigue, etc.) to determine root causes
  • Drive corrective actions by working directly with silicon design, packaging, and manufacturing teams to implement and validate design or process changes based on FA findings
  • Author detailed technical reports documenting failure modes, root cause conclusions, supporting data, and corrective action effectiveness
  • Develop and improve failure analysis techniques and workflows to support new packaging technologies and advanced materials

BASIC QUALIFICATIONS:

  • Bachelor's degree in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline 
  • 2+ years of hands-on experience in microelectronics failure analysis or materials characterization (internship experience is applicable)

PREFERRED SKILLS AND EXPERIENCE:

  • Master's or PhD in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline with a focus on microelectronics or failure analysis
  • Direct experience with failure analysis tools and techniques (SEM, FIB, EDS, cross-sectioning, fault isolation, or equivalent)
  • Strong understanding of semiconductor physics and common microelectronics failure mechanisms (electromigration, thermal fatigue, delamination, solder joint fatigue, electrical overstress/ESD, etc.)
  • Proficiency with advanced FA tools including SEM, FIB, SAM, and EDS
  • Hands-on experience in electrical characterization and fault isolation techniques such as IV curves, RF/VNA measurement, LIT, OBIRCH, EBIRCH, EBAC, nanoprobing, photon emission, or voltage contrast
  • Experience applying JEDEC and AEC reliability test standards and physics-of-failure methodologies to root cause investigations
  • Experience analyzing complex datasets with Python, JMP, or similar tools
  • Excellent problem-solving, communication, and technical writing skills

ADDITIONAL REQUIREMENTS:

  • Ability to work overtime and weekends as needed
  • Ability to work in a cleanroom or ESD-controlled environment when required

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