Process Engineer Electrical Jobs in Virginia (NOW HIRING)

Absolics Inc. is a U.S.-based subsidiary of SKC Co., Ltd., pioneering the commercialization of Glass Core Substrates (GCS) for next-generation semiconductor packaging. Our Covington, GA facility is the center of our U.S. NPI and manufacturing operations, developing glass substrate solutions for AI accelerators, HPC SoCs, and advanced chiplet architectures. We are growing our NPI team to accelerate product development and customer launch programs with tier-1 fabless and OSAT customers.

NPI Process Engineer

Covington, GA

Full-Time

The NPI Engineer owns new Glass Core Substrate product development from initial customer engagement through product launch. Working closely with customer engineering teams, this role defines product specifications, drives internal development and sample builds, and shepherds the product through qualification and into volume production. We are looking for someone who has been on the floor — who understands how materials and processes behave, knows how to read a failure, and has sat across the table from a customer to close out a product launch. Substrate manufacturer background is the strongest fit; OSAT packaging engineering experience is also well-suited for this role.

• Own new GCS product development programs end-to-end: from customer requirements intake through specification definition, sample development, qualification, and production launch.
• Translate customer package requirements into product specifications and internal design targets; work with CAM and process engineering to confirm manufacturability.
• Lead internal development builds: define build objectives, coordinate with manufacturing and process teams, evaluate results, and drive iterative improvement toward spec.
• Perform or coordinate product analysis (cross-section, electrical, dimensional, surface) to characterize new products and resolve development issues.

• Participate in product roadmap planning: identify technology gaps, define development priorities, and align the NPI pipeline with customer and market requirements.
• Act as the primary technical point of contact for customer engineering teams throughout the product development cycle.
• Lead customer technical meetings: present product development status, DFM feedback, sample evaluation results, and qualification progress.
• Manage the customer sample cycle: coordinate build scheduling, shipment, and follow-up on customer evaluation feedback.
• Drive product launch activities in close coordination with customers — from final qualification sign-off through initial production delivery.

• Define qualification test plans in alignment with customer requirements and product application; coordinate test execution with internal and external test resources.
• Review and interpret reliability test results (HAST, TCT, bending, electrical characterization, etc.); prepare qualification summary reports for customer and internal review.
• Identify reliability risks early in the development cycle through design and process review; drive mitigations before qualification.
• Own qualification documentation and manage handoff to the production team upon successful completion.

• Work closely with process engineering, CAM, and operations teams to resolve development issues and ensure smooth NPI-to-production transitions.
• Collaborate with Korea HQ R&D and engineering on material and technology development aligned with the GCS product roadmap.
• Maintain clear and organized NPI program documentation: product specs, development reports, qualification records, and lessons learned.
• Feed process and product insights back into design rules and development best practices to improve future NPI cycles.

• Bachelor’s degree or higher in any engineering discipline — Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or equivalent. Field of study is less important than hands‑on engineering experience.

• 3+ years of experience in substrate or semiconductor packaging engineering. We are targeting a mid-level to senior engineer; Junior‑level candidates will not be considered. Final level placement will be assessed through the interview process.
• Substrate manufacturer background strongly preferred; OSAT packaging engineering background also well‑suited:
• Advanced substrate process experience: buildup layer, via fill, surface finish, panel processing, or equivalent
• OSAT packaging experience: FC‑BGA, 2.5D/3D integration, chiplet packaging, or equivalent
• Glass or specialty substrate background (TGV, ceramic, embedded) is a significant plus
• Hands‑on process engineering or product analysis experience — someone who has worked with materials and processes directly, not just managed programs from a desk.
• Experience taking a product from development through customer qualification and commercial launch.
• Working understanding of reliability concepts as applied to semiconductor packaging: failure modes, stress testing principles, and how design and process decisions affect long‑term product performance.

• Must be 18 years of age or older.
• Must be legally authorized to work in the United States.
• Proficiency in MS Office: Excel, Word, PowerPoint, Outlook.

The following are not required but would strengthen a candidate’s application:

• Experience developing or contributing to product roadmaps in collaboration with customers.
• Familiarity with DFM (Design for Manufacturability) concepts for high-density substrates.
• Background in failure analysis: cross-section SEM/TEM, EDX, or equivalent analytical techniques.
• Exposure to quality certification frameworks (ISO 9001, IATF 16949) or reliability test standards — understanding of the framework is sufficient; hands‑on ownership not required.
• Experience with DOE or statistical analysis tools (Minitab, JMP) in a process or product development context.
• Automotive‑grade product experience or familiarity with AEC-Q100 qualification requirements.
• Korean language proficiency (oral and/or written) — helpful for day‑to‑day collaboration with Korea HQ engineering teams.
• Strong technical writing and presentation skills; comfortable presenting to both customer engineers and senior leadership.

• $85,000 – $115,000

• 401K 6% matching (NO vesting period)
• Healthcare 100% support (Health, Dental, Vision)
• Life, STD, LTD 100 % support
• Cell phone allowance
• PTO and self-development