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Principal Physical Design Engineer Jobs (NOW HIRING)

Physical Design Engineer

San Jose, CA · On-site

$105K - $120K/yr

As a Physical Design Engineer, you will support block-level and/or top-level physical design implementation activities across FPGA product development. You will work closely with cross-functional ...

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Principal Physical Design Engineer information

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$74K

$147.2K

$212.5K

How much do principal physical design engineer jobs pay per year?

As of Jul 21, 2026, the average yearly pay for principal physical design engineer in the United States is $147,220.00, according to ZipRecruiter salary data. Most workers in this role earn between $118,500.00 and $173,000.00 per year, depending on experience, location, and employer.

What is the difference between Principal Physical Design Engineer vs Physical Design Engineer?

AspectPrincipal Physical Design EngineerPhysical Design Engineer
CredentialsBachelor's/Master's in Electrical Engineering or related; extensive experienceBachelor's/Master's in Electrical Engineering or related; some experience
Work EnvironmentLead design teams, oversee complex chip layouts, strategic planningImplement physical design tasks, optimize layouts, follow design flows
Industry UsageUsed in advanced semiconductor companies, high-level design rolesCommon in semiconductor companies, entry to mid-level roles

The Principal Physical Design Engineer typically holds a senior role with leadership responsibilities, overseeing complex projects and guiding teams. In contrast, a Physical Design Engineer focuses on executing physical design tasks under supervision. Both roles require similar technical skills and industry experience, but the principal position involves strategic planning and higher-level decision-making.

What are Principal Physical Design Engineers?

Principal Physical Design Engineers are senior professionals in the semiconductor industry responsible for overseeing the physical implementation of integrated circuit (IC) designs. They lead teams in tasks like floorplanning, placement, routing, timing closure, and verification to ensure that chip layouts meet performance, power, and area requirements. These engineers use specialized design tools and collaborate closely with other engineering teams throughout the chip development process. Their expertise is crucial for translating circuit schematics into manufacturable silicon.

What are the key skills and qualifications needed to thrive as a Principal Physical Design Engineer, and why are they important?

To thrive as a Principal Physical Design Engineer, you need deep expertise in ASIC/FPGA physical design, strong knowledge of RTL-to-GDSII flow, and a relevant degree in electrical or computer engineering. Proficiency with EDA tools such as Synopsys, Cadence, or Mentor Graphics, as well as familiarity with scripting languages and industry-standard verification methodologies, is essential. Exceptional problem-solving, leadership, and communication skills help drive complex projects and collaborate across cross-functional teams. These skills are crucial to ensure optimal chip performance, timely delivery, and successful integration within advanced semiconductor development environments.

What are some typical challenges faced by Principal Physical Design Engineers when managing complex chip development projects?

Principal Physical Design Engineers often navigate challenges such as balancing power, performance, and area (PPA) requirements while meeting tight project deadlines. They must coordinate across multiple teams, including logic design and verification, to resolve integration issues and ensure that design constraints are met. Additionally, they frequently address timing closure and signal integrity concerns, requiring advanced problem-solving and project management skills. The role demands staying current with EDA tools and process technologies to drive innovation and efficiency in chip design workflows.
More about Principal Physical Design Engineer jobs
What job categories do people searching Principal Physical Design Engineer jobs look for? The top searched job categories for Principal Physical Design Engineer jobs are:
Infographic showing various Principal Physical Design Engineer job openings in the United States as of July 2026, with employment types broken down into 89% Full Time, 8% Part Time, and 3% Contract. Highlights an 87% Physical, 3% Hybrid, and 10% Remote job distribution, with an average salary of $147,220 per year, or $70.8 per hour.
Principal Physical Design Engineer

Principal Physical Design Engineer

Microsoft

Redmond, WA • On-site

Full-time

Posted 7 days ago


Microsoft rating

8.5

Company rating: 8.5 out of 10

Based on 131 frontline employees who took The Breakroom Quiz

68th of 209 rated software companies


Job description

Overview
Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft's expanding Cloud Infrastructure and responsible for powering Microsoft's "Intelligent Cloud" mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission.
As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the AISiE team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.
We are looking for a Principal Physical Design Engineer to join the team.
#SCHIE
Responsibilities
We are looking to expand our Physical Design Engineer team in US with immediate hiring of a few senior and principal level Physical Design engineers to work on Microsoft Next-Gen AI SOC chip. If hired, you will be responsible for delivering TFM (tool, flow and methodology) of Physical Design tasks at block, sub-chip, and/or full-chip level. The roles include one or more of the following tasks - Place and Route (PnR), Static Timing Analysis (STA) and timing ECOs, Physical Verification (PV), Formal Equivalency Verification (FEV), Functional ECO, Global Clocking Construction, IR-Drop/EM (EMIR) and PD Infrastructure and IPs collaterals handling with details below:
• Lead the PnR convergence recipe development for designs at blocks/subsystem and subchip level
• Develop and implement methodologies and strategies to improve physical design efficiency and performance
• Develop and implement methodologies and strategies to sign off blocks, subsystem/Subchip in the areas of static timing analysis, physical verification, functional logics equivalence, low power verification and electromigration and IR drop
• Implementation of functional and timing ECO with least physical design impact
• Design and implement the global clocking scheme at SOC and sub chip levels
• Stay current with industry trends and emerging technologies to continuously improve physical design processes and methodologies
• Installation and quality check of internal and external IP collaterals for use by Physical Design execution team
• Conduct physical design reviews, identify and resolve design issues, and provide guidance to junior engineers.
Qualifications
Required Qualifications:
Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.
Other:
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Preferred Qualifications:
  • Bachelor's or Master's in Electrical or Computer Engineering or related field with 10+ years of experience
  • Experience in tapeouts of complex ASICs in leading edge technology
  • 10+ years of experience in blocks level place and route and
  • Expertise in one or more of physical design EDA tools such as Synopsys Fusion Compiler, PrimeClosure, Primetime, Formality, VCLP, Star-RC, Redhawk SC, and Cadence Innovus; Siemens Calibre.
  • Strong understanding of semiconductor design principles, methodologies, and tools.
  • Proven track record of successfully leading physical design projects and delivering high-quality semiconductor products
  • Adequate scripting skillsets in TCL and Python
  • Good understanding of foundry tech files and rule decks

Silicon Engineering IC5 - The typical base pay range for this role across the U.S. is USD $142,800 - $274,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.

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About Microsoft

Sourced by ZipRecruiter

Our infrastructure is comprised of a large global portfolio of more than 100 datacenters and 1 million servers. Our foundation is built upon and managed by a team of subject matter experts working to support services for more than 1 billion customers and 20 million businesses in over 90 countries worldwide. With environmental sustainability and optimization at the forefront of our datacenter design and operations, we continue to grow and evolve as we meet the ever-changing business demands that hold Microsoft as a world-class cloud provider.

Industry

Computer and computer peripheral equipment and software wholesalers

Company size

10,000+ Employees

Headquarters location

Redmond, WA, US

Year founded

1975

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