We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description In this role, you will be working on stress and deformation simulation of IC packages ...
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description In this role, you will be working on stress and deformation simulation of IC packages ...
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description • In this role, you will be working on stress and deformation simulation of IC ...
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description • In this role, you will be working on stress and deformation simulation of IC ...
Packaging Assembly Engineer
Austin, TX · On-site
We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip ...
Packaging Assembly Engineer
Austin, TX · On-site
We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip ...
Senior IC Package Design Engineer Location: Santa Clara, CA (Onsite) Duration: 6 Months (Ongoing ... Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules
Quick apply
Senior IC Package Design Engineer Location: Santa Clara, CA (Onsite) Duration: 6 Months (Ongoing ... Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules
Photonic Packaging Engineer, Principal
San Jose, CA · On-site
$205K - $255K/yr
Collaborate with IC packaging, optical connector, and silicon photonics teams to achieve co-design optimization * Build and mentor a high-performing team of packaging engineers and scientists.
Photonic Packaging Engineer, Principal
San Jose, CA · On-site
$205K - $255K/yr
Collaborate with IC packaging, optical connector, and silicon photonics teams to achieve co-design optimization * Build and mentor a high-performing team of packaging engineers and scientists.
IC Package Engineer
$2.0K/mo
Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...
IC Package Engineer
$2.0K/mo
Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...
IC Package Engineer
Cupertino, CA · On-site
$2.0K/mo
Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...
IC Package Engineer
Cupertino, CA · On-site
$2.0K/mo
Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...
IC Package Engineer
Cupertino, CA · On-site
$2.0K/mo
Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...
IC Package Engineer
Cupertino, CA · On-site
$2.0K/mo
Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...
Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization.
Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization.
Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization.
Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization.
Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization.
Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization.
Senior IC Packaging Designer
Atlanta, GA · On-site
$98K - $104K/yr
The position requires close collaboration with RFIC designers, layout engineers, testing teams, and ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:
Senior IC Packaging Designer
Atlanta, GA · On-site
$98K - $104K/yr
The position requires close collaboration with RFIC designers, layout engineers, testing teams, and ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:
Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization.
Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization.
IC Packaging Simulation Engineer
$126K - $220K/yr
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description • In this role, you will be working on stress and deformation simulation of IC ...
IC Packaging Simulation Engineer
$126K - $220K/yr
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description • In this role, you will be working on stress and deformation simulation of IC ...
Senior IC Packaging Designer
$98K - $104K/yr
The position requires close collaboration with RFIC designers, layout engineers, testing teams, and ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:
Senior IC Packaging Designer
$98K - $104K/yr
The position requires close collaboration with RFIC designers, layout engineers, testing teams, and ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:
IC Packaging Simulation Engineer
$181K - $318K/yr
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description In this role, you will be working on stress and deformation simulation of IC packages ...
IC Packaging Simulation Engineer
$181K - $318K/yr
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description In this role, you will be working on stress and deformation simulation of IC packages ...
IC Packaging Simulation Engineer
$181K - $318K/yr
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description In this role, you will be working on stress and deformation simulation of IC packages ...
IC Packaging Simulation Engineer
$181K - $318K/yr
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description In this role, you will be working on stress and deformation simulation of IC packages ...
Senior IC Packaging Designer
Atlanta, GA · On-site
$98K - $104K/yr
The position requires close collaboration with RFIC designers, layout engineers, testing teams, and ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:
Quick apply
Senior IC Packaging Designer
Atlanta, GA · On-site
$98K - $104K/yr
The position requires close collaboration with RFIC designers, layout engineers, testing teams, and ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:
IC Packaging Simulation Engineer
$126K - $220K/yr
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description • In this role, you will be working on stress and deformation simulation of IC ...
IC Packaging Simulation Engineer
$126K - $220K/yr
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description • In this role, you will be working on stress and deformation simulation of IC ...
What you'll do The Packaging Engineer position requires handling all aspects of packaging ... The products range from IC's, System In Packages, sub-assemblies, and modules. The packaging ...
What you'll do The Packaging Engineer position requires handling all aspects of packaging ... The products range from IC's, System In Packages, sub-assemblies, and modules. The packaging ...
IC Packaging Engineer information
See salary details
$19.71 - $24.02
2% of jobs
$24.02 - $28.32
6% of jobs
$32.42 is the 25th percentile. Wages below this are outliers.
$28.32 - $32.63
17% of jobs
$32.63 - $36.93
16% of jobs
The median wage is $39.08 / hr.
$36.93 - $41.24
16% of jobs
$41.24 - $45.54
12% of jobs
$47.59 is the 75th percentile. Wages above this are outliers.
$45.54 - $49.85
11% of jobs
$49.85 - $54.15
6% of jobs
$54.15 - $58.46
5% of jobs
$58.46 - $62.76
4% of jobs
$62.76 - $67.07
3% of jobs
$19
$42
$67
How much do ic packaging engineer jobs pay per hour?
What is an IC Packaging Engineer job?
An IC Packaging Engineer is responsible for designing and developing semiconductor packaging solutions to ensure the performance, reliability, and manufacturability of integrated circuits (ICs). They work closely with design, manufacturing, and testing teams to create packaging that meets thermal, electrical, and mechanical requirements. Their role includes material selection, process optimization, and collaboration with suppliers to enhance packaging efficiency and cost-effectiveness.
What are the key skills and qualifications needed to thrive in the Ic Packaging Engineer position, and why are they important?
To thrive as an IC Packaging Engineer, you need a robust background in materials science, semiconductor device physics, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Proficiency in design and simulation tools like Cadence, ANSYS, and industry standards such as JEDEC, along with knowledge of thermal, electrical, and reliability testing methods, is essential. Effective communication, cross-functional teamwork, and strong problem-solving skills help you excel in project-based environments. These qualifications are critical for delivering reliable, high-performance integrated circuit packages essential to the semiconductor industry's success.
What are the typical daily responsibilities of an IC Packaging Engineer?
IC Packaging Engineers typically focus on designing, developing, and testing packaging solutions for integrated circuits, working closely with cross-functional teams including design, process, and reliability engineers. Day-to-day tasks may include creating layout drawings, performing simulations, evaluating material choices, resolving technical challenges during assembly, and interacting with manufacturing partners. They are responsible for ensuring the package design meets performance, cost, and reliability requirements set by customers or the market. This role often involves regular collaboration and problem-solving to meet tight development timelines and maintain product quality.
Apple rating
8.1
Based on 666 frontline employees who took The Breakroom Quiz
5th of 30 rated technology retailers
Job description
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM simulation with multi-year FEM software ANSYS or ABAQUS.
This position requires someone familiar with development process of simulation and characterization projects, that thrives in a multifaceted collaborative organization.
Description
In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. You will also be working on scripting CAD/FEM software, and Generative-AI/Machine Learning/numerical tools to set up automated model-generation user interfaces.
Minimum Qualifications
BS and a minimum of 10 years relevant industry experience or equivalent
Preferred Qualifications
Proven capability in mechanics and mathematics.
Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.).
Proficiency with numerical simulation software tools and expert in MATLAB and/or Scientific Python.
Hands-on experience of Gen-AI and Machine Learning.
Deep understanding of packaging materials and their mechanical behaviors.
Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.
Able to perform independent research and development work.
Excellent written and verbal communication skills with ability to present ideas, design concepts, data, and plan with high confidence at team meetings.
About Apple
Sourced by ZipRecruiter
Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.
Industry
Computer and electronic product manufacturing
Company size
10,000+ Employees
Headquarters location
Cupertino, CA, US
Year founded
1976