60 Qualcomm Thermal Engineer Jobs Hiring Near You

Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Systems Engineering
General Summary:
Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!
Our Mission
We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you'll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.
Position: Server FEA Engineer
We are seeking a Staff / Senior Staff Server FEA Engineer to serve as a technical authority for structural simulation and system-level modeling of high-performance server platforms. This role owns multi-scale structural physics spanning package, board, server chassis assembly, and full system/rack-level architectures.
As a senior individual contributor, you will lead system-level structural integrity, dynamics, and reliability modeling, ensuring mechanical robustness, manufacturability, and lifecycle reliability of servers from package through in-rack deployment. You will partner closely with packaging, electrical, thermal, mechanical, manufacturing, reliability, systems, and supplier teams to drive simulation-informed platform design.
Key Responsibilities

• Lead multi-scale FEA across package, board, chassis assembly, system, and rack levels
• Own system-level structural simulation, including server chassis assemblies, multi-node integration, and in-rack boundary conditions
• Lead structural dynamics modeling (modal, shock, drop, random vibration, harmonic response, coupled system dynamics)
• Drive platform-level structural architecture through simulation-based decisions
• Correlate analytical models with component-, system-, and rack-level test data
• Define and maintain platform simulation methodologies, modeling standards, and validation frameworks
• Translate simulation into clear design guidance for cross-functional teams
• Present technical analyses to engineering leadership, customers, and suppliers

Qualifications

• Master's degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or related field
• Strong background in structural mechanics, materials science, and structural dynamics
• 6+ years of advanced FEA experience in high-tech hardware platforms spanning microelectronics packaging, BGAs/sockets, board-level systems, server chassis assemblies, and full system-level structures
• Proficiency in ANSYS, ABAQUS, HyperMesh, or equivalent
• Experience correlating system-level FEA with physical testing (modal, shock, vibration, environmental)
• Strong technical documentation and communication skills
• Proven ability to operate independently and lead within cross-functional teams

Preferred Qualifications

• Ph.D. in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or related field
• 10+ years of advanced FEA experience
• Expertise in structural and system-level FEA
• Experience with rack-scale modeling and in-rack boundary condition simulation
• Deep experience in holistic structural analysis spanning die, package, board, chassis, and rack-integrated systems
• Experience with multi-physics coupling (structural-thermal-mechanical)
• Platform-level simulation ownership across multiple server generations
• Understanding of OCP product designs and industry best practice

Minimum Qualifications:
• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.
OR
Master's degree in Engineering, Information Systems, Computer Science, or related field and 5+ years of Systems Engineering or related work experience.
OR
PhD in Engineering, Information Systems, Computer Science, or related field and 4+ years of Systems Engineering or related work experience.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
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Pay range and Other Compensation & Benefits:
$180,500.00 - $270,700.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.