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Freelance Finite Element Analysis Fea Engineer Jobs

Cspeed

FEA Packaging Engineer

Palo Alto, CA · On-site

The Role This position performs finite element analysis for CspeedIO optical engine packages across both thermal and structural domains. It is scoped for a strong FEA engineer: demonstrated depth in ...

Brunswick

Engineering Manager - FEA Lead

Fond Du Lac, WI · On-site

$103K - $164K/yr

As an Engineering Manager - Finite Element Analysis (FEA Lead) you will lead a high-performing team of analysis engineers supporting the design and development of conventional marine internal ...

Pacific Fusion

Senior Structures Engineer

San Leandro, CA · On-site

$113K - $154K/yr

Provide miscellaneous structural engineering support and detailed mechanical analysis, including Finite Element Analysis (FEA), for various mechanical design scopes and high-load systems. * Design ...

Apple

FEA/AI Methods Engineer

San Francisco, CA · On-site

Experience in implicit and explicit finite element analysis (FEA). Attention to detail and ... S. in Mechanical Engineering, Applied Mechanics, Structural Engineering, or a similar discipline ...

Lund Boats

Engineering Manager - FEA Lead

Fond Du Lac, WI · On-site

$103K - $164K/yr

As an Engineering Manager - Finite Element Analysis (FEA Lead) you will lead a high-performing team of analysis engineers supporting the design and development of conventional marine internal ...

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How much do freelance finite element analysis fea engineer jobs pay per hour?

As of Aug 11, 2026, the average hourly pay for freelance finite element analysis fea engineer in the United States is $33.20, according to ZipRecruiter salary data. Most workers in this role earn between $26.92 and $37.50 per hour, depending on experience, location, and employer.

What does a freelance finite element analysis (FEA) engineer do?

A Freelance Finite Element Analysis (FEA) Engineer specializes in using FEA software to simulate and analyze the physical behavior of structures and components under various conditions. Their work involves creating detailed models, applying loads and boundary conditions, and interpreting results to ensure safety, efficiency, and compliance with engineering standards. Freelance FEA Engineers often assist clients across industries such as automotive, aerospace, civil engineering, and manufacturing, offering flexible project-based solutions. They are skilled in software like ANSYS, Abaqus, and SolidWorks Simulation, providing valuable insights that help optimize designs and reduce development costs.

What are the key skills and qualifications needed to thrive as a freelance finite element analysis (FEA) engineer?

To thrive as a Freelance FEA Engineer, you need a solid background in mechanical engineering, advanced knowledge of finite element analysis principles, and often a relevant engineering degree. Proficiency in FEA software such as ANSYS, Abaqus, or SolidWorks Simulation, along with familiarity with CAD tools and possibly certifications like Professional Engineer (PE), is typically expected. Excellent problem-solving, communication, and project management skills help you deliver clear results to clients and manage multiple projects independently. These skills ensure accurate analyses, effective client interactions, and the successful completion of complex engineering projects.

What are some common challenges freelance FEA engineers face when collaborating remotely with clients and teams?

Freelance FEA engineers often work with clients and project teams who may be located in different regions or time zones, which can make communication and alignment challenging. Clearly defining project requirements, milestones, and feedback loops is essential to ensure expectations are met and revisions are minimized. Additionally, freelancers must be proactive in managing data security, sharing large simulation files, and keeping their software and skills up to date to remain competitive. Building strong relationships and maintaining professionalism in all communications can help overcome these challenges and lead to successful long-term collaborations.
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Freelance Finite Element Analysis Fea Engineer jobs near you
Infographic showing various Freelance Finite Element Analysis Fea Engineer job openings in the United States as of August 2026, with employment types broken down into 1% Internship, 83% Full Time, 12% Part Time, and 4% Contract. Highlights an 82% Physical, 5% Hybrid, and 13% Remote job distribution, with an average salary of $69,055 per year, or $33.2 per hour.

FEA Packaging Engineer

Cspeed

Palo Alto, CA • On-site

Full-time

Posted 6 days ago

Job description

The Role

This position performs finite element analysis for CspeedIO optical engine packages across both thermal and structural domains. It is scoped for a strong FEA engineer: demonstrated depth in either thermal or mechanical analysis is expected, and the ability to work competently in the other is required.

The analysis supports package architecture decisions and qualification. Temperature governs optical wavelength and channel uniformity. Deformation and interconnect stress govern assembly yield, reliability, and optical coupling, since warpage displaces optical facets. Both sets of results terminate in the same design decisions, which is why the scope is held in one role.

Correlation against measured hardware is a standing expectation. Results are used for design sign-off, so assumptions must be documented and defensible.

Responsibilities

Thermal analysis

  • Build and maintain thermal models spanning die, package, interface materials, lid, and cold plate, and establish cooling boundary conditions and their validity limits.
  • Resolve the temperature field across the photonic IC to the resolution photonic design requires, and define the heat extraction path and interface material selection for high-flux die within the assembly.

Structural analysis

  • Predict warpage through the assembly process, and own the flatness, coplanarity, and facet planarity budgets that assembly and optical coupling depend on.
  • Analyze bump and interconnect stress, chip-package interaction, and fatigue life, supporting qualification against JEDEC or equivalent methodology.

Methodology and correlation

  • Define modeling standards and document assumptions such that results are auditable.
  • Lead correlation against measured temperature, warpage, cross-section, and reliability data, and revise methodology accordingly.

Design and supplier support

  • Provide requirements, constraints, and sign-off criteria during architecture definition rather than after design freeze.
  • Engage substrate suppliers, OSATs, and cooling and material vendors on process assumptions and measured data.
Required Qualifications
  • MS or PhD in Mechanical Engineering, Materials Science, Engineering Mechanics, or equivalent practical background.
  • 6+ years of finite element analysis for semiconductor packaging or electronic systems, including one product carried from architecture through hardware correlation.
  • Expert proficiency in one commercial FEA or CFD tool and working proficiency in a second covering the other domain - for example Ansys Mechanical or Abaqus alongside Icepak, Fluent, Flotherm, or Celsius.
  • Sound FEA fundamentals: meshing judgment, boundary condition selection, convergence, and the ability to defend a model rather than only to run one.
  • Demonstrated correlation of simulation against physical measurement, and the judgment to distinguish a modeling error from a process excursion.
  • Experience with advanced packaging construction: flip chip, 2.5D/3D, interposers, and heterogeneous integration.
Preferred Qualifications
  • Depth in nonlinear and time-dependent material behavior: creep, viscoplasticity, viscoelasticity, and fatigue.
  • Silicon photonics or optoelectronic packaging, including thermo-optic sensitivity or warpage as an optical alignment constraint.
  • Coupled thermal-structural workflows, including transfer of a computed temperature field into a structural model.
  • Direct-to-chip liquid cooling, or chip-package interaction and low-k dielectric stress.
  • Scripting for model automation and parametric studies, and design of experiments methodology.
Scope and Impact

This position provides the physics basis for package architecture decisions and qualification.

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